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Editorial.
- Published in:
- Journal of Electronic Testing, 2024, v. 40, n. 2, p. 137, doi. 10.1007/s10836-024-06120-y
- By:
- Publication type:
- Article
A Survey and Recent Advances: Machine Intelligence in Electronic Testing.
- Published in:
- Journal of Electronic Testing, 2024, v. 40, n. 2, p. 139, doi. 10.1007/s10836-024-06117-7
- By:
- Publication type:
- Article
Editorial.
- Published in:
- 2024
- By:
- Publication type:
- Editorial
Editorial.
- Published in:
- 2023
- By:
- Publication type:
- Editorial
Editorial.
- Published in:
- 2023
- By:
- Publication type:
- Editorial
Editorial.
- Published in:
- 2023
- By:
- Publication type:
- Correction Notice
Editorial.
- Published in:
- 2023
- By:
- Publication type:
- Editorial
Editorial.
- Published in:
- 2023
- By:
- Publication type:
- Editorial
Editorial.
- Published in:
- 2022
- By:
- Publication type:
- Editorial
Editorial: JETTA Volume 38, Number 5, October 2022.
- Published in:
- 2022
- By:
- Publication type:
- Editorial
Editorial.
- Published in:
- Journal of Electronic Testing, 2022, v. 38, n. 4, p. 335, doi. 10.1007/s10836-022-06023-w
- By:
- Publication type:
- Article
Editorial.
- Published in:
- 2022
- By:
- Publication type:
- Editorial
Editorial.
- Published in:
- Journal of Electronic Testing, 2022, v. 38, n. 2, p. 125, doi. 10.1007/s10836-022-06003-0
- By:
- Publication type:
- Article
Editorial.
- Published in:
- 2022
- By:
- Publication type:
- Editorial
Editorial.
- Published in:
- 2021
- By:
- Publication type:
- Editorial
Editorial.
- Published in:
- Journal of Electronic Testing, 2021, v. 37, n. 4, p. 423, doi. 10.1007/s10836-021-05970-0
- By:
- Publication type:
- Article
Editorial.
- Published in:
- 2021
- By:
- Publication type:
- Editorial
Editorial.
- Published in:
- 2021
- By:
- Publication type:
- Editorial
Editorial.
- Published in:
- 2021
- By:
- Publication type:
- Editorial
Estimating Operational Age of an Integrated Circuit.
- Published in:
- Journal of Electronic Testing, 2021, v. 37, n. 1, p. 25, doi. 10.1007/s10836-021-05927-3
- By:
- Publication type:
- Article
Editorial.
- Published in:
- 2020
- By:
- Publication type:
- Editorial
Editorial.
- Published in:
- 2020
- By:
- Publication type:
- Editorial
Editorial.
- Published in:
- 2020
- By:
- Publication type:
- Editorial
Editorial.
- Published in:
- 2020
- By:
- Publication type:
- Editorial
Editorial.
- Published in:
- 2020
- By:
- Publication type:
- Editorial
Editorial.
- Published in:
- 2020
- By:
- Publication type:
- Editorial
Improved Pseudo-Random Fault Coverage Through Inversions: a Study on Test Point Architectures.
- Published in:
- Journal of Electronic Testing, 2020, v. 36, n. 1, p. 123, doi. 10.1007/s10836-020-05859-4
- By:
- Publication type:
- Article
Editorial.
- Published in:
- 2019
- By:
- Publication type:
- Editorial
Editorial.
- Published in:
- 2019
- By:
- Publication type:
- Editorial
Editorial.
- Published in:
- 2019
- By:
- Publication type:
- Editorial
Editorial.
- Published in:
- 2019
- By:
- Publication type:
- Editorial
Editorial.
- Published in:
- 2019
- By:
- Publication type:
- Editorial
Editorial.
- Published in:
- Journal of Electronic Testing, 2019, v. 35, n. 1, p. 1, doi. 10.1007/s10836-019-05781-4
- By:
- Publication type:
- Article
Editorial.
- Published in:
- Journal of Electronic Testing, 2018, v. 34, n. 6, p. 615, doi. 10.1007/s10836-018-5768-z
- By:
- Publication type:
- Article
Editorial.
- Published in:
- 2018
- By:
- Publication type:
- Editorial
Editorial.
- Published in:
- Journal of Electronic Testing, 2018, v. 34, n. 4, p. 371, doi. 10.1007/s10836-018-5743-8
- By:
- Publication type:
- Article
Editorial.
- Published in:
- 2018
- By:
- Publication type:
- Proceeding
Editorial.
- Published in:
- Journal of Electronic Testing, 2018, v. 34, n. 2, p. 105, doi. 10.1007/s10836-018-5728-7
- By:
- Publication type:
- Article
Editorial.
- Published in:
- 2018
- By:
- Publication type:
- Editorial
Editorial.
- Published in:
- 2017
- By:
- Publication type:
- Editorial
Editorial.
- Published in:
- 2017
- By:
- Publication type:
- Editorial
Three-Stage Optimization of Pre-Bond Diagnosis of TSV Defects.
- Published in:
- Journal of Electronic Testing, 2017, v. 33, n. 5, p. 573, doi. 10.1007/s10836-017-5681-x
- By:
- Publication type:
- Article
Editorial.
- Published in:
- 2017
- By:
- Publication type:
- Editorial
Editorial.
- Published in:
- 2017
- By:
- Publication type:
- Editorial
Editorial.
- Published in:
- 2017
- By:
- Publication type:
- Editorial
Power-Aware Optimization of SoC Test Schedules Using Voltage and Frequency Scaling.
- Published in:
- Journal of Electronic Testing, 2017, v. 33, n. 2, p. 171, doi. 10.1007/s10836-017-5652-2
- By:
- Publication type:
- Article
Editorial.
- Published in:
- 2017
- By:
- Publication type:
- Editorial
Editorial.
- Published in:
- 2016
- By:
- Publication type:
- Editorial
Editorial.
- Published in:
- 2016
- By:
- Publication type:
- Editorial
Editorial.
- Published in:
- 2016
- By:
- Publication type:
- Editorial