不同取向 Cu / Cu<sub>3</sub> Sn 界面处原子扩散行为的 分子动力学模拟.
- Published in:
- Electronic Components & Materials, 2023, v. 42, n. 4, p. 467, doi. 10.14106/j.cnki.1001-2028.2023.1582
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- Publication type:
- Article
Works by 李晓延
Results: 6
1
2
空位对Cu / Sn 焊点中Cu<sub>3</sub> Sn层元素扩散的影响.
- Published in:
- Electronic Components & Materials, 2022, v. 41, n. 4, p. 381, doi. 10.14106/j.cnki.1001-2028.2022.1560
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- Publication type:
- Article
3
Cu/Sn/Cu 界面元素的扩散行为研究现状.
- Published in:
- Electronic Components & Materials, 2017, v. 36, n. 7, p. 17, doi. 10.14106/j.cnki.1001-2028.2017.07.003
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- Publication type:
- Article
4
3D 封装中电镀参数对微凸点制备的影响.
- Published in:
- Electronic Components & Materials, 2017, v. 36, n. 5, p. 37, doi. 10.14106/j.cnki.1001-2028.2017.05.008
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- Publication type:
- Article
5
电子封装中 Cu/Cu<sub>3</sub>Sn/Cu 焊点的制备工艺及组织演变.
- Published in:
- Electronic Components & Materials, 2017, v. 36, n. 2, p. 69, doi. 10.14106/j.cnki.1001-2028.2017.02.015
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- Publication type:
- Article
6
全Cu<sub>3</sub>Sn焊点在高温时效下的 组织及力学性能.
- Published in:
- Journal of Materials Engineering / Cailiao Gongcheng, 2022, v. 50, n. 9, p. 169, doi. 10.11868/j.issn.1001-4381.2021.000977
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- Publication type:
- Article