Effects of reflow atmosphere and flux on Sn whisker growth of Sn-Ag-Cu solders.
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- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 10, p. 1066, doi. 10.1007/s10854-010-0099-6
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- Article
Works matching AU Baated, Alongheng
Results: 5
1
2
A Method for Copper Direct Bonding Reduced by Ethylene Glycol.
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- Journal of Electronic Materials, 2020, v. 49, n. 3, p. 2095, doi. 10.1007/s11664-019-07788-1
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- Article
3
Whisker Growth Behavior of Sn and Sn Alloy Lead-Free Finishes.
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- Journal of Electronic Materials, 2011, v. 40, n. 11, p. 2278, doi. 10.1007/s11664-011-1712-z
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4
Effects of Zn-Containing Flux on Sn-3.5Ag Soldering with an Electroless Ni-P/Au Surface Finish: Microstructure and Wettability.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2598, doi. 10.1007/s11664-010-1344-8
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- Article
5
Effect of intermetallic growth rate on spontaneous whisker growth from a tin coating on copper.
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- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 11, p. 1685, doi. 10.1007/s10854-011-0346-5
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- Article