基于同频共振的超厚层路基高能级低碳压实技术.Published in:Journal of Beijing University of Technology, 2025, v. 51, n. 6, p. 695, doi. 10.11936/bjutxb2023070049By:蒋红光;王育杰;嵇永军;李宜欣;吴传山;张晓勇Publication type:Article