Works matching AU 钱帅丞

Cu 核微焊点液-固界面反应及剪切行为研究.

Published in:

Electronic Components & Materials, 2024, v. 43, n. 3, p. 367, doi. 10.14106/j.cnki.1001-2028.2024.1298

By:

• 钱帅丞;
• 陈 湜;
• 乔媛媛;
• 赵 宁

Publication type:

Article