Works matching Bonding
Results: 5000
Computational insights into halogen bonding between P&bond;Cl contact and several electron donors.
- Published in:
- International Journal of Quantum Chemistry, 2010, v. 110, n. 6, p. 1245, doi. 10.1002/qua.22228
- By:
- Publication type:
- Article
Thermosonic Bonding of Gold Wire onto Silver Bonding Layer on the Bond Pads of Chips with Copper Interconnects.
- Published in:
- Journal of Electronic Materials, 2006, v. 35, n. 9, p. 1693, doi. 10.1007/s11664-006-0220-z
- By:
- Publication type:
- Article
Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application.
- Published in:
- Nanomaterials (2079-4991), 2023, v. 13, n. 17, p. 2490, doi. 10.3390/nano13172490
- By:
- Publication type:
- Article
Investigation of mycelium film as the adhesive for poplar veneer bonding: insight into interfacial bonding mechanisms.
- Published in:
- Wood Material Science & Engineering, 2025, v. 20, n. 1, p. 31, doi. 10.1080/17480272.2024.2321602
- By:
- Publication type:
- Article
Hydrogen Bonding vs Dihydrogen Bonding in the Air Stable Primary Phosphine ortho‐Phosphinophenol.
- Published in:
- European Journal of Inorganic Chemistry, 2024, v. 27, n. 25, p. 1, doi. 10.1002/ejic.202400260
- By:
- Publication type:
- Article
No-primer adhesive vs. self-adhesive resin: bonding strength following LED curing.
- Published in:
- Journal of Orofacial Orthopedics/Fortschritte der Kieferorthopadie, 2022, v. 83, n. 2, p. 141, doi. 10.1007/s00056-021-00340-z
- By:
- Publication type:
- Article
NMR and FTIR studies of coordinate-bonding and intramolecular and intermolecular hydrogen bonding in zinc(II)(3,5-diisopropylsalicylate)2.
- Published in:
- Journal of Coordination Chemistry, 2008, v. 61, n. 18, p. 2861, doi. 10.1080/00958970802087086
- By:
- Publication type:
- Article
Effect of Au Film Thickness and Surface Roughness on Room-Temperature Wafer Bonding and Wafer-Scale Vacuum Sealing by Au-Au Surface Activated Bonding.
- Published in:
- Micromachines, 2020, v. 11, n. 5, p. 454, doi. 10.3390/mi11050454
- By:
- Publication type:
- Article
Bonding-Based Wafer-Level Vacuum Packaging Using Atomic Hydrogen Pre-Treated Cu Bonding Frames.
- Published in:
- Micromachines, 2018, v. 9, n. 4, p. 181, doi. 10.3390/mi9040181
- By:
- Publication type:
- Article
Fusible Systems for Bonding.
- Published in:
- Textile Chemist & Colorist, 1969, v. 1, n. 27, p. 43
- By:
- Publication type:
- Article
Comparison of Bonding Time and Shear Bond Strength Between a Conventional and a New Integrated Bonding System.
- Published in:
- Angle Orthodontist, 2005, v. 75, n. 2, p. 237
- By:
- Publication type:
- Article
Effect of Si Concentration of a Brazing Precursor on the Bonding Strength of Aluminum Foam Bonded via Foaming Bonding.
- Published in:
- Materials Transactions, 2021, v. 62, n. 8, p. 1210, doi. 10.2320/matertrans.MT-M2020393
- By:
- Publication type:
- Article
Interfacial Bonding and Fracture Behaviors of AZ63 Magnesium Alloy Sheet Processed by Accumulative Roll Bonding.
- Published in:
- Materials (1996-1944), 2023, v. 16, n. 14, p. 4981, doi. 10.3390/ma16144981
- By:
- Publication type:
- Article
Some thoughts on bondability and strength of gold wire bonding.
- Published in:
- Gold Bulletin, 2012, v. 45, n. 3, p. 115, doi. 10.1007/s13404-012-0060-y
- By:
- Publication type:
- Article
OPTIMAL BONDING CONDITIONS FOR DIFFUSION BONDING OF ALUMINUM METAL MATRIX COMPOSITES USING TAGUCHI BASED RESPONSE SURFACE METHODOLOGY.
- Published in:
- Journal of the Balkan Tribological Association, 2016, v. 22, n. 3-I, p. 2437
- By:
- Publication type:
- Article
Geometrical Effects on Ultrasonic Al Bump Direct Bonding for Microsystem Integration: Simulation and Experiments.
- Published in:
- Micromachines, 2021, v. 12, n. 7, p. 750, doi. 10.3390/mi12070750
- By:
- Publication type:
- Article
Role of Thin Sn Layer for Low Temperature Al‐Al Thermo‐compression Bonding of Wafer‐Level Hermetic Sealing.
- Published in:
- Electronics & Communications in Japan, 2018, v. 101, n. 5, p. 33, doi. 10.1002/ecj.12060
- By:
- Publication type:
- Article
Highly Active Halogen Bonding and Chalcogen Bonding Chloride Transporters with Non‐Protonophoric Activity.
- Published in:
- Chemistry - A European Journal, 2021, v. 27, n. 45, p. 11738, doi. 10.1002/chem.202101681
- By:
- Publication type:
- Article
Modelling and analysis of the bonding mechanism of CBN grains for electroplated superabrasive tools-part 1: introduction and application of a novel approach for determining the bonding force and the failure modes.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2015, v. 76, n. 9-12, p. 2051, doi. 10.1007/s00170-014-6411-5
- By:
- Publication type:
- Article
Development of Bonding Mechanisms for Different Materials During Forming.
- Published in:
- Metallurgist, 2017, v. 60, n. 11/12, p. 1175, doi. 10.1007/s11015-017-0424-x
- By:
- Publication type:
- Article
Comparative study on the nonadditivity of methyl group in lithium bonding and hydrogen bonding.
- Published in:
- International Journal of Quantum Chemistry, 2009, v. 109, n. 5, p. 1127, doi. 10.1002/qua.21929
- By:
- Publication type:
- Article
σ-Hole bonding and hydrogen bonding: Competitive interactions.
- Published in:
- International Journal of Quantum Chemistry, 2007, v. 107, n. 15, p. 3046, doi. 10.1002/qua.21419
- By:
- Publication type:
- Article
Al-Ge Diffusion Bonding for Hermetic Sealing Application.
- Published in:
- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2387, doi. 10.1007/s11664-015-3683-y
- By:
- Publication type:
- Article
Diffusion bonding systems.
- Published in:
- Materialwissenschaft und Werkstoffechnik, 2014, v. 45, n. 9, p. 807, doi. 10.1002/mawe.201400285
- By:
- Publication type:
- Article
The Role of Hydrogen Bonding and Halogen Bonding in the Polymorphic Structures of 3,5-Dibromo-2,6-diaminopyridinium Bromide.
- Published in:
- Journal of Chemical Crystallography, 2010, v. 40, n. 11, p. 902, doi. 10.1007/s10870-010-9760-4
- By:
- Publication type:
- Article
Taking the halogen bonding-hydrogen bonding competition one step further: complexes of difluoroiodomethane with trimethylphosphine, dimethyl sulfide and chloromethane.
- Published in:
- Acta Crystallographica Section B: Structural Science, Crystal Engineering & Materials, 2017, v. 73, n. 2, p. 168, doi. 10.1107/S2052520617001354
- By:
- Publication type:
- Article
Ultrasonic bonding of Cu/Ni and its thermal reliability.
- Published in:
- Welding International, 2015, v. 29, n. 4, p. 270, doi. 10.1080/09507116.2014.921047
- By:
- Publication type:
- Article
Interfacial bonding mechanism and bonding strength of AlTiCrN coating by cathodic arc ion plating.
- Published in:
- Surface & Interface Analysis: SIA, 2015, v. 47, n. 2, p. 198, doi. 10.1002/sia.5688
- By:
- Publication type:
- Article
Comparison of shear bond strength and bonding time of a novel flash-free bonding system.
- Published in:
- Angle Orthodontist, 2016, v. 86, n. 2, p. 265, doi. 10.2319/011715-37.1
- By:
- Publication type:
- Article
Redox‐Active Triazole‐Derived Mesoionic Imines with Ferrocenyl Substituents and their Metal Complexes: Directed Hydrogen‐Bonding, Unusual C−H Activation and Ion‐Pair Formation.
- Published in:
- Chemistry - A European Journal, 2024, v. 30, n. 35, p. 1, doi. 10.1002/chem.202400730
- By:
- Publication type:
- Article
Halogen Bonding Tripodal Metallo‐Receptors for Phosphate Recognition and Sensing in Aqueous‐Containing Organic Media.
- Published in:
- Chemistry - A European Journal, 2024, v. 30, n. 2, p. 1, doi. 10.1002/chem.202302775
- By:
- Publication type:
- Article
Anion Sensing through Redox‐Modulated Fluorescent Halogen Bonding and Hydrogen Bonding Hosts**.
- Published in:
- Angewandte Chemie, 2024, v. 136, n. 6, p. 1, doi. 10.1002/ange.202315959
- By:
- Publication type:
- Article
Deciphering the Primary Role of Au⋅⋅⋅H−X Hydrogen Bonding in Gold Catalysis.
- Published in:
- Angewandte Chemie, 2023, v. 135, n. 41, p. 1, doi. 10.1002/ange.202310314
- By:
- Publication type:
- Article
Halogen Bonding in Dithiane/Iodofluorobenzene Mixtures: A New Class of Hydrophobic Deep Eutectic Solvents.
- Published in:
- Angewandte Chemie, 2021, v. 133, n. 42, p. 23165, doi. 10.1002/ange.202110520
- By:
- Publication type:
- Article
Room Temperature Wafer Bonding of Glass Using Aluminum Oxide Intermediate Layer.
- Published in:
- Advanced Materials Interfaces, 2021, v. 8, n. 5, p. 1, doi. 10.1002/admi.202001741
- By:
- Publication type:
- Article
Wafer Bonding: Solution‐Processed‐ZnO‐Mediated Semiconductor Bonding with High Mechanical Stability, Electrical Conductivity, Optical Transparency, and Roughness Tolerance (Adv. Mater. Interfaces 22/2019).
- Published in:
- Advanced Materials Interfaces, 2019, v. 6, n. 22, p. N.PAG, doi. 10.1002/admi.201970137
- By:
- Publication type:
- Article
Laser Drop on Demand Micro Joining for High Temperature Wire Bonding Applications – System Technology And Mechanical Joint Performance.
- Published in:
- Journal of Laser Micro / Nanoengineering, 2017, v. 12, n. 3, p. 239, doi. 10.2961/jlmn.2017.03.0012
- By:
- Publication type:
- Article
Roles of Hydrogen, Halogen Bonding and Aromatic Stacking in a Series of Isophthalamides.
- Published in:
- Symmetry (20738994), 2023, v. 15, n. 3, p. 738, doi. 10.3390/sym15030738
- By:
- Publication type:
- Article
SYNTHESIS AND CHARACTERIZATION OF WELL-DEFINED BLOCK COPOLYMERS CONTAINING PENDANT, SELF-COMPLEMENTARY QUADRUPLE HYDROGEN BONDING SITES.
- Published in:
- Chinese Journal of Polymer Science (World Scientific Publishing Company), 2008, v. 26, n. 6, p. 767, doi. 10.1142/S0256767908003527
- By:
- Publication type:
- Article
Effects of post heat treatment on 5052Al and 6063 aluminium joints during pulsed electric current bonding.
- Published in:
- Welding International, 2011, v. 25, n. 3, p. 159, doi. 10.1080/09507111003655473
- By:
- Publication type:
- Article
An in vitro study to evaluate the effect of two ethanol-based and two acetone-based dental bonding agents on the bond strength of composite to enamel treated with 10% carbamide peroxide.
- Published in:
- Journal of the Indian Society of Pedodontics & Preventive Dentistry, 2014, v. 32, n. 3, p. 207, doi. 10.4103/0970-4388.135826
- By:
- Publication type:
- Article
超声波键合压力自适应平衡装置设计与实验研究.
- Published in:
- China Mechanical Engineering, 2023, v. 34, n. 16, p. 2009, doi. 10.3969/j.issn.l004-132X.2023.16.015
- By:
- Publication type:
- Article
木材表面初始损伤对 CFRP-木材界面 粘结性能的影响.
- Published in:
- Acta Materiae Compositae Sinica, 2023, v. 40, n. 8, p. 4720, doi. 10.13801/j.cnki.fhclxb.20221014.003
- By:
- Publication type:
- Article
BFRP 网格布对超高性能混凝土粘结性能的 影响.
- Published in:
- Acta Materiae Compositae Sinica, 2023, v. 40, n. 6, p. 3473, doi. 10.13801/j.cnki.fhclxb.20220819.002
- By:
- Publication type:
- Article
合成粗聚丙烯纤维与水泥砂浆界面 黏结力学性能.
- Published in:
- Acta Materiae Compositae Sinica, 2023, v. 40, n. 4, p. 2427, doi. 10.13801/j.cnki.fhclxb.20220624.001
- By:
- Publication type:
- Article
工程水泥基复合材料与发泡式聚苯乙烯 保温板的界面粘结性能.
- Published in:
- Acta Materiae Compositae Sinica, 2022, v. 39, n. 11, p. 5251, doi. 10.13801/j.cnki.fhclxb.20220215.002
- By:
- Publication type:
- Article
三类典型纳米增强相对多尺度复合材料界面 黏结性能影响的力学模型.
- Published in:
- Acta Materiae Compositae Sinica, 2021, v. 38, n. 11, p. 3714, doi. 10.13801/j.cnki.fhclxb.20210119.003
- By:
- Publication type:
- Article
Halogen and Hydrogen Bonding Benzothiophene Diol Derivatives: A Study Using ab initio Calculations and X-Ray Crystal Structure Measurements.
- Published in:
- ChemistryOpen, 2015, v. 4, n. 2, p. 161, doi. 10.1002/open.201402087
- By:
- Publication type:
- Article
Effects of Chemical Cross-linkers on Caries-affected Dentin Bonding.
- Published in:
- Journal of Dental Research, 2009, v. 88, n. 12, p. 1096, doi. 10.1177/0022034509351001
- By:
- Publication type:
- Article
N-phenyliminodiacetic Acid as an Etchant/Primer for Dentin Bonding.
- Published in:
- Journal of Dental Research, 1997, v. 76, n. 1, p. 602, doi. 10.1177/00220345970760011201
- By:
- Publication type:
- Article