Works matching AU 吴思诚

多层LCP 基板中铜浆垂直互连射频特性的研究.

Published in:

Electronic Components & Materials, 2019, v. 38, n. 9, p. 87, doi. 10.14106/j.cnki.1001-2028.2019.09.014

By:

• 刘维红;
• 康 昕;
• 张 博;
• 吴思诚;
• 刘鹏程

Publication type:

Article