IC 铜布线抛光及后清洗中缓蚀剂BTA 吸附及去除的研究进展.
- Published in:
- Electroplating & Finishing, 2022, v. 41, n. 3, p. 203, doi. 10.19289/j.1004-227x.2022.03.010
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- Article
Works by 檀柏梅
Results: 8
1
2
抑制剂在铜表面吸附机理的实验与理论研究进展.
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- Electroplating & Finishing, 2021, v. 40, n. 21, p. 1637, doi. 10.19289/j.1004-227x.2021.21.008
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- Article
3
复配表面活性剂对铜CMP 后清洗中颗粒的去除.
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- Electroplating & Finishing, 2021, v. 40, n. 13, p. 1031, doi. 10.19289/j.1004-227x.2021.13.010
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- Article
4
电化学测试技术在集成电路制程化学机械抛光中的应用现状.
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- Electroplating & Finishing, 2021, v. 40, n. 1, p. 54, doi. 10.19289/j.1004-227x.2021.01.010
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- Article
5
切削液对金刚石线锯切割 β-Ga<sub>2</sub>O<sub>3</sub> 晶片表面质量的影响.
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- Lubrication Engineering (0254-0150), 2024, v. 49, n. 3, p. 133, doi. 10.3969/j.issn.0254-0150.2024.03.018
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- Article
6
阴离子表面活性剂及复配对阻挡层抛光液性能的影响.
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- Lubrication Engineering (0254-0150), 2023, v. 48, n. 12, p. 46, doi. 10.3969/j.issn.0254-0150.2023.12.007
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- Article
7
集成电路钴化学机械抛光缺陷控制的研究进展.
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- Lubrication Engineering (0254-0150), 2023, v. 48, n. 7, p. 190, doi. 10.3969/j.issn.0254-0150.2023.07.028
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- Article
8
新型碱性清洗液对CMP后残留SiO<sub>2</sub>颗粒的去除.
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- Electronic Components & Materials, 2018, v. 37, n. 5, p. 95, doi. 10.14106/j.cnki.1001-2028.2018.05.017
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- Article