Works matching DE "BOUNDARY scan testing"

Results: 37

Tunable Dual Band Filter with BST Capacitors.

Published in:

Integrated Ferroelectrics, 2014, v. 157, n. 1, p. 95, doi. 10.1080/10584587.2014.912109

By:

Aldeeb, Hassan;
Kalkur, T. S.

Publication type:

Article

Improved Mechanisms for Excellent Tunable Microwave Ce and Mn Codoped Ba 0.6 Sr 0.4 TiO 3 Thin Films.

Published in:

Integrated Ferroelectrics, 2014, v. 152, n. 1, p. 104, doi. 10.1080/10584587.2014.901875

By:

Liao, Jiaxuan;
Wang, Sizhe;
Wei, Xubo;
Xu, Ziqiang;
Wang, Peng

Publication type:

Article

Influence of Film Thickness on Dielectric Properties of Y and Mn Alternately Doped BST Films.

Published in:

Integrated Ferroelectrics, 2014, v. 152, n. 1, p. 97, doi. 10.1080/10584587.2014.901873

By:

Zhang, Weifang;
Liao, Jiaxuan;
Huang, Jiaqi

Publication type:

Article

CHARACTERIZATION AND FIRST PRINCIPLE STUDIES ON Pb-SUBSTITUTED (Ba,Sr)TiO3 CERAMICS.

Published in:

Integrated Ferroelectrics, 2009, v. 113, n. 1, p. 75, doi. 10.1080/10584587.2009.490175

By:

JIANJUN LI;
WEIMING YANG;
MENG WANG;
YUNBO WANG;
JUN YU

Publication type:

Article

STRUCTURAL AND ELECTRICAL PROPERTIES OF (Ba x Sr 1-x )TiO 3 THIN FILMS PREPARED BY A SOL-GEL METHOD.

Published in:

Integrated Ferroelectrics, 2006, v. 80, n. 1, p. 423, doi. 10.1080/10584580600663201

By:

J. K. Kim;
S. S. Kim;
W. J. Kim;
J. K. Chung;
I.-S. Kim;
J.-S Song

Publication type:

Article

Toward building full-system EMI verification and early design flows through full-wave electromagnetic simulation.

Published in:

International Journal of RF & Microwave Computer-Aided Engineering, 2012, v. 22, n. 1, p. 104, doi. 10.1002/mmce.20589

By:

Jandhyala, Vikram;
Gope, Dipanjan;
Chakraborty, Swagato;
Murugan, Rajen;
Mukherjee, Souvik

Publication type:

Article

Optimization of Boundary Scan Tests Using FPGA-Based Efficient Scan Architectures.

Published in:

Journal of Electronic Testing, 2016, v. 32, n. 3, p. 245, doi. 10.1007/s10836-016-5588-y

By:

Aleksejev, Igor;
Devadze, Sergei;
Jutman, Artur;
Shibin, Konstantin

Publication type:

Article

Application of Contactless Testing to PCBs with BGAs and Open Sockets.

Published in:

Journal of Electronic Testing, 2015, v. 31, n. 4, p. 339, doi. 10.1007/s10836-015-5535-3

By:

Renbi, Abdelghani;
Delsing, Jerker

Publication type:

Article

Contactless Testing of Circuit Interconnects.

Published in:

Journal of Electronic Testing, 2015, v. 31, n. 3, p. 229, doi. 10.1007/s10836-015-5524-6

By:

Renbi, Abdelghani;
Delsing, Jerker

Publication type:

Article

Current State of the Mixed-Signal Test Bus 1149.4.

Published in:

Journal of Electronic Testing, 2012, v. 28, n. 6, p. 857, doi. 10.1007/s10836-012-5339-7

By:

Hannu, Jari;
Häkkinen, Juha;
Voutilainen, Juha-Veikko;
Jantunen, Heli;
Moilanen, Markku

Publication type:

Article

A New Algorithm for the Selection of Control Cells in Boundary-Scan Interconnect Test.

Published in:

Journal of Electronic Testing, 2009, v. 25, n. 2/3, p. 187, doi. 10.1007/s10836-008-5091-1

By:

A. Quiros-Olozabal;
M. Cifredo-Chacon

Publication type:

Article

Thermal conductivity of skutterudite CoSb3 from first principles: Substitution and nanoengineering effects.

Published in:

Scientific Reports, 2015, p. 7806, doi. 10.1038/srep07806

By:

Guo, Ruiqiang;
Wang, Xinjiang;
Huang, Baoling

Publication type:

Article

Appling a Novel Cost Function to Hopfield Neural Network for Defects Boundaries Detection of Wood Image.

Published in:

EURASIP Journal on Advances in Signal Processing, 2010, p. 1, doi. 10.1155/2010/427878

By:

Dawei Qi;
Peng Zhang;
Xuefei Zhang;
Xuejing Jin;
Haijun Wu

Publication type:

Article

Boundary scan pioneers go deep.

Published in:

EE: Evaluation Engineering, 2015, v. 54, n. 5, p. 18

By:

Nelson, Rick

Publication type:

Article

The life-cycle aspect of boundary scan.

Published in:

EE: Evaluation Engineering, 2014, v. 53, n. 11, p. 24

By:

van den Eijnden, Peter

Publication type:

Article

JTAG Controller with WLAN Interface.

Published in:: 2012
Publication type:: Product Review

Embedded Test Complements Boundary Scan.

Published in:

2012

By:

Nelson, Rick

Publication type:

Product Review

Paul's Picks.

Published in:: EE: Evaluation Engineering, 2011, v. 50, n. 3, p. 8
Publication type:: Article

Three Degrees of Board Testing.

Published in:

2010

By:

Lecklider, Tom

Publication type:

Product Review

PAUL'S PICKS.

Published in:: 2009
Publication type:: Product Review

Integrating Boundary Scan With Various ATE.

Published in:

EE: Evaluation Engineering, 2006, v. 45, n. 7, p. 32

By:

Ehrenberg, Heiko

Publication type:

Article

What Problems Can Boundary Scan Solve?

Published in:

EE: Evaluation Engineering, 2006, v. 45, n. 5, p. 18

By:

Bennetts, R. G. (Ben)

Publication type:

Article

DFT Features Evaluated Before Prototyping.

Published in:: 2005
Publication type:: Product Review

Testability Beyond JTAG.

Published in:

EE: Evaluation Engineering, 2005, v. 44, n. 9, p. 48

By:

Ungar, Louis Y.

Publication type:

Article

Boundary Scan and Processor Emulation Achieve Synergy.

Published in:

EE: Evaluation Engineering, 2005, v. 44, n. 5, p. 56

By:

Bonnett, Dave

Publication type:

Article

Testing: Boundary Scan Style.

Published in:

EE: Evaluation Engineering, 2004, v. 43, n. 8, p. 34

By:

Lecklider, Tom

Publication type:

Article

New Products.

Published in:: 2004
Publication type:: Product Review

PCB Testing Goes Socketless.

Published in:

EE: Evaluation Engineering, 2004, v. 43, n. 7, p. 84

By:

Parker, Matt;
Smith, Jeff

Publication type:

Article

Reducing the Cost of Test With Boundary Scan.

Published in:

EE: Evaluation Engineering, 2004, v. 43, n. 1, p. 28

By:

Goepel, Holger

Publication type:

Article

Boundary Scan for Mixed-Signal Controller Cards.

Published in:

EE: Evaluation Engineering, 2003, v. 42, n. 9, p. 18

By:

Richards, Michael J.

Publication type:

Article

MODELING THE DOUBLE WELL POTENTIAL CONFIGURATION OF TI +4 : A FIRST STEP TOWARD A TRANSVERSE ISING MODEL FOR BST.

Published in:

Integrated Ferroelectrics, 2005, v. 71, n. 1, p. 161, doi. 10.1080/10584580590964600

By:

CROWNE, FRANK;
POTREPKA, DANIEL;
TIDROW, STEVEN

Publication type:

Article

Understanding Thickness Effects in Thin Film Capacitors.

Published in:

Integrated Ferroelectrics, 2004, v. 61, n. 1, p. 51, doi. 10.1080/10584580490458856

By:

Lookman, A.;
Bowman, R. M.;
Gregg, J. M.;
Scott, J. F.;
Dawber, Matt;
Ruediger, A.

Publication type:

Article

Investigation of the High Frequency Properties of BST Thin Films--A Comparison of Three Different Commonly Used Methods.

Published in:

Integrated Ferroelectrics, 2003, v. 53, n. 1, p. 455, doi. 10.1080/10584580390258624

By:

Tappe, S.;
Böttger, U.;
Waser, R.

Publication type:

Article

The Robin problem for singular p(x)-Laplacian equation in a cone.

Published in:

Electronic Journal of Qualitative Theory of Differential Equations, 2018, p. 1, doi. 10.14232/ejqtde.2018.1.93

By:

Borsuk, Mikhail

Publication type:

Article

A Test Procedure for Boundary Scan Circuitry in PLDs and FPGAs.

Published in:

International Arab Journal of Information Technology (IAJIT), 2010, v. 7, n. 2, p. 124

By:

Al-Khalifa, Bashar

Publication type:

Article

A Discrete Adjoint Variable Method for Printed-Circuit Board Computer-Aided Design.

Published in:

INFORMS Journal on Computing, 2006, v. 18, n. 2, p. 186, doi. 10.1287/ijoc.1050.0138

By:

Ali, Shirook M.;
Nikolova, Natalia K.;
Bakr, Mohamed H.

Publication type:

Article

Dielectric Abnormities in Ba0.6Sr0.4TiO3–MgAl2O4 Composite Ceramics.

Published in:

Journal of the American Ceramic Society, 2008, v. 91, n. 10, p. 3258, doi. 10.1111/j.1551-2916.2008.02607.x

By:

Jingji Zhang;
Jiwei Zhai;
Xiujian Chou;
Xi Yao

Publication type:

Article

Works matching DE "BOUNDARY scan testing"

Tunable Dual Band Filter with BST Capacitors.

Improved Mechanisms for Excellent Tunable Microwave Ce and Mn Codoped Ba 0.6 Sr 0.4 TiO 3 Thin Films.

Influence of Film Thickness on Dielectric Properties of Y and Mn Alternately Doped BST Films.

CHARACTERIZATION AND FIRST PRINCIPLE STUDIES ON Pb-SUBSTITUTED (Ba,Sr)TiO3 CERAMICS.

STRUCTURAL AND ELECTRICAL PROPERTIES OF (Ba x Sr 1-x )TiO 3 THIN FILMS PREPARED BY A SOL-GEL METHOD.

Toward building full-system EMI verification and early design flows through full-wave electromagnetic simulation.

Optimization of Boundary Scan Tests Using FPGA-Based Efficient Scan Architectures.

Application of Contactless Testing to PCBs with BGAs and Open Sockets.

Contactless Testing of Circuit Interconnects.

Current State of the Mixed-Signal Test Bus 1149.4.

A New Algorithm for the Selection of Control Cells in Boundary-Scan Interconnect Test.

Thermal conductivity of skutterudite CoSb<sub>3</sub> from first principles: Substitution and nanoengineering effects.

Appling a Novel Cost Function to Hopfield Neural Network for Defects Boundaries Detection of Wood Image.

Boundary scan pioneers go deep.

The life-cycle aspect of boundary scan.

JTAG Controller with WLAN Interface.

Embedded Test Complements Boundary Scan.

Paul's Picks.

Three Degrees of Board Testing.

PAUL'S PICKS.

Integrating Boundary Scan With Various ATE.

What Problems Can Boundary Scan Solve?

DFT Features Evaluated Before Prototyping.

Testability Beyond JTAG.

Boundary Scan and Processor Emulation Achieve Synergy.

Testing: Boundary Scan Style.

New Products.

PCB Testing Goes Socketless.

Reducing the Cost of Test With Boundary Scan.

Boundary Scan for Mixed-Signal Controller Cards.

MODELING THE DOUBLE WELL POTENTIAL CONFIGURATION OF TI +4 : A FIRST STEP TOWARD A TRANSVERSE ISING MODEL FOR BST.

Understanding Thickness Effects in Thin Film Capacitors.

Investigation of the High Frequency Properties of BST Thin Films--A Comparison of Three Different Commonly Used Methods.

The Robin problem for singular p(x)-Laplacian equation in a cone.

A Test Procedure for Boundary Scan Circuitry in PLDs and FPGAs.

A Discrete Adjoint Variable Method for Printed-Circuit Board Computer-Aided Design.

Dielectric Abnormities in Ba<sub>0.6</sub>Sr<sub>0.4</sub>TiO<sub>3</sub>–MgAl<sub>2</sub>O<sub>4</sub> Composite Ceramics.