Works matching AU 雷永平
1
- Electronic Components & Materials, 2023, v. 42, n. 3, p. 367, doi. 10.14106/j.cnki.1001-2028.2023.1622
- Article
2
- Electronic Components & Materials, 2018, v. 37, n. 7, p. 1, doi. 10.14106/j.cnki.1001-2028.2018.07.001
- Article
3
- Electronic Components & Materials, 2017, v. 36, n. 3, p. 63, doi. 10.14106/j.cnki.1001-2028.2017.03.013
- Article
4
- Journal of Materials Engineering / Cailiao Gongcheng, 2020, v. 48, n. 12, p. 126, doi. 10.11868/j.issn.1001-4381.2019.001168
- Article
5
- Journal of Beijing University of Technology, 2022, v. 48, n. 10, p. 1078, doi. 10.11936/bjutxb2021060012
- Article