Works matching DE "MICROELECTRONICS industry"
Results: 75
Anodic dissolution of copper in dilute hydroxylamine solutions: application to electrochemical mechanical planarisation of copper.
- Published in:
- Corrosion Engineering, Science & Technology, 2009, v. 44, n. 2, p. 101, doi. 10.1179/174327808X315669
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- Publication type:
- Article
Coherent singlet-triplet oscillations in a silicon-based double quantum dot.
- Published in:
- Nature, 2012, v. 481, n. 7381, p. 344, doi. 10.1038/nature10707
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- Publication type:
- Article
RESEARCH, TECHNOLOGY, AND INNOVATION.
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- Defense Acquisition, 2023, v. 52, n. 6, p. 57
- Publication type:
- Article
Aromatic polyethers with 2,6-bis(4-azidotetrafluorobenzylidene)cyclohexanone side fragments and styryl groups in the backbone.
- Published in:
- Doklady Chemistry, 2011, v. 438, n. 1, p. 140, doi. 10.1134/S0012500811050041
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- Publication type:
- Article
A Review on Aerosol-Based Direct-Write and Its Applications for Microelectronics.
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- Journal of Nanotechnology, 2012, p. 1, doi. 10.1155/2012/324380
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- Publication type:
- Article
METROPOLITAN DEVELOPMENT IN THE SAN FRANCISCO BAY AREA.
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- Annals of Regional Science, 1988, v. 22, n. 3, p. 11, doi. 10.1007/BF01283650
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- Publication type:
- Article
HIGH HOPES FOR HIGH TECH (Book Review).
- Published in:
- 1988
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- Publication type:
- Book Review
Static control logic for microfluidic devices using pressure-gain valves.
- Published in:
- Nature Physics, 2010, v. 6, n. 3, p. 218, doi. 10.1038/nphys1513
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- Publication type:
- Article
Microelectronics see water growth.
- Published in:
- Water & Environment International, 2001, p. 5
- Publication type:
- Article
A state-of-the-art review of ductile cutting of silicon wafers for semiconductor and microelectronics industries.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2012, v. 63, n. 5-8, p. 481, doi. 10.1007/s00170-012-3937-2
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- Publication type:
- Article
A silicon/iron-disilicide light-emitting diode operating at a wavelength of 1.5 ...m.
- Published in:
- Nature, 1997, v. 387, n. 6634, p. 686, doi. 10.1038/42667
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- Publication type:
- Article
In Recognition of Professor Hitchman: Advances in Chemical Vapor Deposition.
- Published in:
- 2017
- By:
- Publication type:
- Editorial
GUEST EDITORIAL.
- Published in:
- 2005
- By:
- Publication type:
- Editorial
Labor Unions' Response to the Technological Revolution in Microelectronics.
- Published in:
- International Studies of Management & Organization, 1985, v. 15, n. 3/4, p. 159, doi. 10.1080/00208825.1985.11656418
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- Publication type:
- Article
Chip Wars: Can the U.S. Regain Its Advantage in Microelectronics?
- Published in:
- California Management Review, 1988, v. 30, n. 4, p. 64, doi. 10.2307/41166527
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- Publication type:
- Article
Feedback quality adjustment with Bayesian state-space models.
- Published in:
- Applied Stochastic Models in Business & Industry, 2007, v. 23, n. 2, p. 145, doi. 10.1002/asmb.659
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- Publication type:
- Article
Laser-Induced Forward Transfer of Functional Materials: Advances and Future Directions.
- Published in:
- Journal of Laser Micro / Nanoengineering, 2014, v. 9, n. 3, p. 192, doi. 10.2961/jlmn.2014.03.0002
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- Publication type:
- Article
Development of High-Speed On–Off Valves and Their Applications.
- Published in:
- Chinese Journal of Mechanical Engineering, 2022, v. 35, n. 1, p. 1, doi. 10.1186/s10033-022-00720-5
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- Publication type:
- Article
The birth and development of a born global industry: The case of microelectronics in Norway.
- Published in:
- Journal of International Entrepreneurship, 2018, v. 16, n. 1, p. 82, doi. 10.1007/s10843-017-0206-3
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- Publication type:
- Article
Ferroelectric, Thermal, and Magnetic Characteristics of Praseodymium Malonate Hexahydrate Crystals.
- Published in:
- Journal of Electronic Materials, 2016, v. 45, n. 4, p. 2206, doi. 10.1007/s11664-015-4269-4
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- Publication type:
- Article
Nucleation and Growth of Cu-Al Intermetallics in Al-Modified Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys.
- Published in:
- Journal of Electronic Materials, 2015, v. 44, n. 3, p. 842, doi. 10.1007/s11664-014-3551-1
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- Publication type:
- Article
Optimal Phosphorous Content Selection for the Soldering Reaction of Ni-P Under Bump Metallization with Sn-Ag-Cu Solder.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 8, p. 1665, doi. 10.1007/s11664-006-0215-9
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- Publication type:
- Article
All or nothing [production engineering computing - vacuum pumps].
- Published in:
- Manufacturing Engineer, 2007, v. 86, n. 1, p. 40, doi. 10.1049/me:20070109
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- Publication type:
- Article
THE NEW ALCHEMISTS (Book).
- Published in:
- 1983
- By:
- Publication type:
- Book Review
Wafer Level Packaging of Compound Semiconductors.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2010, v. 7, n. 3, p. 152, doi. 10.4071/imaps.263
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- Publication type:
- Article
Critical Issues of TSV and 3D IC Integration.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2010, v. 7, n. 1, p. 35, doi. 10.4071/1551-4897-7.1.35
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- Publication type:
- Article
Development and validation of the analytical method by high performance liquid chromatography (HPLC) for Lamotrigine raw material.
- Published in:
- Acta Scientiarum: Health Sciences, 2011, v. 33, n. 2, p. 153, doi. 10.4025/actascihealthsci.v33i2.8244
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- Publication type:
- Article
Effect of Process Parameters on Surface Quality for Wire Saw Cutting of Alumina Ceramic.
- Published in:
- Gazi University Journal of Science, 2011, v. 24, n. 2, p. 291
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- Publication type:
- Article
AC CONDUCTION AND DIELECTRIC CHARACTERIZATION OF LEAD SELENIDE THIN FILMS FROM VACUUM EVAPORATION TECHNIQUE.
- Published in:
- Chalcogenide Letters, 2009, v. 6, n. 9, p. 509
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- Publication type:
- Article
Intellectual Property and Product Portfolio Expansion Drive Investments.
- Published in:
- Microwave Journal, 2007, v. 50, n. 11, p. 46
- Publication type:
- Article
GaAs Device Market Will Break Through $3 B in 2006.
- Published in:
- Microwave Journal, 2006, v. 49, n. 6, p. 45
- Publication type:
- Article
Job stress models, depressive disorders and work performance of engineers in microelectronics industry.
- Published in:
- International Archives of Occupational & Environmental Health, 2011, v. 84, n. 1, p. 91, doi. 10.1007/s00420-010-0538-y
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- Publication type:
- Article
Nanotechnology and Nanoscience – From Past Breakthroughs to Future Prospects.
- Published in:
- Informacije MIDEM: Journal of Microelectronics, Electronic Components & Materials, 2021, v. 51, n. 1, p. 25, doi. 10.33180/InfMIDEM2021.102
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- Publication type:
- Article
Impurity Effects in Electroplated-Copper Solder Joints.
- Published in:
- Metals (2075-4701), 2018, v. 8, n. 6, p. 388, doi. 10.3390/met8060388
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- Publication type:
- Article
Pulsed laser deposition of Co and growth of CoSi<sub>2</sub> on Si(111).
- Published in:
- Applied Physics A: Materials Science & Processing, 2005, v. 81, n. 8, p. 1651, doi. 10.1007/s00339-005-3374-2
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- Publication type:
- Article
The Microelectronics Industry (Book).
- Published in:
- 1986
- Publication type:
- Book Review
SOCIOMATERIALIDAD Y ORGANIZACIÓN: BASES SOBRE UNA ONTOLOGÍA RELACIONAL DE LA TECNOLOGÍA.
- Published in:
- Gestión y Estrategia, 2014, n. 45, p. 133
- By:
- Publication type:
- Article
NUI Galway hosts ISSC.
- Published in:
- Engineers Journal, 2008, v. 62, n. 6, p. 342
- Publication type:
- Article
Evaluating PCB Plated Through Holes For 5G Applications.
- Published in:
- Microwave Journal, 2018, v. 61, n. 12, p. 60
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- Publication type:
- Article
Electrochemical Polishing of Copper for Microelectronic Applications.
- Published in:
- Surface Engineering, 2003, v. 19, n. 1, p. 11, doi. 10.1179/026708402225010047
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- Publication type:
- Article
JESSI enters critical phase.
- Published in:
- Nature, 1989, v. 341, n. 6243, p. 559, doi. 10.1038/341559b0
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- Publication type:
- Article
Freestanding few-layer sheets of a dual topological insulator.
- Published in:
- NPJ 2D Materials & Applications, 2021, v. 5, n. 1, p. 1, doi. 10.1038/s41699-021-00203-6
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- Publication type:
- Article
Determinants of Perceived Interfirm Dependence in Industrial Supplier Relations.
- Published in:
- Journal of Management & Governance, 1998, v. 2, n. 3, p. 213, doi. 10.1023/A:1009962926611
- By:
- Publication type:
- Article
Micro- and Nanoscale Heat Transfer: Challenges and Opportunities.
- Published in:
- 2002
- By:
- Publication type:
- Editorial
PVD Global Market Expected to Grow Over Next Five Years.
- Published in:
- Advanced Materials & Processes, 2008, v. 166, n. 2, p. 58
- Publication type:
- Article
POSS-benzocyclobutene (POSS-BCB) resin.
- Published in:
- High Performance Polymers, 2018, v. 30, n. 9, p. 1123, doi. 10.1177/0954008317740194
- By:
- Publication type:
- Article
Amkor's experiences with factory opportunities in China.
- Published in:
- Solid State Technology, 2001, v. 44, n. 8, p. S25
- By:
- Publication type:
- Article
Marseille-Provence: A center of microelectronics.
- Published in:
- Solid State Technology, 1999, v. 42, n. 7, p. 44
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- Publication type:
- Article
Eastern Germany's `Silicon Saxony' attracting high-tech business.
- Published in:
- Solid State Technology, 1998, v. 41, n. 9, p. 52
- By:
- Publication type:
- Article
Europe is speeding up R&D in deep submicron processing.
- Published in:
- Solid State Technology, 1998, v. 41, n. 6, p. 50
- By:
- Publication type:
- Article