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Low Dielectric Polyimide/Fluorinated Ethylene Propylene (PI/FEP) Nanocomposite Film for High‐Frequency Flexible Circuit Board Application.
- Published in:
- Macromolecular Materials & Engineering, 2021, v. 306, n. 7, p. 1, doi. 10.1002/mame.202100086
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- Publication type:
- Article