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Ceramic filled resin based 3D printed X-band dual-mode bandpass filter with enhanced thermal handling capability.
- Published in:
- Electronics Letters (Wiley-Blackwell), 2016, v. 52, n. 23, p. 1929, doi. 10.1049/el.2016.2955
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- Publication type:
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Ceramic filled resin based 3D printed X‐band dual‐mode bandpass filter with enhanced thermal handling capability.
- Published in:
- Electronics Letters (Wiley-Blackwell), 2016, v. 52, n. 23, p. 1929, doi. 10.1049/el.2016.2955
- By:
- Publication type:
- Article