Works matching IS 0038111X AND DT 2000 AND VI 43 AND IP 6
Results: 36
The role of partnership in today's quality programs.
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- Solid State Technology, 2000, v. 43, n. 6, p. 282
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Sensor and actuator bus networks for better OEE.
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- Solid State Technology, 2000, v. 43, n. 6, p. 217
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In 300mm contamination control, watch out for electrostatic attraction.
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- Solid State Technology, 2000, v. 43, n. 6, p. 209
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Targeting water use for chemical mechanical polishing.
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- Solid State Technology, 2000, v. 43, n. 6, p. 201
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AFM's role in debug probing.
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- Solid State Technology, 2000, v. 43, n. 6, p. 195
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Accurate metrology of epi pattern shift.
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- Solid State Technology, 2000, v. 43, n. 6, p. 187
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New `green' heat transfer fluids.
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- Solid State Technology, 2000, v. 43, n. 6, p. 175
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Tracking down causes of DUV sub-pellicle defects.
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- Solid State Technology, 2000, v. 43, n. 6, p. 159
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Better cycle time and on-time delivery via real-time dispatching.
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- Solid State Technology, 2000, v. 43, n. 6, p. 151
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Measurement of carrier lifetime: Monitoring epitaxy quality.
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- Solid State Technology, 2000, v. 43, n. 6, p. 143
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Intelligent second-generation MES solutions for 300mm fabs.
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- Solid State Technology, 2000, v. 43, n. 6, p. 133
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Improved planarization for STI with fixed abrasive technology.
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- Solid State Technology, 2000, v. 43, n. 6, p. 123
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Modeling CMP for copper dual damascene interconnects.
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- Solid State Technology, 2000, v. 43, n. 6, p. 111
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Expanding capabilities in existing fabs with lithography tool-matching.
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- Solid State Technology, 2000, v. 43, n. 6, p. 97
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SOI wafers based on epitaxial technology.
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- Solid State Technology, 2000, v. 43, n. 6, p. 88
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CMP: Market trends and technology.
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- Solid State Technology, 2000, v. 43, n. 6, p. 67
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As markets zoom, Philips strengthens Asia presence.
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- Solid State Technology, 2000, v. 43, n. 6, p. 62
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Munich hosts upbeat SEMI Europa show.
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- Solid State Technology, 2000, v. 43, n. 6, p. 56
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French EUV development program under way.
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- Solid State Technology, 2000, v. 43, n. 6, p. 56
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Hot topics at MRS: low-k, dopant profiling, copper.
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- Solid State Technology, 2000, v. 43, n. 6, p. 50
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SC300 finds DUV problems.
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- Solid State Technology, 2000, v. 43, n. 6, p. 46
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TI votes for AMAT's Black Diamond CVD low-k; IBM uses SILK.
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- Solid State Technology, 2000, v. 43, n. 6, p. 46
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Extrusion coating considered applicable to 300mm wafers.
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- Solid State Technology, 2000, v. 43, n. 6, p. 44
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Motorola's SiGe:C process targets wireless.
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- Solid State Technology, 2000, v. 43, n. 6, p. 40
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UL to unveil fire standard for plastics.
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- Solid State Technology, 2000, v. 43, n. 6, p. 40
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Phase-shift masks challenge CDs.
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- Solid State Technology, 2000, v. 43, n. 6, p. 40
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Patterned phosphors enable electroluminescent display.
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- Solid State Technology, 2000, v. 43, n. 6, p. 38
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Industry Roadmap likely to be overtaken.
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- Solid State Technology, 2000, v. 43, n. 6, p. 36
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Gas purification enables SiGe production.
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- Solid State Technology, 2000, v. 43, n. 6, p. 34
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WORLDWIDE HIGHLIGHTS.
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- Solid State Technology, 2000, v. 43, n. 6, p. 18
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We need better factories.
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- Solid State Technology, 2000, v. 43, n. 6, p. 14
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Gate oxide breakdown mechanisms detailed, some cause for optimism.
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- Solid State Technology, 2000, v. 43, n. 6, p. 34
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Europe.
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- Solid State Technology, 2000, v. 43, n. 6, p. 30
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Asia Pacific.
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- Solid State Technology, 2000, v. 43, n. 6, p. 26
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Japan.
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- Solid State Technology, 2000, v. 43, n. 6, p. 24
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USA.
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- Solid State Technology, 2000, v. 43, n. 6, p. 20
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