Silicon‐Integrated Perovskite Photonic Laser Based on Bound States in Continuum.
- Published in:
- Laser & Photonics Reviews, 2025, v. 19, n. 9, p. 1, doi. 10.1002/lpor.202401327
- By:
- Publication type:
- Article
Works matching DE "INTEGRATED circuits"
Results: 5000
1
2
On the Cover.
- Published in:
- 2016
- Publication type:
- Cover Art
3
Trade Protection Comes to Silicon Valley.
- Published in:
- Society, 1989, v. 26, n. 3, p. 38, doi. 10.1007/BF02699246
- By:
- Publication type:
- Article
4
Where are they now?
- Published in:
- Solid State Technology, 2001, v. 44, n. 11, p. 32
- By:
- Publication type:
- Article
5
A new paradigm for evaluating IC yield loss.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. 47
- By:
- Publication type:
- Article
6
Brittlestar eyes: Key to future microlenses?
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. 28
- Publication type:
- Article
7
Higher-density packaging innovations continue.
- Published in:
- Solid State Technology, 2001, v. 44, n. 10, p. 28
- By:
- Publication type:
- Article
8
Is chipmaking skill still a differentiator?
- Published in:
- 2001
- By:
- Publication type:
- Editorial
9
Cycle time, 300mm in spotlight at automation conference.
- Published in:
- Solid State Technology, 2001, v. 44, n. 8, p. 34
- By:
- Publication type:
- Article
10
Patented IC measures time to trillionths of a second.
- Published in:
- Solid State Technology, 2001, v. 44, n. 8, p. 28
- By:
- Publication type:
- Article
11
SMIF Integration and mini-environments cause users most grief.
- Published in:
- Solid State Technology, 2001, v. 44, n. 8, p. 20
- Publication type:
- Article
12
WORLDWIDE HIGHLIGHTS.
- Published in:
- Solid State Technology, 2001, v. 44, n. 8, p. 18
- Publication type:
- Article
13
Economics will dictate the future.
- Published in:
- 2001
- By:
- Publication type:
- Editorial
14
Safety solutions for high-pressure gas cylinders.
- Published in:
- Solid State Technology, 2001, v. 44, n. 7, p. 153
- By:
- Publication type:
- Article
15
Better EDA tool integration needed for growing SoC market.
- Published in:
- Solid State Technology, 2001, v. 44, n. 7, p. 58
- By:
- Publication type:
- Article
16
Chipmakers to compete with assembly houses for SiP.
- Published in:
- Solid State Technology, 2001, v. 44, n. 7, p. 51
- Publication type:
- Article
17
System-on-a-chip challenged by stacked system-in-a-package technology*.
- Published in:
- Solid State Technology, 2001, v. 44, n. 7, p. 48
- By:
- Publication type:
- Article
18
Floating 3-D display seemingly out of sci-fi.
- Published in:
- Solid State Technology, 2001, v. 44, n. 6, p. 28
- Publication type:
- Article
19
2001": The 'make or break' year for 300mm wafer transition goals.
- Published in:
- Solid State Technology, 2001, v. 44, n. 5, p. 174
- By:
- Publication type:
- Article
20
IBM, MOSIS get SiGe wit it.
- Published in:
- Solid State Technology, 2001, v. 44, n. 5, p. 28
- Publication type:
- Article
21
Advanced IC packaging: Markets and trends.
- Published in:
- Solid State Technology, 2001, v. 44, n. 4, p. 44
- By:
- Publication type:
- Article
22
Meeting ITRS Roadmap challenges with low-kappa dielectric etching.
- Published in:
- Solid State Technology, 2001, v. 44, n. 3, p. 107
- By:
- Publication type:
- Article
23
Communicant Semiconductor Technologies.
- Published in:
- Solid State Technology, 2001, v. 44, n. 3, p. 46
- Publication type:
- Article
24
Integrating backend processes.
- Published in:
- Solid State Technology, 2001, v. 44, n. 2, p. 78
- By:
- Publication type:
- Article
25
Emergence of atomic layer processes.
- Published in:
- Solid State Technology, 2001, v. 44, n. 1, p. 70
- By:
- Publication type:
- Article
26
Schlumberger makes progress in flip chip probing.
- Published in:
- Solid State Technology, 2001, v. 44, n. 1, p. 36
- By:
- Publication type:
- Article
27
Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits.
- Published in:
- Solid State Technology, 2000, v. 43, n. 11, p. 125
- By:
- Publication type:
- Article
28
Broadening the platforms for system-in-package solutions.
- Published in:
- Solid State Technology, 2000, v. 43, n. 11, p. 115
- By:
- Publication type:
- Article
29
Defects from substrate particles depend on the sputter deposition process.
- Published in:
- Solid State Technology, 2000, v. 43, n. 11, p. 95
- By:
- Publication type:
- Article
30
System-on-a-chip: Not as easy as it looks.
- Published in:
- 2000
- By:
- Publication type:
- Editorial
31
A re-examination of silicon wafer specifications.
- Published in:
- Solid State Technology, 2000, v. 43, n. 10, p. 210
- By:
- Publication type:
- Article
32
The SiGe IC market in a wireless, broadband world.
- Published in:
- Solid State Technology, 2000, v. 43, n. 9, p. 59
- By:
- Publication type:
- Article
33
SOC devices spur ASIC market growth.
- Published in:
- Solid State Technology, 2000, v. 43, n. 8, p. 48
- By:
- Publication type:
- Article
34
Analysis improves thermal control of heated chucks for IC processing.
- Published in:
- Solid State Technology, 2000, v. 43, n. 7, p. 271
- By:
- Publication type:
- Article
35
System-on-a-chip: What industry needs to do.
- Published in:
- Solid State Technology, 2000, v. 43, n. 3, p. 142
- By:
- Publication type:
- Article
36
Pentacene organic thin-film transistors and ICs.
- Published in:
- Solid State Technology, 2000, v. 43, n. 3, p. 63
- By:
- Publication type:
- Article
37
Spin-etch planarization for dual damascene interconnect structures.
- Published in:
- Solid State Technology, 2000, v. 43, n. 3, p. 53
- By:
- Publication type:
- Article
38
Fab Trends: Are Europe and Asia leading the way?
- Published in:
- Solid State Technology, 2000, v. 43, n. 3, p. 8
- By:
- Publication type:
- Article
39
Advent of SOCs thwarted: Panelists cite packaging standards testing costs.
- Published in:
- Solid State Technology, 2000, v. 43, n. 2, p. 36
- Publication type:
- Article
40
IEDM 1999 focused on CMOS solutions.
- Published in:
- Solid State Technology, 2000, v. 43, n. 2, p. 30
- By:
- Publication type:
- Article
41
Moore's Law--the z dimension.
- Published in:
- Solid State Technology, 2000, v. 43, n. 1, p. 84
- By:
- Publication type:
- Article
42
Microelectronics' nanotechnology future.
- Published in:
- Solid State Technology, 2000, v. 43, n. 1, p. 63
- By:
- Publication type:
- Article
43
Gearing up for flip chip.
- Published in:
- Solid State Technology, 1999, v. 42, n. 10, p. 87
- By:
- Publication type:
- Article
44
Plasma doping: Progress and potential.
- Published in:
- Solid State Technology, 1999, v. 42, n. 10, p. 77
- By:
- Publication type:
- Article
45
Salicides and alternative technologies for future ICs: Part 2.
- Published in:
- Solid State Technology, 1999, v. 42, n. 8, p. 55
- By:
- Publication type:
- Article
46
From Japan: Simplified interconnect processing for cost-sensitive chips.
- Published in:
- Solid State Technology, 1999, v. 42, n. 7, p. 99
- By:
- Publication type:
- Article
47
SBC '99: I300I milestones, cycle time, spec-setting.
- Published in:
- Solid State Technology, 1999, v. 42, n. 7, p. 38
- Publication type:
- Article
48
SOCs will reshape the industry.
- Published in:
- Solid State Technology, 1999, v. 42, n. 7, p. 14
- By:
- Publication type:
- Article
49
Buried layer substrates: Economically enhancing device performance.
- Published in:
- Solid State Technology, 1999, v. 42, n. 6, p. 95
- By:
- Publication type:
- Article
50
Salicides and alternative technologies for future ICs: Part 1.
- Published in:
- Solid State Technology, 1999, v. 42, n. 6, p. 81
- By:
- Publication type:
- Article