ATMP 作为辅助配位剂对 HEDP 体系铜电沉积行为的影响.
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- Electroplating & Finishing, 2022, v. 41, n. 17, p. 1197, doi. 10.19289/j.1004-227x.2022.17.001
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- Article
Works by 廖志祥
Results: 3
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2
炔醇类添加剂对HEDP 体系中铜电沉积行为的影响.
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- Electroplating & Finishing, 2022, v. 41, n. 13, p. 901, doi. 10.19289/j.1004-227x.2022.13.001
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- Article
3
HEDP 镀铜体系中铜阳极的电化学溶解行为.
- Published in:
- Electroplating & Finishing, 2021, v. 40, n. 16, p. 1231, doi. 10.19289/j.1004-227x.2021.16.001
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- Article