多层 LCP 基板过孔互联结构高精度等效电路模型.
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- Electronic Components & Materials, 2024, v. 43, n. 3, p. 313, doi. 10.14106/j.cnki.1001-2028.2024.1440
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- Article
Works by 刘维红
Results: 10
1
2
多层 LCP 基板中宽带槽线耦合结构的设计与实现.
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- Electronic Components & Materials, 2022, v. 41, n. 12, p. 1318, doi. 10.14106/j.cnki.1001-2028.2022.0170
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- Article
3
LCP 柔性 HMSAFSIW 带通滤波器设计与实现.
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- Electronic Components & Materials, 2022, v. 41, n. 1, p. 59, doi. 10.14106/j.cnki.1001-2028.2022.1246
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- Publication type:
- Article
4
圆形半模空气隙填充基片集成波导带通滤波器 设计与实现.
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- Electronic Components & Materials, 2021, v. 40, n. 11, p. 1140, doi. 10.14106/j.cnki.1001-2028.2021.1813
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- Article
5
基于 LCP 基板的平面螺旋电感设计与实现.
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- Electronic Components & Materials, 2021, v. 40, n. 11, p. 1095, doi. 10.14106/j.cnki.1001-2028.2021.0459
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- Article
6
LCP 多层板中电磁耦合过渡结构的设计与实现.
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- Electronic Components & Materials, 2020, v. 39, n. 10, p. 89, doi. 10.14106/j.cnki.1001-2028.2020.0213
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- Article
7
多层LCP 基板中铜浆垂直互连射频特性的研究.
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- Electronic Components & Materials, 2019, v. 38, n. 9, p. 87, doi. 10.14106/j.cnki.1001-2028.2019.09.014
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- Article
8
基于LCP 基板的超宽带滤波器的设计与实现.
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- Electronic Components & Materials, 2019, v. 38, n. 4, p. 106, doi. 10.14106/j.cnki.1001-2028.2019.04.017
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- Article
9
基于LCP 基板的平面叉指电容研究.
- Published in:
- Electronic Components & Materials, 2019, v. 38, n. 3, p. 45, doi. 10.14106/j.cnki.1001-2028.2019.03.008
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- Article
10
多层LCP电路板过孔互联电路模型快速构建.
- Published in:
- Journal of Shanghai Jiao Tong University (1006-2467), 2022, v. 56, n. 11, p. 1547, doi. 10.16183/j.cnki.jsjtu.2021.308
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- Publication type:
- Article