环氧树脂表面改性催化铜导电线路沉积研究.
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- Electronic Components & Materials, 2021, v. 40, n. 12, p. 1234, doi. 10.14106/j.cnki.1001-2028.2021.0548
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Works matching AU 贾明理
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PCB 中耐高温有机可焊保护剂 成膜机理及性能研究.
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- Journal of the University of Electronic Science & Technology of China, 2024, v. 53, n. 4, p. 487, doi. 10.12178/1001-0548.2023256
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