Works matching AU 杨智勤

不同因素对倒装芯片球栅格阵列多阶盲孔可靠性的影响.

Published in:

Electroplating & Finishing, 2024, v. 43, n. 5, p. 46, doi. 10.19289/j.1004-227x.2024.05.007

By:

• 杨智勤;
• 吴鹏;
• 熊佳;
• 魏炜;
• 汪鑫

Publication type:

Article