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基于 MLP-Bagging 的PCB 电热耦合建模方法.
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- Semiconductor Technology, 2024, v. 49, n. 10, p. 912, doi. 10.13290/j.cnki.bdtjs.2024.10.007
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基于AdaBelief 残差神经网络的超材料结构逆设计.
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- Laser Technology, 2022, v. 46, n. 3, p. 307, doi. 10.7510/jgjs.issn.1001-3806.2022.03.003
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- Article