Works by 秦跃利

Results: 3
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    高介薄型陶瓷芯片电容制备工艺研究.

    Published in:
    Electronic Components & Materials, 2022, v. 41, n. 9, p. 1001, doi. 10.14106/j.cnki.1001-2028.2022.0228
    By:
    • 王春富;
    • 黎俊宇;
    • 李彦睿;
    • 王文博;
    • 张 健;
    • 秦跃利;
    • 钟朝位
    Publication type:
    Article
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