Found: 13
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Effects of solder temperature on pin through-hole during wave soldering: thermal-fluid structure interaction analysis.
- Published in:
- 2014
- By:
- Publication type:
- journal article
Effects of Aspect Ratio in Moulded Packaging Considering Fluid/Structure Interaction: A CFD Modelling Approach.
- Published in:
- Journal of Applied Fluid Mechanics, 2017, v. 10, n. 6, p. 1799, doi. 10.29252/jafm.73.245.27083
- By:
- Publication type:
- Article
Effects of Temperature on the Wave Soldering of Printed Circuit Boards: CFD Modeling Approach.
- Published in:
- Journal of Applied Fluid Mechanics, 2016, v. 9, n. 4, p. 2053
- By:
- Publication type:
- Article
Effects of PCB thickness on adjustable fountain wave soldering.
- Published in:
- Sādhanā: Academy Proceedings in Engineering Sciences, 2015, v. 40, n. 7, p. 2197, doi. 10.1007/s12046-015-0409-z
- By:
- Publication type:
- Article
Effects of immersion silver (ImAg) and immersion tin (ImSn) surface finish on the microstructure and joint strength of Sn-3.0Ag-0.5Cu solder.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 17, p. 14249, doi. 10.1007/s10854-022-08353-z
- By:
- Publication type:
- Article
Three-dimensional CFD simulation of the stencil printing performance of solder paste.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2020, v. 108, n. 9/10, p. 3351, doi. 10.1007/s00170-020-05636-9
- By:
- Publication type:
- Article
Optimization of 3D IC stacking chip on molded encapsulation process: a response surface methodology approach.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2019, v. 103, n. 1-4, p. 1139, doi. 10.1007/s00170-019-03525-4
- By:
- Publication type:
- Article
Stencil printing process performance on various aperture size and optimization for lead-free solder paste.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2019, v. 102, n. 9-12, p. 3369, doi. 10.1007/s00170-019-03423-9
- By:
- Publication type:
- Article
Effect of filling level and fillet profile on pin-through-hole solder joint.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2019, v. 102, n. 5-8, p. 1467, doi. 10.1007/s00170-018-03285-7
- By:
- Publication type:
- Article
Exploring the Use of Inorganic Nitrogen Fertilizer at Different Levels to Improve the Yield, Nutrient Content and In-vitro Gas Production of Immature Kenaf (Hibiscus cannabinus).
- Published in:
- Malaysian Journal of Animal Science, 2023, v. 26, n. 1, p. 37
- By:
- Publication type:
- Article
Thermal Fluid-Structure Interaction in the Effects of Pin-Through-Hole Diameter during Wave Soldering.
- Published in:
- Advances in Mechanical Engineering (Sage Publications Inc.), 2014, p. 1, doi. 10.1155/2014/275735
- By:
- Publication type:
- Article
Pharamacognostic Profile and Comparative In Vitro Anti-Inflammatory Activity Study of Ethanomedicinal Plants of North East India.
- Published in:
- Pharmacognosy Journal, 2021, v. 13, n. 2, p. 317, doi. 10.5530/pj.2021.13.41
- By:
- Publication type:
- Article
Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis.
- Published in:
- Scientific World Journal, 2014, p. 1, doi. 10.1155/2014/482363
- By:
- Publication type:
- Article