Works matching AU 商世广
1
- Electronic Components & Materials, 2022, v. 41, n. 5, p. 539, doi. 10.14106/j.cnki.1001-2028.2022.1578
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2
- Electronic Components & Materials, 2021, v. 40, n. 12, p. 1261, doi. 10.14106/j.cnki.1001-2028.2021.0110
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3
- Electronic Components & Materials, 2021, v. 40, n. 10, p. 1028, doi. 10.14106/j.cnki.1001-2028.2021.1851
- Article
4
- Electronic Components & Materials, 2021, v. 40, n. 3, p. 229, doi. 10.14106/j.cnki.1001-2028.2021.1685
- Article
5
- Journal of Functional Materials / Gongneng Cailiao, 2024, v. 55, n. 3, p. 3178, doi. 10.3969/j.issn.1001-9731.2024.03.023
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6
- Journal of Functional Materials / Gongneng Cailiao, 2021, v. 52, n. 7, p. 7096, doi. 10.3969/j.issn.1001-9731.2021.07.016
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7
- Journal of Chongqing University of Posts & Telecommunications (Natural Science Edition) / Chongqing Youdian Daxue Xuebao (Ziran Kexue Ban), 2022, v. 34, n. 6, p. 1102, doi. 10.3979/j.issn.1673-825X.202106010186
- Article