Works matching IS 0038111X AND DT 2000 AND VI 43 AND IP 7

Results: 27

Thermal-mechanical stress analysis of a silicon-based system-in-a-package.

Published in:

Solid State Technology, 2000, v. 43, n. 7, p. 279

By:

Goetz, Martin P.

Publication type:

Article

Liners for tungsten plug applications with long throw and ionized PVD.

Published in:

Solid State Technology, 2000, v. 43, n. 7, p. 183

By:

Butler, D. C.;
Buchanan, Keith;
Burgess, Stephen R.;
Urbansky, N.;
Schmidbauer, S.

Publication type:

Article

Excimer lasers for future lithography light sources.

Published in:

Solid State Technology, 2000, v. 43, n. 7, p. 255

By:

Semprez, Olivier

Publication type:

Article

Space charge effects in e-beam projection lithography.

Published in:

Solid State Technology, 2000, v. 43, n. 7, p. 241

By:

Mkrtchyan, Masis;
Liddle, J. Alexander;
Harriott, Lloyd R.;
Munro, Eric

Publication type:

Article

SECS is overrated.

Published in:

Solid State Technology, 2000, v. 43, n. 7, p. 349

By:

Baylis, Charles

Publication type:

Article

NEW LITERATURE.

Published in:: Solid State Technology, 2000, v. 43, n. 7, p. 333
Publication type:: Article

PRODUCT PANORAMA.

Published in:: Solid State Technology, 2000, v. 43, n. 7, p. 295
Publication type:: Article

Correlation of FT-IR epitaxial thickness measurement.

Published in:

Solid State Technology, 2000, v. 43, n. 7, p. 289

By:

Kostoulas, Yiorgos;
Kneissl, Gerhart;
Kohl, Ian

Publication type:

Article

Thermal processing in a single wafer rapid thermal furnace.

Published in:

Solid State Technology, 2000, v. 43, n. 7, p. 223

By:

Yoo, Woo Sik;
Yamazaki, Taro;
Enjoji, Keiichi

Publication type:

Article

Analysis improves thermal control of heated chucks for IC processing.

Published in:

Solid State Technology, 2000, v. 43, n. 7, p. 271

By:

Strehlow, Russell

Publication type:

Article

The semiconductor industry's SEMI standard GUI.

Published in:

Solid State Technology, 2000, v. 43, n. 7, p. 263

By:

Jipp, Shawn;
Summers, Frank

Publication type:

Article

Processing for advanced devices with hot-wall furnace RTP.

Published in:

Solid State Technology, 2000, v. 43, n. 7, p. 211

By:

Osborne, Nick;
Laser, Allan;
Rust, Werner

Publication type:

Article

Process development and monitoring with atomic force profiling for CMP.

Published in:

Solid State Technology, 2000, v. 43, n. 7, p. 167

By:

Cunningham, Tim;
Todd, Brad;
Kalpathy-Cramer, Jayashree;
Kirchner, Eric;
Berman, Michael

Publication type:

Article

In situ steam generation: A new rapid thermal oxidation technique.

Published in:

Solid State Technology, 2000, v. 43, n. 7, p. 233

By:

Kuppurao, Satheesh;
Joo, Hyun Sung;
Miner, Gary

Publication type:

Article

The effect of sub-0.1Mu m filtration on 248nm photoresist performance.

Published in:

Solid State Technology, 2000, v. 43, n. 7, p. 202

By:

Gotlinsky, Barry;
Mesawich, Michael;
Beach, James

Publication type:

Article

Progress for characterization and Advanced reticle repair.

Published in:

Solid State Technology, 2000, v. 43, n. 7, p. 195

By:

Morgan, John;
Morrison, Troy

Publication type:

Article

TCAD physical verification for reticle enhancement techniques.

Published in:

Solid State Technology, 2000, v. 43, n. 7, p. 134

By:

Rieger, Mike;
Stirniman, John

Publication type:

Article

Chromeless phase-shift masks used for sub-100nm SOI CMOS transistors.

Published in:

Solid State Technology, 2000, v. 43, n. 7, p. 116

By:

Fritze, Michael;
Astolfi, David K.;
Yost, Donna-Ruth W.;
Wyatt, Peter W.;
Liu, Hua-Yu

Publication type:

Article

An integrated etch approach as STI evolves for the 100nm regime.

Published in:

Solid State Technology, 2000, v. 43, n. 7, p. 157

By:

Lassig, Steve;
Xu, C. Shan;
Miller, Alan J.;
Kamath, Sanjay;
Romano, Andy;
Kudo, Takanori

Publication type:

Article

Modified pump, trap system cuts down PECVD maintenance.

Published in:

Solid State Technology, 2000, v. 43, n. 7, p. 147

By:

Fancourt, Peter;
Ishaq, Sajid;
Czerniak, Mike

Publication type:

Article

Noncontact megasonics for post-Cu CMP cleaning.

Published in:

Solid State Technology, 2000, v. 43, n. 7, p. 105

By:

Fraser, Brian;
Rafie, Sana;
Eissa, Mona;
Joshi, Somit

Publication type:

Article

Factors influencing damascene feature fill using copper PVD and electroplating.

Published in:

Solid State Technology, 2000, v. 43, n. 7, p. 86

By:

Reid, Jan;
Mayer, Steve;
Broadbent, Eliot;
Klawuhn, Erich;
Ashtiani, Kaihan

Publication type:

Article

Improving the forecasts.

Published in:

Solid State Technology, 2000, v. 43, n. 7, p. 72

By:

Schumann, Elizabeth

Publication type:

Article

ASIAFOCUS.

Published in:: Solid State Technology, 2000, v. 43, n. 7, p. 62
Publication type:: Article

EUROFOCUS.

Published in:: Solid State Technology, 2000, v. 43, n. 7, p. 56
Publication type:: Article

TECHNOLOGY NEWS.

Published in:: Solid State Technology, 2000, v. 43, n. 7, p. 36
Publication type:: Article

WORLD NEWS.

Published in:: Solid State Technology, 2000, v. 43, n. 7, p. 16
Publication type:: Article