Found: 6
Select item for more details and to access through your institution.
Nanocomposite SAC solders: morphology, electrical and mechanical properties of Sn-3.8Ag-0.7Cu solders by adding Co nanoparticles.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 15, p. 10965, doi. 10.1007/s10854-017-6877-7
- By:
- Publication type:
- Article
Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6143, doi. 10.1007/s11664-016-4832-7
- By:
- Publication type:
- Article
Influence of Ti and Zr on the bond strength between carbon rod and Cu-Ti and/or Cu-Zr alloys.
- Published in:
- Journal of Materials Science, 2000, v. 35, n. 2, p. 503, doi. 10.1023/A:1004792022731
- By:
- Publication type:
- Article
A meeting of good friends: When the cell biology of prokaryotes and eukaryotes meet.
- Published in:
- 1998
- By:
- Publication type:
- Report
Molecular properties of elongation factor Tu from Streptomyces aureofaciens and Escherichia coli.
- Published in:
- Folia Microbiologica, 1988, v. 33, n. 2, p. 81, doi. 10.1007/BF02928072
- By:
- Publication type:
- Article
Identification of an inducible penicillinase of the lithoautotrophic hydrogen-oxidizing bacterium Alcaligenes eutrophus.
- Published in:
- Folia Microbiologica, 1987, v. 32, n. 5, p. 376, doi. 10.1007/BF02887567
- By:
- Publication type:
- Article