Works by Byung-Seung Yim

Results: 18

Mechanisms for the formation of conduction paths in a solderable epoxy composite with a mixed low- and high-melting-point solder filler.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 10, p. 1, doi. 10.1007/s10854-023-10324-x

By:

Ha, Min Jeong;
Lee, Jeong Il;
Kim, Jong-Min;
Yim, Byung-Seung

Publication type:

Article

An investigation of the bonding properties of Cu particle-filled solderable isotropic polymer composites (Cu-SIPCs)

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 10, p. 1, doi. 10.1007/s10854-023-10276-2

By:

Youn, Hee Jun;
Lee, Jeong Il;
Ha, Min Jeong;
Kim, Jong-Min;
Yim, Byung-Seung

Publication type:

Article

Influence of Cu powders on the wettability and mechanical properties of solderable epoxy composites.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 13, p. 10030, doi. 10.1007/s10854-022-07994-4

By:

Youn, Hee Jun;
Lee, Jeong Il;
Kim, Jong-Min;
Yim, Byung-Seung

Publication type:

Article

Effect of multi-walled carbon nanotube (MWCNT) concentration on thermomechanical reliability of MWCNT-reinforced solderable isotropic polymer nanocomposites.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 9, p. 9159, doi. 10.1007/s10854-016-4952-0

By:

Yim, Byung-Seung;
Kim, Jong-Min

Publication type:

Article

Three-dimensional multi-layer through-hole filling properties of solderable polymer composites with low-melting-point alloy fillers.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 6, p. 6223, doi. 10.1007/s10854-016-4553-y

By:

Lee, Jeong;
Yim, Byung-Seung;
Shin, Dongjun;
Kim, Jong-Min

Publication type:

Article

Influence of functionalized graphene on the electrical, mechanical, and thermal properties of solderable isotropic conductive adhesives.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 5, p. 4516, doi. 10.1007/s10854-016-4326-7

By:

Yim, Byung-Seung;
Kim, Kiho;
Kim, Jooheon;
Kim, Jong-Min

Publication type:

Article

Through-hole filling characteristics of solderable polymer composites with low melting point alloy fillers.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 1, p. 982, doi. 10.1007/s10854-015-3842-1

By:

Lee, Jeong;
Yim, Byung-Seung;
Yun, Mu;
Kim, Jong-Min

Publication type:

Article

Influence of multi-walled carbon nanotube (MWNT) concentration on the interconnection properties of solderable anisotropic conductive adhesives (SACAs).

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 7, p. 4969, doi. 10.1007/s10854-015-3009-0

By:

Yim, Byung-Seung;
Kim, Jong-Min

Publication type:

Article

Electrical and mechanical properties of multiwalled carbon nanotubes-reinforced solderable polymer nanocomposites.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 3, p. 1678, doi. 10.1007/s10854-014-2592-9

By:

Yim, Byung-Seung;
Kim, Jong-Min

Publication type:

Article

Effect of dispersion condition of multi-walled carbon nanotube (MWNT) on bonding properties of solderable isotropic conductive adhesives (ICAs).

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 12, p. 5208, doi. 10.1007/s10854-014-2290-7

By:

Yim, Byung-Seung;
Lee, Byung;
Kim, Jooheon;
Kim, Jong-Min

Publication type:

Article

Effect of dissolved-gas concentration on bulk nanobubbles generation using ultrasonication.

Published in:

Scientific Reports, 2020, v. 10, n. 1, p. N.PAG, doi. 10.1038/s41598-020-75818-8

By:

Lee, Jeong Il;
Yim, Byung-Seung;
Kim, Jong-Min

Publication type:

Article

Mechanical Properties of Sn58Bi--Cu Composite Solder Filled with Copper Particles.

Published in:

Materials Transactions, 2024, v. 65, n. 12, p. 1616, doi. 10.2320/matertrans.MT-M2024122

By:

Myeong Jin Jung;
Jeong Il Lee;
Jong-Min Kim;
Byung-Seung Yim

Publication type:

Article

Mechanical Properties of Solderable Polymer Composites with Low- and High-Melting-Point Solder Mixed Filler.

Published in:

Materials Transactions, 2023, v. 64, n. 4, p. 939, doi. 10.2320/matertrans.MT-M2022200

By:

Min Jeong Ha;
Sangil Kim;
Won Chul Cho;
Jong-Min Kim;
Byung-Seung Yim

Publication type:

Article

Investigation of Bonding Mechanism for Cu-Powder Contained Solderable Epoxy-Solder Composites.

Published in:

Materials Transactions, 2021, v. 62, n. 12, p. 1802, doi. 10.2320/matertrans.MT-M2021144

By:

Hee Jun Youn;
Sangil Kim;
Jong-Min Kim;
Byung-Seung Yim

Publication type:

Article

Interconnection Mechanism of Ni-Reinforcement Particle Filled Solderable Polymer Composites with Low-Melting-Point Alloy Filler.

Published in:

Materials Transactions, 2020, n. 12, p. 2442, doi. 10.2320/matertrans.MT-M2020265

By:

Hee Jun Youn;
Jeong Il Lee;
Jong-Min Kim;
Byung-Seung Yim

Publication type:

Article

Investigation of bonding properties of solderable anisotropic polymer composite filled with low- and high-melting-point alloy fillers.

Published in:

Journal of Materials Science: Materials in Electronics, 2024, v. 35, n. 32, p. 1, doi. 10.1007/s10854-024-13797-6

By:

Ha, Yi Hyeon;
Lee, Jeong Il;
Kim, Jong-Min;
Yim, Byung-Seung

Publication type:

Article

Investigation of interconnection properties of solderable isotropic polymer composite filled with low- and high-melting-point solder mixed fillers.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 27, p. 1, doi. 10.1007/s10854-023-11325-6

By:

Ha, Min Jeong;
Lee, Jeong Il;
Kim, Jong-Min;
Yim, Byung-Seung

Publication type:

Article

Suppression characteristics of flow-induced vibration in a test cylinder with varying locations of a control cylinder.

Published in:

Journal of Mechanical Science & Technology, 2018, v. 32, n. 12, p. 5685, doi. 10.1007/s12206-018-1115-7

By:

Kim, Sangil;
Yoon, Jong-Chul;
Yim, Byung-Seung

Publication type:

Article