Works matching DE "PRINTED circuits industry"

Results: 233

Effects of 2-aminothiazoline and benzotriazole on copper foil etching.

Published in:

Transactions of the Institute of Metal Finishing, 2025, v. 103, n. 3, p. 125, doi. 10.1080/00202967.2025.2485551

By:

Jin, Lei;
Li, Ke;
Wang, Zhao-Yun

Publication type:

Article

A complete PLC on a chip?

Published in:

Computing & Control Engineering, 2004, v. 15, n. 5, p. 39, doi. 10.1049/cce:20040508

By:

Babb, Michael

Publication type:

Article

Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 15, p. 12910, doi. 10.1007/s10854-018-9410-8

By:

Ismail, Norliza;
Ismail, Roslina;
Jalar, Azman;
Omar, Ghazali;
Salleh, Emee Marina;
Kamil, Norinsan;
Rahman, Irman Abdul

Publication type:

Article

Investigation of moisture uptake into printed circuit board laminate and solder mask materials.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 8, p. 6138, doi. 10.1007/s10854-016-6292-5

By:

Conseil-Gudla, Hélène;
Gudla, Visweswara;
Borgaonkar, Shruti;
Jellesen, Morten;
Ambat, Rajan

Publication type:

Article

Wetting behaviour of SAC305 solder on different substrates in high vacuum and inert atmosphere.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 7, p. 5106, doi. 10.1007/s10854-015-3037-9

By:

Gonçalves, C.;
Leitão, H.;
Lau, C.;
Teixeira, J.;
Ribas, L.;
Teixeira, S.;
Cerqueira, M.;
Macedo, F.;
Soares, D.

Publication type:

Article

某印制电路板企业清洁生产评价体系构建与探讨.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 21, p. 1558, doi. 10.19289/j.1004-227x.2022.21.013

By:

陈妤;
魏喆;
叶茂盛;
李杨杨;
魏立安

Publication type:

Article

PCB Handler의 과도응답해석 및 충격계수 산출 연구.

Published in:

Journal of Digital Convergence, 2017, v. 15, n. 7, p. 223, doi. 10.14400/JDC.2017.15.7.223

By:

이병화;
권순기;
고만수

Publication type:

Article

Demand satisfaction and decision-making for a PCB manufacturing system with production lines in parallel.

Published in:

International Journal of Production Research, 2015, v. 53, n. 11, p. 3193, doi. 10.1080/00207543.2014.965851

By:

Lin, Yi-Kuei;
Chang, Ping-Chen

Publication type:

Article

Bi-objective optimisation for scheduling the identical parallel batch-processing machines with arbitrary job sizes, unequal job release times and capacity limits.

Published in:

International Journal of Production Research, 2015, v. 53, n. 6, p. 1680, doi. 10.1080/00207543.2014.952795

By:

Abedi, Mehdi;
Seidgar, Hany;
Fazlollahtabar, Hamed;
Bijani, Rohollah

Publication type:

Article

Using Deep Learning to Automatic Inspection System of Printed Circuit Board in Manufacturing Industry under the Internet of Things.

Published in:

Computer Science & Information Systems, 2023, v. 20, n. 2, p. 723, doi. 10.2298/CSIS220718020Z

By:

Kai Zhang

Publication type:

Article

Fully Time-domain Scanning of EM Near-Field Radiated by RF Circuits.

Published in:

Progress in Electromagnetics Research B, 2014, v. 57, p. 21, doi. 10.2528/pierb13072903

By:

Yang Liu;
Ravelo, Blaise

Publication type:

Article

MULTIBAND HANDSET ANTENNA ANALYSIS INCLUDING LTE BAND MIMO SERVICE.

Published in:

Progress in Electromagnetics Research, 2013, v. 138, p. 661, doi. 10.2528/pier13022408

By:

Hyunho Wi;
Byeongkwan Kim;
Woojae Jung;
Byungje Lee

Publication type:

Article

A low phase noise oscillator based on substrate integrated coaxial line technology.

Published in:

Journal of Electromagnetic Waves & Applications, 2019, v. 33, n. 4, p. 409, doi. 10.1080/09205071.2018.1531728

By:

Du, Heng;
Yu, Xutao;
Zhang, Hui;
Chen, Peng

Publication type:

Article

Mathematical methods for physical layout of printed circuit boards: an overview.

Published in:

OR Spectrum, 2008, v. 30, n. 3, p. 453, doi. 10.1007/s00291-007-0080-9

By:

Abboud, Nadine;
Grötschel, Martin;
Koch, Thorsten

Publication type:

Article

Newsdesk: PCB manufacturer embraces X-ray inspection for next-generation devices.

Published in:: Insight: Non-Destructive Testing & Condition Monitoring, 2015, v. 57, n. 1, p. 4
Publication type:: Article

Facility-wide planning and scheduling of printed wiring board assembly.

Published in:

Operations Research, 1995, v. 43, n. 2, p. 219, doi. 10.1287/opre.43.2.219

By:

Feo, Thomas A.;
Bard, Jonathan F.

Publication type:

Article

ROUTING PRINTED CIRCUIT CARDS THROUGH AN ASSEMBLY CELL.

Published in:

Operations Research, 1991, v. 39, n. 6, p. 992, doi. 10.1287/opre.39.6.992

By:

Lofgren, Christopher B.;
Mcginnis, Leon F.;
Tovey, Craig A.

Publication type:

Article

Research on pyrolysis of PCB waste with TG-FTIR and Py-GC/MS.

Published in:

Journal of Thermal Analysis & Calorimetry, 2012, v. 110, n. 3, p. 1463, doi. 10.1007/s10973-011-2048-x

By:

Quan, Cui;
Li, Aimin;
Gao, Ningbo

Publication type:

Article

Bioleaching of Metals from Printed Circuit Boards by Mesophilic Lysinibacillus sp.

Published in:

Pollution (2383451X), 2024, v. 10, n. 4, p. 1190, doi. 10.22059/poll.2024.375335.2346

By:

Guin, Shailu Dalal;
Deswal, Surinder

Publication type:

Article

Ka-band compact and high-performance bandpass filter based on multilayer air-filled SIW.

Published in:

Electronics Letters (Wiley-Blackwell), 2017, v. 53, n. 7, p. 486, doi. 10.1049/el.2016.4399

By:

Parment, F.;
Ghiotto, A.;
Vuong, T.-P.;
Duchamp, J.-M.;
Wu, K.

Publication type:

Article

A LOW PROFILE DUAL BAND SLOTTED PATCH ANTENNA ON DIELECTRIC MATERIAL SUBSTRATE.

Published in:

Journal of Applied Global Research, 2013, v. 6, n. 18, p. 12

By:

Islam, M. T.;
Ullah, M. Habib;
Reaz, M. B. I.

Publication type:

Article

Silver Sintering of Packaged GaN-Devices on Printed Circuit Board.

Published in:

Journal of Microelectronic & Electronic Packaging, 2022, v. 19, n. 1, p. 18, doi. 10.4071/imaps.1675410

By:

Müller, Jonas;
Letz, Sebastian A.;
Simon, Flaviu-Bogdan;
Bayer, Christoph F.;
Schletz, Andreas;
Görlich, Jens;
Takatoshi Nishimura

Publication type:

Article

Thermal Cycling Test and Simulation of Fan-Out Chip-Last Panel-Level Packaging for Heterogeneous Integration.

Published in:

Journal of Microelectronic & Electronic Packaging, 2021, v. 18, n. 2, p. 29, doi. 10.4071/imaps.1419800

By:

Lau, John H.;
Cheng-Ta Ko;
Chia-Yu Peng;
Kai-Ming Yang;
Tim Xia;
Lin, Puru Bruce;
Jean-Jou Chen;
Po-Chun Huang;
Tzvy-Jang Tseng;
Lin, Eagle;
Leo Chang;
Lin, Curry;
Yan-Jun Fan;
Hsing-Ning Liu;
Lu, Winnie

Publication type:

Article

Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous Integration.

Published in:

Journal of Microelectronic & Electronic Packaging, 2020, v. 17, n. 3, p. 89, doi. 10.4071/imaps.1137828

By:

Lau, John H.;
Cheng-Ta Ko;
Chia-Yu Peng;
Kai-Ming Yang;
Tim Xia;
Puru Bruce Lin;
Jean-Jou Chen;
Po-Chun Huang;
Tzvy-Jang Tseng;
Eagle Lin;
Leo Chang;
Curry Lin;
Winnie Lu

Publication type:

Article

The Impact of Hydrogen Gas Evolution on Blister Formation in Electroless Cu Films.

Published in:

Journal of Microelectronic & Electronic Packaging, 2015, v. 12, n. 2, p. 86, doi. 10.4071/imaps.458

By:

Bernhard, Tobias;
Brüning, Frank;
Brüning, Ralf;
Sharma, Tanu;
Brown, Delilah;
Zarwell, Sebastian;
Bishop, Craig

Publication type:

Article

Capacitive Fringing Field Moisture Sensors Implemented in Flexible Printed Circuit Board Technology.

Published in:

Journal of Microelectronic & Electronic Packaging, 2014, v. 11, n. 3, p. 122, doi. 10.4071/imaps.415

By:

Dean, Robert N.;
Hamilton, Michael C.;
Baginski, Michael E.

Publication type:

Article

A Modeling Approach for Predicting the Effects of Dielectric Moisture Absorption on the Electrical Performance of Passive Structures.

Published in:

Journal of Microelectronic & Electronic Packaging, 2014, v. 11, n. 3, p. 115, doi. 10.4071/imaps.421

By:

Curran, Brian;
Ndip, Ivan;
Engin, Ege;
Bauer, Jorg;
Pötter, Harald;
Lang, Klaus-Dieter;
Reichl, Herbert

Publication type:

Article

Performance and Perspectives of Zero-Level MEMS Chip Packages with Vertical Interconnects.

Published in:

Journal of Microelectronic & Electronic Packaging, 2014, v. 11, n. 3, p. 87, doi. 10.4071/imaps.418

By:

Cherman, Vladimir O.;
Pham, Nga P.;
Slabbekoorn, John;
Faes, Alessandro;
Margesin, Benno;
Tilmans, Harrie A. C.

Publication type:

Article

EXTRACTION OF COPPER FROM SOLUTION AFTER BIOLEACHING OF PRINTED CIRCUIT BOARDS (PCBs).

Published in:

Metalurgija, 2014, v. 53, n. 2, p. 228

By:

WILLNER, J.;
FORNALCZYK, A.

Publication type:

Article

Package and PCB Effects Shift Intermodulation Notch in an RF Common-Emitter Amplifier.

Published in:

Radioengineering, 2014, v. 23, n. 1, p. 229

By:

Jian-Ming WU;
Ming-Yin KO

Publication type:

Article

Does employee engagement mediate the influence of psychological contract breach on pro-environmental behaviors and intent to remain with the organization in the hotel industry?

Published in:

Journal of Hospitality Marketing & Management, 2021, v. 30, n. 3, p. 326, doi. 10.1080/19368623.2020.1812142

By:

Karatepe, Osman M.;
Rezapouraghdam, Hamed;
Hassannia, Raheleh

Publication type:

Article

Dynamic Analysis of HSDB System and Evaluation of Boundary Non-linearity through Experiments.

Published in:

Defence Science Journal, 2016, v. 66, n. 3, p. 210, doi. 10.14429/dsj.66.8936

By:

Chandrakar, K.;
Rao, P. L. Venkateshwara;
Rajendran, P.;
Satyanarayana, C.

Publication type:

Article

Optimization Studies on Recovery of Metals from Printed Circuit Board Waste.

Published in:

Bioinorganic Chemistry & Applications, 2018, p. 1, doi. 10.1155/2018/1067512

By:

Sivakumar, P.;
Prabhakaran, D.;
Thirumarimurugan, M.

Publication type:

Article

A novel approach for generation of power by harvesting microwave from the ambient environment.

Published in:

Journal of Microwave Power & Electromagnetic Energy, 2016, v. 50, n. 1, p. 19, doi. 10.1080/08327823.2016.1157311

By:

Paulchamy, B.;
Jaya, J.;
Venkatesh, A.

Publication type:

Article

Millimeter-wave planar high gain SIW antenna using half elliptic radiation slots.

Published in:

International Journal of RF & Microwave Computer-Aided Engineering, 2015, v. 25, n. 8, p. 709, doi. 10.1002/mmce.20913

By:

Hao, Zhang‐Cheng;
Ding, Wenqi;
Fan, Kuikui;
Liu, Xiaoming

Publication type:

Article

A novel full-wave CAD for the design of tapered leaky-wave antennas in hybrid waveguide printed-circuit technology.

Published in:

International Journal of RF & Microwave Computer-Aided Engineering, 2006, v. 16, n. 4, p. 297, doi. 10.1002/mmce.20139

By:

Gómez-Tornero, José Luis;
Pascual-García, Juan;
Álvarez-Melcón, Alejandro

Publication type:

Article

An efficient genetic algorithm for setup time minimization in PCB assembly.

Published in:

International Journal of Advanced Manufacturing Technology, 2015, v. 77, n. 5-8, p. 973, doi. 10.1007/s00170-014-6510-3

By:

García-Nájera, Abel;
Brizuela, Carlos;
Martínez-Pérez, Israel

Publication type:

Article

Interaction of cemented carbide micro-drills and printed circuit boards during micro-drilling.

Published in:

International Journal of Advanced Manufacturing Technology, 2015, v. 77, n. 5-8, p. 1305, doi. 10.1007/s00170-014-6520-1

By:

Zheng, Li;
Wang, Cheng;
Qu, Yun;
Song, Yue;
Fu, Lian

Publication type:

Article

Generation of microfeatures on stainless steel by electrochemical micromachining.

Published in:

International Journal of Advanced Manufacturing Technology, 2015, v. 76, n. 1-4, p. 39, doi. 10.1007/s00170-013-5251-z

By:

Ghoshal, B.;
Bhattacharyya, B.

Publication type:

Article

Organizing the nozzle magazine of a gantry-type PCB assembly machine.

Published in:

International Journal of Advanced Manufacturing Technology, 2013, v. 68, n. 5-8, p. 1189, doi. 10.1007/s00170-013-4911-3

By:

Knuutila, Timo;
Suomi, Tomi;
Emet, Stefan;
Johnsson, Mika;
Nevalainen, Olli S.

Publication type:

Article

Misalignment inspection of multilayer PCBs with an automated X-ray machine vision system.

Published in:

International Journal of Advanced Manufacturing Technology, 2010, v. 51, n. 9-12, p. 995, doi. 10.1007/s00170-010-2664-9

By:

Chuang, Shui-Fa;
Chang, Wen-Tung;
Lin, Chih-Cheng;
Tarng, Yeong-Shin

Publication type:

Article

Workload balancing in printed circuit board assembly.

Published in:

International Journal of Advanced Manufacturing Technology, 2010, v. 50, n. 9-12, p. 1175, doi. 10.1007/s00170-010-2558-x

By:

Emet, Stefan;
Knuutila, Timo;
Alhoniemi, Esa;
Maier, Michael;
Johnsson, Mika;
Nevalainen, Olli

Publication type:

Article

Establishing process parameter levels for double-sided PCBs.

Published in:

International Journal of Advanced Manufacturing Technology, 2010, v. 50, n. 9-12, p. 1025, doi. 10.1007/s00170-010-2591-9

By:

Pradhan, Biswabrata

Publication type:

Article

Analysis of sonic waves generated during laser engraving of printed circuits.

Published in:

International Journal of Advanced Manufacturing Technology, 2009, v. 42, n. 1/2, p. 138, doi. 10.1007/s00170-008-1581-7

By:

Gorkič, Aleš;
Kovačič, Drago;
Diaci, Janez

Publication type:

Article

An environmental assessment model applied to printed circuit board manufacturing.

Published in:

International Journal of Advanced Manufacturing Technology, 2007, v. 32, n. 7/8, p. 834, doi. 10.1007/s00170-005-0389-y

By:

Hui, I.

Publication type:

Article

Automatic optical inspection for detecting defects on printed circuit board inner layers.

Published in:

International Journal of Advanced Manufacturing Technology, 2005, v. 25, n. 9/10, p. 940, doi. 10.1007/s00170-004-2299-9

By:

Rau, H.;
Wu, C.-H.

Publication type:

Article

Parametric Optimization of Double-Sided Printed Circuit Board With Triple Modal Reservation Accounting Failures.

Published in:

Electrica, 2023, v. 23, n. 2, p. 338, doi. 10.5152/electrica.2023.22078

By:

Medvedev, Artem V.;
Gazizov, Talgat R.

Publication type:

Article

Preparation and Characterization of Adsorbent from Waste Printed Circuit Boards.

Published in:

Journal of Solid Waste Technology & Management, 2015, v. 41, n. 4, p. 996

By:

Debnath, Biswajit;
Ghosh, Sadhan K.

Publication type:

Article

Leistungsmodule mit hoher Stromdichte.

Published in:: Elektronik Industrie, 2025, p. 12
Publication type:: Article

Für geringere Umwelt-auswirkungen generativer KI.

Published in:

Elektronik Industrie, 2025, n. 3, p. 12

By:

Wood, Maury

Publication type:

Article