Heat Dissipation Capability of Stagger-Stacked Double Data Rate Module.
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- Electronics (2079-9292), 2024, v. 13, n. 9, p. 1775, doi. 10.3390/electronics13091775
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Works matching AU Cang, Dongqing
Results: 3
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Chiplet Multi-Objective Optimization Algorithm Based on Communication Consumption and Temperature.
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- Electronics (2079-9292), 2023, v. 12, n. 7, p. 1604, doi. 10.3390/electronics12071604
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- Article
3
New Heuristic Algorithm for Low Energy Mapping for 2.5-D Integration.
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- Electronics (2079-9292), 2022, v. 11, n. 12, p. 1817, doi. 10.3390/electronics11121817
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- Article