Works matching DE "INTEGRATED circuits"
Results: 5000
Theoretical Analysis of Efficient Thermo-Optic Switching on Si 3 N 4 Waveguide Platform Using SiOC-Based Plasmo-Photonics.
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- Nanomaterials (2079-4991), 2025, v. 15, n. 4, p. 296, doi. 10.3390/nano15040296
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- Article
A Method for Grading Failure Rates Within the Dynamic Effective Space of Integrated Circuits After Testing.
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- Applied Sciences (2076-3417), 2025, v. 15, n. 4, p. 2009, doi. 10.3390/app15042009
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- Article
Research Progress in In Vitro Screening Techniques for Natural Antithrombotic Medicines.
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- Pharmaceuticals (14248247), 2025, v. 18, n. 2, p. 137, doi. 10.3390/ph18020137
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- Article
Inductor-Based Active Balancing Topology with Wide Voltage Range Capability.
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- Batteries, 2025, v. 11, n. 2, p. 77, doi. 10.3390/batteries11020077
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- Article
Recent Advances in Homogeneous Integration of Emitting Structures on a Silicon Platform.
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- Photonics, 2025, v. 12, n. 2, p. 141, doi. 10.3390/photonics12020141
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- Article
Assessment of the Prediction Accuracy of Genomic Selection for Rice Amylose Content and Gel Consistency.
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- Agronomy, 2025, v. 15, n. 2, p. 336, doi. 10.3390/agronomy15020336
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- Article
Molecular Marker-Assisted Breeding and Seed Production Techniques for Shenyou R3, a New Premium Aromatic Hybrid Japonica Rice.
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- Agronomy, 2025, v. 15, n. 2, p. 317, doi. 10.3390/agronomy15020317
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Correction: A CryStAl-RDF technique-based integrated circuit topology for fast charging station of electric vehicle (EV).
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- 2025
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- Correction Notice
Chemical Compatibility of Li 1.3 Al 0.3 Ti 1.7 (PO 4) 3 Solid-State Electrolyte Co-Sintered with Li 4 Ti 5 O 12 Anode for Multilayer Ceramic Lithium Batteries.
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- Materials (1996-1944), 2025, v. 18, n. 4, p. 851, doi. 10.3390/ma18040851
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- Article
Contrastive Learning with Global and Local Representation for Mixed-Type Wafer Defect Recognition.
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- Sensors (14248220), 2025, v. 25, n. 4, p. 1272, doi. 10.3390/s25041272
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- Article
Tessling on My Brain: The Future of Lie Detection and Brain Privacy in the Criminal Justice System.
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- Canadian Journal of Criminology & Criminal Justice, 2008, v. 50, n. 3, p. 367, doi. 10.3138/cjccj.50.3.367
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- Article
Where are they now?
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- Solid State Technology, 2001, v. 44, n. 11, p. 32
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- Article
A new paradigm for evaluating IC yield loss.
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- Solid State Technology, 2001, v. 44, n. 10, p. 47
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- Article
Brittlestar eyes: Key to future microlenses?
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- Solid State Technology, 2001, v. 44, n. 10, p. 28
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- Article
Higher-density packaging innovations continue.
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- Solid State Technology, 2001, v. 44, n. 10, p. 28
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- Article
Is chipmaking skill still a differentiator?
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- 2001
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- Editorial
Cycle time, 300mm in spotlight at automation conference.
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- Solid State Technology, 2001, v. 44, n. 8, p. 34
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- Article
Patented IC measures time to trillionths of a second.
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- Solid State Technology, 2001, v. 44, n. 8, p. 28
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SMIF Integration and mini-environments cause users most grief.
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- Solid State Technology, 2001, v. 44, n. 8, p. 20
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- Article
WORLDWIDE HIGHLIGHTS.
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- Solid State Technology, 2001, v. 44, n. 8, p. 18
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- Article
Economics will dictate the future.
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- 2001
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- Editorial
Safety solutions for high-pressure gas cylinders.
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- Solid State Technology, 2001, v. 44, n. 7, p. 153
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- Article
Better EDA tool integration needed for growing SoC market.
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- Solid State Technology, 2001, v. 44, n. 7, p. 58
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- Article
Chipmakers to compete with assembly houses for SiP.
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- Solid State Technology, 2001, v. 44, n. 7, p. 51
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- Article
System-on-a-chip challenged by stacked system-in-a-package technology*.
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- Solid State Technology, 2001, v. 44, n. 7, p. 48
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Floating 3-D display seemingly out of sci-fi.
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- Solid State Technology, 2001, v. 44, n. 6, p. 28
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- Article
2001": The 'make or break' year for 300mm wafer transition goals.
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- Solid State Technology, 2001, v. 44, n. 5, p. 174
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- Article
IBM, MOSIS get SiGe wit it.
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- Solid State Technology, 2001, v. 44, n. 5, p. 28
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- Article
Advanced IC packaging: Markets and trends.
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- Solid State Technology, 2001, v. 44, n. 4, p. 44
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Meeting ITRS Roadmap challenges with low-kappa dielectric etching.
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- Solid State Technology, 2001, v. 44, n. 3, p. 107
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Communicant Semiconductor Technologies.
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- Solid State Technology, 2001, v. 44, n. 3, p. 46
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- Article
Integrating backend processes.
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- Solid State Technology, 2001, v. 44, n. 2, p. 78
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- Article
Emergence of atomic layer processes.
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- Solid State Technology, 2001, v. 44, n. 1, p. 70
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Schlumberger makes progress in flip chip probing.
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- Solid State Technology, 2001, v. 44, n. 1, p. 36
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Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits.
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- Solid State Technology, 2000, v. 43, n. 11, p. 125
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- Article
Broadening the platforms for system-in-package solutions.
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- Solid State Technology, 2000, v. 43, n. 11, p. 115
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- Article
Defects from substrate particles depend on the sputter deposition process.
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- Solid State Technology, 2000, v. 43, n. 11, p. 95
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- Article
System-on-a-chip: Not as easy as it looks.
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- 2000
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- Editorial
A re-examination of silicon wafer specifications.
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- Solid State Technology, 2000, v. 43, n. 10, p. 210
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- Article
The SiGe IC market in a wireless, broadband world.
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- Solid State Technology, 2000, v. 43, n. 9, p. 59
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SOC devices spur ASIC market growth.
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- Solid State Technology, 2000, v. 43, n. 8, p. 48
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Analysis improves thermal control of heated chucks for IC processing.
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- Solid State Technology, 2000, v. 43, n. 7, p. 271
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System-on-a-chip: What industry needs to do.
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- Solid State Technology, 2000, v. 43, n. 3, p. 142
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Pentacene organic thin-film transistors and ICs.
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- Solid State Technology, 2000, v. 43, n. 3, p. 63
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Spin-etch planarization for dual damascene interconnect structures.
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- Solid State Technology, 2000, v. 43, n. 3, p. 53
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- Article
Fab Trends: Are Europe and Asia leading the way?
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- Solid State Technology, 2000, v. 43, n. 3, p. 8
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Advent of SOCs thwarted: Panelists cite packaging standards testing costs.
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- Solid State Technology, 2000, v. 43, n. 2, p. 36
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- Article
IEDM 1999 focused on CMOS solutions.
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- Solid State Technology, 2000, v. 43, n. 2, p. 30
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Moore's Law--the z dimension.
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- Solid State Technology, 2000, v. 43, n. 1, p. 84
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Microelectronics' nanotechnology future.
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- Solid State Technology, 2000, v. 43, n. 1, p. 63
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- Article