Works by 毛宽民

基于模态分析的印刷电路板力学性能研究.

Published in:

Electronic Components & Materials, 2021, v. 40, n. 6, p. 597, doi. 10.14106/j.cnki.1001-2028.2021.1747

By:

• 胡 超;
• 刘 芳;
• 周嘉诚;
• 毛宽民

Publication type:

Article