Works matching IS 0038111X AND DT 2000 AND VI 43 AND IP 8
Results: 43
Moore's Law switching to a subwavelength track.
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- Solid State Technology, 2000, v. 43, n. 8, p. 184
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- Article
NEW LITERATURE.
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- Solid State Technology, 2000, v. 43, n. 8, p. 155
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Software.
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- Solid State Technology, 2000, v. 43, n. 8, p. 152
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Lithography.
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- Solid State Technology, 2000, v. 43, n. 8, p. 152
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Materials.
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- Solid State Technology, 2000, v. 43, n. 8, p. 152
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Vacuum Equipment.
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- Solid State Technology, 2000, v. 43, n. 8, p. 151
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- Article
Gases/Gas Handling.
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- Solid State Technology, 2000, v. 43, n. 8, p. 151
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Failure Analysis.
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- Solid State Technology, 2000, v. 43, n. 8, p. 148
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- Article
Chemicals/Chemical Handling.
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- Solid State Technology, 2000, v. 43, n. 8, p. 148
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- Article
Metrology.
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- Solid State Technology, 2000, v. 43, n. 8, p. 146
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- Article
Packaging/Assembly/Test.
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- Solid State Technology, 2000, v. 43, n. 8, p. 142
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Contamination Control.
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- Solid State Technology, 2000, v. 43, n. 8, p. 140
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- Article
Hardware/Accessories.
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- Solid State Technology, 2000, v. 43, n. 8, p. 140
- Publication type:
- Article
Process Equipment.
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- Solid State Technology, 2000, v. 43, n. 8, p. 138
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- Article
Process control for copper electrodeposition.
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- Solid State Technology, 2000, v. 43, n. 8, p. 136
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- Article
Multi-application die bonding platform.
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- Solid State Technology, 2000, v. 43, n. 8, p. 136
- Publication type:
- Article
Benchtop stylus profiler.
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- Solid State Technology, 2000, v. 43, n. 8, p. 136
- Publication type:
- Article
300/200mm RTP tool.
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- Solid State Technology, 2000, v. 43, n. 8, p. 136
- Publication type:
- Article
PECVD system for dialectric films.
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- Solid State Technology, 2000, v. 43, n. 8, p. 135
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- Article
High-speed defect detection system.
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- Solid State Technology, 2000, v. 43, n. 8, p. 135
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- Article
Universal CMP system.
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- Solid State Technology, 2000, v. 43, n. 8, p. 135
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- Article
Low-energy ion implant.
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- Solid State Technology, 2000, v. 43, n. 8, p. 135
- Publication type:
- Article
Substrates with topography.
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- Solid State Technology, 2000, v. 43, n. 8, p. 127
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Monitor wet clean recovery.
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- Solid State Technology, 2000, v. 43, n. 8, p. 117
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Beneath the MEEF.
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- Solid State Technology, 2000, v. 43, n. 8, p. 107
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PEB process in a CA resist.
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- Solid State Technology, 2000, v. 43, n. 8, p. 95
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Control metals in furnaces.
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- Solid State Technology, 2000, v. 43, n. 8, p. 83
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Real-time trace gas detection.
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- Solid State Technology, 2000, v. 43, n. 8, p. 71
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Low-k dialectric metrology.
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- Solid State Technology, 2000, v. 43, n. 8, p. 55
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- Article
SOC devices spur ASIC market growth.
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- Solid State Technology, 2000, v. 43, n. 8, p. 48
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Mitsui to double production of NF[sub 3].
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- Solid State Technology, 2000, v. 43, n. 8, p. 44
- Publication type:
- Article
TSMC's Fab 6 capabilities.
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- Solid State Technology, 2000, v. 43, n. 8, p. 44
- Publication type:
- Article
Sumitomo hikes production and spending; Canon and Nikon increase stepper production.
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- Solid State Technology, 2000, v. 43, n. 8, p. 44
- Publication type:
- Article
S. Korea's Hyundai to concentrate on chip foundry business.
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- Solid State Technology, 2000, v. 43, n. 8, p. 42
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1st Silicon plans production ramp.
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- Solid State Technology, 2000, v. 43, n. 8, p. 42
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Euro Briefs.
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- Solid State Technology, 2000, v. 43, n. 8, p. 38
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SOITEC plans 300mm SOI production.
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- Solid State Technology, 2000, v. 43, n. 8, p. 38
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Philips to by IBM MiCRUS fab.
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- Solid State Technology, 2000, v. 43, n. 8, p. 36
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- Article
BASF sees 20% shortfall in hydroxylamine supply.
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- Solid State Technology, 2000, v. 43, n. 8, p. 36
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Mattson plans to acquire STEAG unit, CFM.
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- Solid State Technology, 2000, v. 43, n. 8, p. 36
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TECHNOLOGY NEWS.
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- Solid State Technology, 2000, v. 43, n. 8, p. 26
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WORLD NEWS.
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- Solid State Technology, 2000, v. 43, n. 8, p. 16
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Design and chip fabrication need to be linked.
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- Solid State Technology, 2000, v. 43, n. 8, p. 12
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