Works matching AU 雷永平


Results: 5
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    无卤素低银无铅焊膏的研制.

    Published in:
    Electronic Components & Materials, 2017, v. 36, n. 3, p. 63, doi. 10.14106/j.cnki.1001-2028.2017.03.013
    By:
    • 郝娟娟;
    • 顾建;
    • 赵鹏;
    • 雷永平;
    • 林健
    Publication type:
    Article
    4

    316L 超薄板激光焊接的失稳 变形规律.

    Published in:
    Journal of Materials Engineering / Cailiao Gongcheng, 2020, v. 48, n. 12, p. 126, doi. 10.11868/j.issn.1001-4381.2019.001168
    By:
    • 张景祺;
    • 林 健;
    • 雷永平;
    • 许海亮;
    • 王细波
    Publication type:
    Article
    5

    核电用错合金电阻对焊的研究进展.

    Published in:
    Journal of Beijing University of Technology, 2022, v. 48, n. 10, p. 1078, doi. 10.11936/bjutxb2021060012
    By:
    • 林健;
    • 冯刚;
    • 雷永平;
    • 季顺成;
    • 崔泰然;
    • 鲁立;
    • 梁振新
    Publication type:
    Article