Works by 相晨萌

电力电子模块封装硅胶电荷输运与陷阱特性研究.

Published in:

Insulating Materials, 2022, v. 55, n. 8, p. 64, doi. 10.16790/j.cnki.1009-9239.im.2022.08.011

By:

• 赵 军;
• 何瑞东;
• 高树国;
• 相晨萌;
• 王亚林;
• 尹 毅

Publication type:

Article