Damage Progression Using Speckle-Correlation and High-Speed Imaging for Survivability of Leadfree Packaging Under Shock.
- Published in:
- Strain, 2009, v. 45, n. 3, p. 267, doi. 10.1111/j.1475-1305.2009.00629.x
- By:
- Publication type:
- Article
Works matching DE "SEMICONDUCTOR failures"
Results: 12
1
2
Fault recognition based test score for improving the accuracy of defect diagnosis.
- Published in:
- Electronics Letters (Wiley-Blackwell), 2021, v. 57, n. 15, p. 597, doi. 10.1049/ell2.12195
- By:
- Publication type:
- Article
3
Modeling and Simulation of Electronic Packages Subjected to Drop Impact.
- Published in:
- International Journal for Computational Methods in Engineering Science & Mechanics, 2008, v. 9, n. 2, p. 138, doi. 10.1080/15502280701815465
- By:
- Publication type:
- Article
4
THE TEST-TO-TARGET METHODOLOGIES FOR THE RISK ASSESSMENT OF SEMICONDUCTOR RELIABILITY.
- Published in:
- International Journal of Reliability, Quality & Safety Engineering, 2013, v. 20, n. 4, p. -1, doi. 10.1142/S0218539313500113
- By:
- Publication type:
- Article
5
ENGAGE WITH EDFAS.
- Published in:
- 2018
- By:
- Publication type:
- Editorial
6
Yield-Oriented Logic Failure Characterization for FA Prioritization.
- Published in:
- Electronic Device Failure Analysis, 2014, v. 16, n. 3, p. 4, doi. 10.31399/asm.edfa.2014-3.p004
- By:
- Publication type:
- Article
7
Electromigration History and Failure Analysis.
- Published in:
- Electronic Device Failure Analysis, 2014, v. 16, n. 3, p. 14, doi. 10.31399/asm.edfa.2014-3.p014
- By:
- Publication type:
- Article
8
ISTFA 2014 Preview.
- Published in:
- 2014
- By:
- Publication type:
- Proceeding
9
Failure Analysis of Electronic Material Using Cryogenic FIB-SEM.
- Published in:
- Electronic Device Failure Analysis, 2013, v. 15, n. 3, p. 12, doi. 10.31399/asm.edfa.2013-3.p012
- By:
- Publication type:
- Article
10
Fast Failure Isolation of Thermal Defects, Generally Shorts.
- Published in:
- Electronic Device Failure Analysis, 2013, v. 15, n. 3, p. 4, doi. 10.31399/asm.edfa.2013-3.p004
- By:
- Publication type:
- Article
11
Noteworthy Item: IPFA 2011.
- Published in:
- 2011
- Publication type:
- Proceeding
12
Failure Analysis: Why Mistakes Are Made and How to Avoid Making One.
- Published in:
- Journal of Failure Analysis & Prevention, 2014, v. 14, n. 6, p. 697, doi. 10.1007/s11668-014-9891-6
- By:
- Publication type:
- Article