挠性印制电路板细线路微蚀及化学镀镍工艺研究.
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- Electroplating & Finishing, 2024, v. 43, n. 4, p. 1, doi. 10.19289/j.1004-227x.2024.04.001
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Works matching AU 罗继业
Results: 6
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巯基羧酸类有机物对无氰亚硫酸盐体系电镀金的影响.
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- Electroplating & Finishing, 2023, v. 42, n. 17, p. 35, doi. 10.19289/j.1004-227x.2023.17.006
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- Article
3
高电流密度通孔电镀铜用抑制剂的研究.
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- Electroplating & Finishing, 2023, v. 42, n. 11, p. 43, doi. 10.19289/j.1004-227x.2023.11.007
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- Article
4
稳定剂对盲孔电镀铜用硫酸盐体系镀液寿命的影响.
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- Electroplating & Finishing, 2023, v. 42, n. 5, p. 33, doi. 10.19289/j.1004-227x.2023.05.007
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- Article
5
广东工业大学应用化学专业电子化学品特色方向建设与实践.
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- University Chemistry, 2023, v. 38, n. 3, p. 27, doi. 10.3866/PKU.DXHX202210096
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6
聚乙烯醇缩丁醛的甲苯-乙醇溶液及其非溶剂诱导相分离研究.
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- Journal of Functional Polymers, 2022, v. 35, n. 4, p. 328, doi. 10.14133/j.cnki.1008-9357.20210906001
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- Article