Works matching AU  Y


Results: 5000
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    Mechanical Behavior of SnAgCu as an Electronic Packaging Solder and Its Comparison with Pure Sn: Mechanical Behavior of SnAgCu as an Electronic Packaging Solder and Its Comparison with Pure Sn: Liu, Zhou, Kong, Y. W. Li, Xing, Pang, Wu, Ma, and P. Li.

    Published in:
    JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2025, v. 77, n. 5, p. 3482, doi. 10.1007/s11837-025-07202-8
    By:
    • Liu, X.;
    • Zhou, T. H.;
    • Kong, L. W.;
    • Li, Y. W.;
    • Xing, Z. B.;
    • Pang, L.;
    • Wu, W. B.;
    • Ma, K. Y.;
    • Li, P.
    Publication type:
    Article
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    Recent Progress in High Entropy Alloy Research.

    Published in:
    JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2017, v. 69, n. 10, p. 2024, doi. 10.1007/s11837-017-2484-6
    By:
    • MacDonald, B.;
    • Fu, Z.;
    • Zheng, B.;
    • Chen, W.;
    • Lin, Y.;
    • Chen, F.;
    • Zhang, L.;
    • Ivanisenko, J.;
    • Zhou, Y.;
    • Hahn, H.;
    • Lavernia, E.
    Publication type:
    Article
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