Works by 叶凤娇

成型压力对CuFeO₂陶瓷材料结构和介电性能的影响.

Published in:

Electronic Components & Materials, 2017, v. 36, n. 12, p. 16, doi. 10.14106/j.cnki.1001-2028.2017.12.004

By:

• 谢新宇;
• 代海洋;
• 陈镇平;
• 叶凤娇;
• 谷留停;
• 刘树人

Publication type:

Article