Works by Cheung, Yiu Ming


Results: 27
    1

    Effects of bonding frequency on Au wedge wire bondability.

    Published in:
    Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 3, p. 281, doi. 10.1007/s10854-007-9312-7
    By:
    • Yu Hin Chan;
    • Jang-Kyo Kim;
    • Deming Liu;
    • Liu, Peter C. K.;
    • Yiu Ming Cheung;
    • Ming Wai Ng
    Publication type:
    Article
    2
    3

    Fabrication of 0.9PMN-0.1PT multilayer actuator.

    Published in:
    Ferroelectrics, 2001, v. 263, n. 1, p. 223, doi. 10.1080/00150190108225203
    By:
    • Tang, Kwan-Wai;
    • Chan, Helen Lai-Wa;
    • Choy, Chung-Loong;
    • Cheung, Yiu-Ming;
    • Liu, Peter Chou-Kee
    Publication type:
    Article
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    Process Windows for Low-Temperature Au Wire Bonding.

    Published in:
    Journal of Electronic Materials, 2004, v. 33, n. 2, p. 146, doi. 10.1007/s11664-004-0285-5
    By:
    • Yu Hin Chan, L.;
    • Jang-Kyo Kim;
    • Deming Liu;
    • Liu, Peter C. K.;
    • Yiu Ming Cheung, Peter C. K.;
    • Ming Wai Ng, Peter C. K.
    Publication type:
    Article
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    Reliability of Fan-Out Wafer-Level Heterogeneous Integration.

    Published in:
    Journal of Microelectronic & Electronic Packaging, 2018, v. 15, n. 4, p. 148, doi. 10.4071/imaps.728940
    By:
    • Lau, John;
    • Ming Li;
    • Yang Lei;
    • Margie Li;
    • Iris Xu;
    • Chen, Tony;
    • Yong, Qing X.;
    • Cheng, Zhong;
    • Wu Kai;
    • Lo, Penny;
    • Zhang Li;
    • Tan, Kim H.;
    • Yiu Ming Cheung;
    • Fan, Nelson;
    • Kuah, Eric;
    • Cao Xi;
    • Jiang Ran;
    • Beica, Rozalia;
    • Lim, Sze P.;
    • Ning Cheng Lee
    Publication type:
    Article
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