Works by 袁进霞

Comsol 模拟金属离子浓度对电镀铜锌合金的影响.

Published in:

Electroplating & Finishing, 2021, v. 40, n. 11, p. 820, doi. 10.19289/j.1004-227x.2021.11.002

By:

• 丁莉峰;
• 陈冲艳;
• 李强;
• 尚芮泽;
• 薛丁;
• 袁进霞;
• 牛宇岚

Publication type:

Article