Found: 11
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Wandering spleen: a unique cause of acute abdomen.
- Published in:
- 2018
- By:
- Publication type:
- journal article
Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure Interaction.
- Published in:
- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1201, doi. 10.1007/s11664-023-10855-3
- By:
- Publication type:
- Article
Numerical Analysis of the Thermal and Mechanical Performance of Cu Pillar Bumps During Reflow: Effects of Height and Solder Material.
- Published in:
- Journal of Electronic Materials, 2024, v. 53, n. 3, p. 1169, doi. 10.1007/s11664-023-10782-3
- By:
- Publication type:
- Article
Effects of Temperature on the Wave Soldering of Printed Circuit Boards: CFD Modeling Approach.
- Published in:
- Journal of Applied Fluid Mechanics, 2016, v. 9, n. 4, p. 2053
- By:
- Publication type:
- Article
Effects of PCB thickness on adjustable fountain wave soldering.
- Published in:
- Sādhanā: Academy Proceedings in Engineering Sciences, 2015, v. 40, n. 7, p. 2197, doi. 10.1007/s12046-015-0409-z
- By:
- Publication type:
- Article
The influence of Fe<sub>2</sub>O<sub>3</sub> nano-reinforced SAC lead-free solder in the ultra-fine electronics assembly.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2018, v. 96, n. 1-4, p. 717, doi. 10.1007/s00170-018-1583-z
- By:
- Publication type:
- Article
Diagnosis Of Foreign Body (FB) Aspiration Following Road Traffic Accident - An Accidental Event Or Incidental Finding?
- Published in:
- Surgical Chronicles, 2019, v. 24, n. 2, p. 85
- By:
- Publication type:
- Article
Thermo-Mechanical and Adhesion Performance of Silver-Filled Conductive Polymer Composite (SFCP) Using Thermoplastic Polyurethane (TPU) Substrate.
- Published in:
- International Journal of Nanoelectronics & Materials, 2020, v. 13, p. 419
- By:
- Publication type:
- Article
Response to: Limberg Flap Reconstruction in Treating Sacrococcygeal Pilonidal Sinus.
- Published in:
- Bangladesh Journal of Medical Science, 2020, v. 19, n. 2, p. 343, doi. 10.3329/bjms.v19i2.45021
- By:
- Publication type:
- Article
Backward Compatibility Solder Joint Formation at High Peak Reflow Temperature for Aerospace Applications.
- Published in:
- Arabian Journal for Science & Engineering (Springer Science & Business Media B.V. ), 2016, v. 41, n. 5, p. 1813, doi. 10.1007/s13369-015-1986-1
- By:
- Publication type:
- Article
Implications of Adjustable Fountain Wave in Pin Through Hole Soldering Process.
- Published in:
- Arabian Journal for Science & Engineering (Springer Science & Business Media B.V. ), 2014, v. 39, n. 12, p. 9101, doi. 10.1007/s13369-014-1457-0
- By:
- Publication type:
- Article