Ion Bombardment-Induced Stress Mechanism for the Formation of Ag Nanotwinned Films on Si Substrates.
- Published in:
- Journal of Electronic Materials, 2024, v. 53, n. 5, p. 2583, doi. 10.1007/s11664-023-10905-w
- By:
- Publication type:
- Article
Works by Chuang, Tung-Han
Results: 34
1
2
Focused-Ion-Beam-Based Selective Closing and Opening of Anodic Alumina Nanochannels for the Growth of Nanowire Arrays Comprising Multiple Elements.
- Published in:
- Advanced Materials, 2008, v. 20, n. 13, p. 2547, doi. 10.1002/adma.200702604
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- Publication type:
- Article
3
Au-induced improvements in the grain stability and mechanical properties of Ag-based alloy wires under electrical current stressing.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 17, p. 15897, doi. 10.1007/s10854-019-01936-3
- By:
- Publication type:
- Article
4
Effect of alloying Au on the microstructural, mechanical and electrical properties of Ag-based alloy wires.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 10, p. 9396, doi. 10.1007/s10854-019-01270-8
- By:
- Publication type:
- Article
5
Ultrasonic Bonding of Ag Ribbon on Si Wafers With Various Backside Metallization.
- Published in:
- International Journal of Manufacturing, Materials & Mechanical Engineering, 2024, v. 13, n. 1, p. 1, doi. 10.4018/IJMMME.333626
- By:
- Publication type:
- Article
6
Atomic Migration of Cu on the Surface of Si/Ti/Ni/Cu/Ag Thin Films.
- Published in:
- Journal of Electronic Materials, 2022, v. 51, n. 7, p. 3624, doi. 10.1007/s11664-022-09573-z
- By:
- Publication type:
- Article
7
Effects of Grain Size on the Ag Dissolution and Ion Migration of Ag-4Pd Alloy Wires.
- Published in:
- Journal of Electronic Materials, 2021, v. 50, n. 10, p. 5955, doi. 10.1007/s11664-021-09119-9
- By:
- Publication type:
- Article
8
Interfacial Reactions of Ag and Ag-4Pd Stud Bumps with Sn-3Ag-0.5Cu Solder for Flip Chip Packaging.
- Published in:
- Journal of Electronic Materials, 2021, v. 50, n. 1, p. 249, doi. 10.1007/s11664-020-08523-x
- By:
- Publication type:
- Article
9
Improvement of Sn-3Ag-0.5Cu Soldered Joints Between Bi0.5Sb1.5Te3 Thermoelectric Material and a Cu Electrode.
- Published in:
- Journal of Electronic Materials, 2020, v. 49, n. 5, p. 3391, doi. 10.1007/s11664-020-08002-3
- By:
- Publication type:
- Article
10
Electrolytic Migration of Ag-Pd Alloy Wires with Various Pd Contents.
- Published in:
- Journal of Electronic Materials, 2018, v. 47, n. 7, p. 3634, doi. 10.1007/s11664-018-6210-0
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- Publication type:
- Article
11
Mechanism of Electromigration in Ag-Alloy Bonding Wires with Different Pd and Au Content.
- Published in:
- Journal of Electronic Materials, 2015, v. 44, n. 2, p. 623, doi. 10.1007/s11664-014-3558-7
- By:
- Publication type:
- Article
12
Effect of Annealing Twins on Electromigration in Ag-8Au-3Pd Bonding Wires.
- Published in:
- Journal of Electronic Materials, 2013, v. 42, n. 3, p. 545, doi. 10.1007/s11664-012-2381-2
- By:
- Publication type:
- Article
13
Effects of Ce Addition on the Microstructure and Mechanical Properties of Sn-58Bi Solder Joints.
- Published in:
- Journal of Electronic Materials, 2011, v. 40, n. 1, p. 71, doi. 10.1007/s11664-010-1385-z
- By:
- Publication type:
- Article
14
Inhibition of Whisker Growth on the Surface of Sn-3Ag-0.5Cu-0.5Ce Solder Alloyed with Zn.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 3, p. 420, doi. 10.1007/s11664-008-0606-1
- By:
- Publication type:
- Article
15
Enhancement of Ag sintering reactions through high-density (111) orientation Ag nanotwins for the die bonding of SiC chips with DBC alumina substrates.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2025, v. 36, n. 6, p. 1, doi. 10.1007/s10854-025-14451-5
- By:
- Publication type:
- Article
16
Growth of Cu nanotwinned films on surface activated SiC chips.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 23, p. 1, doi. 10.1007/s10854-023-11058-6
- By:
- Publication type:
- Article
17
Enhancing effect of substrate bias on nanotwin formation of sputtered Ag thin films.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 17, p. 21966, doi. 10.1007/s10854-021-06628-5
- By:
- Publication type:
- Article
18
Sputtering of Ag (111) nanotwinned films on Si (100) wafers for backside metallization of power devices.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 6, p. 7319, doi. 10.1007/s10854-021-05442-3
- By:
- Publication type:
- Article
19
Formation of Cu Nanotwins on Silicon Carbide Wafers with Cr Adhesive Layer under Various Substrate Bias.
- Published in:
- Metals (2075-4701), 2023, v. 13, n. 10, p. 1747, doi. 10.3390/met13101747
- By:
- Publication type:
- Article
20
Improvement of the Mechanical Properties of the Diffusion-Bonded 2024 Aluminum Alloy through Post-Weld Heat Treatments.
- Published in:
- Metals (2075-4701), 2022, v. 12, n. 10, p. 1738, doi. 10.3390/met12101738
- By:
- Publication type:
- Article
21
Highly Stable and Enhanced Performance of p–i–n Perovskite Solar Cells via Cuprous Oxide Hole-Transport Layers.
- Published in:
- Nanomaterials (2079-4991), 2023, v. 13, n. 8, p. 1363, doi. 10.3390/nano13081363
- By:
- Publication type:
- Article
22
Intermetallic Growth at the Interfaces Between Zn<sub>4</sub>Sb<sub>3</sub> Thermoelectric Material and Various Metallic Electrodes.
- Published in:
- Metallurgical & Materials Transactions. Part A, 2022, v. 53, n. 1, p. 136, doi. 10.1007/s11661-021-06499-9
- By:
- Publication type:
- Article
23
Mechanism of the Electromigration in Ag-Pd Alloy Bonding Wires.
- Published in:
- Metallurgical & Materials Transactions. Part A, 2018, v. 49, n. 11, p. 5904, doi. 10.1007/s11661-018-4848-0
- By:
- Publication type:
- Article
24
Effect of Au Addition on the Microstructure and Properties of Ag-4Pd Bonding Wires.
- Published in:
- Metallurgical & Materials Transactions. Part A, 2018, v. 49, n. 11, p. 5411, doi. 10.1007/s11661-018-4841-7
- By:
- Publication type:
- Article
25
The Influence of Oxygen Flow Ratio on the Optoelectronic Properties of p-Type Ni1−xO Films Deposited by Ion Beam Assisted Sputtering.
- Published in:
- Coatings (2079-6412), 2018, v. 8, n. 5, p. 168, doi. 10.3390/coatings8050168
- By:
- Publication type:
- Article
26
Low-Temperature Bonding of BiSbTe Thermoelectric Material with Cu Electrodes Using a Thin-Film In Interlayer.
- Published in:
- Metallurgical & Materials Transactions. Part A, 2016, v. 47, n. 9, p. 4767, doi. 10.1007/s11661-016-3641-1
- By:
- Publication type:
- Article
27
Durability to Electromigration of an Annealing-Twinned Ag-4Pd Alloy Wire Under Current Stressing.
- Published in:
- Metallurgical & Materials Transactions. Part A, 2014, v. 45, n. 12, p. 5574, doi. 10.1007/s11661-014-2538-0
- By:
- Publication type:
- Article
28
Surface Reconstruction of an Annealing Twinned Ag-8Au-3Pd Alloy Wire Under Current Stressing.
- Published in:
- Metallurgical & Materials Transactions. Part A, 2013, v. 44, n. 11, p. 5106, doi. 10.1007/s11661-013-1879-4
- By:
- Publication type:
- Article
29
Morphology of the Tin Whiskers on the Surface of a Sn-3Ag-0.5Cu-0.5Nd Alloy.
- Published in:
- Metallurgical & Materials Transactions. Part A, 2011, v. 42, n. 3, p. 684, doi. 10.1007/s11661-010-0454-5
- By:
- Publication type:
- Article
30
Formation of Ag Dendrites During the Electrolytic Migration Between Ag-4Pd Wire Couple in Water Under Bias.
- Published in:
- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2023, v. 75, n. 6, p. 1880, doi. 10.1007/s11837-023-05700-1
- By:
- Publication type:
- Article
31
Effects of substrate bias on the sputtering of high density (111)-nanotwinned Cu films on SiC chips.
- Published in:
- Scientific Reports, 2022, v. 12, n. 1, p. 1, doi. 10.1038/s41598-022-19825-x
- By:
- Publication type:
- Article
32
Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper.
- Published in:
- Advances in Materials Science & Engineering, 2021, p. 1, doi. 10.1155/2021/8069719
- By:
- Publication type:
- Article
33
Effects of Adding Active Elements to Aluminum-Based Filler Alloys on the Bonding of 6061 Aluminum Alloy and Alumina.
- Published in:
- Applied Sciences (2076-3417), 2021, v. 11, n. 21, p. 10440, doi. 10.3390/app112110440
- By:
- Publication type:
- Article
34
Effect of Post-Weld Heat Treatment on the Solid-State Diffusion Bonding of 6061 Aluminum Alloy.
- Published in:
- Applied Sciences (2076-3417), 2021, v. 11, n. 20, p. 9660, doi. 10.3390/app11209660
- By:
- Publication type:
- Article