Works matching DE "LEAD-free electronics manufacturing processes"
Results: 85
Thick film paste created for lead-free hybrid circuits.
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- Advanced Materials & Processes, 2005, v. 163, n. 12, p. 16
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- Article
A HYBRID METHOD FOR MECHANICAL TESTING OF ELECTRONIC PACKAGING.
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- Annals of DAAAM & Proceedings, 2009, p. 1045
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Molten hydroxide synthesis as an alternative to molten salt synthesis for producing KNaNbO lead free ceramics.
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- Journal of Materials Science, 2012, v. 47, n. 4, p. 1938, doi. 10.1007/s10853-011-5984-8
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BiFeO-modified (Li, K, Na)(Nb, Ta)O lead-free piezoelectric ceramics with temperature-stable piezoelectric property and enhanced mechanical strength.
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- Journal of Materials Science, 2012, v. 47, n. 4, p. 1767, doi. 10.1007/s10853-011-5957-y
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BiFeO<sub>3</sub>-doped (Na<sub>0.5</sub>K<sub>0.5</sub>)NbO<sub>3</sub> lead-free piezoelectric ceramics.
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- Science & Technology of Advanced Materials, 2008, v. 9, n. 2, p. 1, doi. 10.1088/1468-6996/9/2/025004
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- Article
Heterojunction-Depleted Lead-Free Perovskite Solar Cells with Coarse-Grained B-γ-CsSnI<sub>3</sub> Thin Films.
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- Advanced Energy Materials, 2016, v. 6, n. 24, p. n/a, doi. 10.1002/aenm.201601130
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- Article
DIELECTRIC PROPERTIES OF LEAD-FREE [(1-x)(Na0.5Bi0.5)-xBa]Zr1-yTiyO3 CERAMICS (x = 0.01, 0.06, 0.085, 0.09, 0.1 AND y = 0.96, 0.97).
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- Integrated Ferroelectrics, 2008, v. 102, n. 1, p. 62, doi. 10.1080/10584580802558092
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INFLUENCE OF MONOXIDES ADDITION ON SINTERING OF SODIUM-POTASSIUM NIOBATES SOLID SOLUTION.
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- Integrated Ferroelectrics, 2008, v. 102, n. 1, p. 69, doi. 10.1080/10584580802558134
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CHEMICAL SOLUTION DEPOSITION AND ELECTRICAL PROPERTIES OF (100)-PREDOMINANT BaTiO3 THICKER FILMS.
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- Integrated Ferroelectrics, 2007, v. 88, n. 1, p. 51, doi. 10.1080/10584580601098605
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What's Creeping Around in Your Data Center?
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- ASHRAE Transactions, 2010, v. 116, n. 1, p. 207
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- Article
Phase development, densification and dielectric properties of (0.95-x)Na<sub>0.5</sub>K<sub>0.5</sub>NbO<sub>3</sub> - 0.05LiTaO<sub>3</sub> - x LiSbO<sub>3</sub> lead-free piezoelectric ceramics.
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- Songklanakarin Journal of Science & Technology, 2008, v. 30, n. 6, p. 791
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Fracture Behavior of Sn-3.5Ag-0.7Cu and Pure Sn Solders as a Function of Applied Strain Rate.
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- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2519, doi. 10.1007/s11664-012-2180-9
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Whisker Formation Induced by Component and Assembly Ionic Contamination.
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- Journal of Electronic Materials, 2012, v. 41, n. 2, p. 204, doi. 10.1007/s11664-011-1808-5
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Evaluation of Diffusion Barrier Between Lead-Free Solder Systems and Thermoelectric Materials.
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- Journal of Electronic Materials, 2012, v. 41, n. 1, p. 153, doi. 10.1007/s11664-011-1740-8
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Thermodynamic Description of the Quaternary Ag-Cu-In-Sn System.
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- Journal of Electronic Materials, 2012, v. 41, n. 1, p. 86, doi. 10.1007/s11664-011-1757-z
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Effect of Constant and Cyclic Current Stressing on the Evolution of Intermetallic Compound Layers.
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- Journal of Electronic Materials, 2011, v. 40, n. 7, p. 1517, doi. 10.1007/s11664-011-1632-y
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Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates.
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- Journal of Electronic Materials, 2011, v. 40, n. 7, p. 1533, doi. 10.1007/s11664-011-1639-4
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Electrochemical Corrosion Behaviors of Sn-9Zn-3Bi- xCr Solder in 3.5% NaCl Solution.
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- Journal of Electronic Materials, 2011, v. 40, n. 7, p. 1556, doi. 10.1007/s11664-011-1650-9
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Characterizing the Mechanical Properties of Actual SAC105, SAC305, and SAC405 Solder Joints by Digital Image Correlation.
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- Journal of Electronic Materials, 2011, v. 40, n. 6, p. 1409, doi. 10.1007/s11664-011-1534-z
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Microstructure Changes and Physical Properties of the Intermetallic Compounds Formed at the Interface Between Sn-Cu Solders and a Cu Substrate Due to a Minor Addition of Ni.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2553, doi. 10.1007/s11664-010-1373-3
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Foreword: Pb-Free Solders and Emerging Interconnect and Packaging Technologies.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2503, doi. 10.1007/s11664-010-1389-8
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- Article
Erratum to: A Cryo-XPS Study of Triammonium Citrate-KAuCl-NaSO Electroplating Solutions for Pb-Free Solder Packaging.
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- 2010
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- Correction Notice
Phase Equilibria in the Sn-Ni-Zn Ternary System: Isothermal Sections at 200°C, 500°C, and 800°C.
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- Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2643, doi. 10.1007/s11664-010-1313-2
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High-Temperature Capacitor Based on Ca-Doped BiNaTiO-BaTiO Ceramics.
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- Journal of Electronic Materials, 2010, v. 39, n. 11, p. 2471, doi. 10.1007/s11664-010-1246-9
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Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C.
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- Journal of Electronic Materials, 2009, v. 38, n. 6, p. 843, doi. 10.1007/s11664-009-0772-9
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Viscosity and Surface Tension of Liquid Sn-Cu Lead-Free Solders.
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- Journal of Electronic Materials, 2009, v. 38, n. 6, p. 828, doi. 10.1007/s11664-008-0611-4
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An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics.
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- Journal of Electronic Materials, 2009, v. 38, n. 6, p. 815, doi. 10.1007/s11664-009-0761-z
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- Article
Wetting Kinetics of Eutectic Lead and Lead-Free Solders: Spreading over the Cu Surface.
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- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 284, doi. 10.1007/s11664-008-0590-5
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- Article
Effects of Ag and Al Additions on the Structure and Creep Properties of Sn-9Zn Solder Alloy.
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- Journal of Electronic Materials, 2009, v. 38, n. 2, p. 330, doi. 10.1007/s11664-008-0576-3
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- Article
Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 39, doi. 10.1007/s11664-008-0529-x
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- Article
Suppressing Growth of the Cu<sub>5</sub>Zn<sub>8</sub> Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints.
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- Journal of Electronic Materials, 2009, v. 38, n. 1, p. 88, doi. 10.1007/s11664-008-0579-0
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Joint Strength and Microstructure for Sn-Ag-(Cu) Soldering on an Electroless Ni-Au Surface Finish by Using a Flux Containing a Cu Compound.
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- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 806, doi. 10.1007/s11664-008-0408-5
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Impact of Thermal Cycling on Sn-Ag-Cu Solder Joints and Board-Level Drop Reliability.
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- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 880, doi. 10.1007/s11664-008-0400-0
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Enhancing the Mechanical Response of a Lead-Free Solder Using an Energy-Efficient Microwave Sintering Route.
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- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 860, doi. 10.1007/s11664-008-0399-2
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Decapsulation Method for Flip Chips with Ceramics in Microelectronic Packaging.
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- Journal of Electronic Materials, 2008, v. 37, n. 6, p. 845, doi. 10.1007/s11664-008-0387-6
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- Article
Effect of Carbon Nanotubes on the Shear Strength and Electrical Resistivity of a Lead-Free Solder.
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- Journal of Electronic Materials, 2008, v. 37, n. 4, p. 515, doi. 10.1007/s11664-008-0379-6
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Effect of Interfacial Reactions on the Reliability of Lead-Free Assemblies after Board Level Drop Tests.
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- Journal of Electronic Materials, 2007, v. 36, n. 9, p. 1129, doi. 10.1007/s11664-007-0186-5
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Nanoindentation on SnAgCu Lead-Free Solder Joints and Analysis.
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- Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2107, doi. 10.1007/s11664-006-0320-9
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- Article
The Effect of Ag Content on the Formation of Ag<sub>3</sub>Sn Plates in Sn-Ag-Cu Lead-Free Solder.
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- Journal of Electronic Materials, 2006, v. 35, n. 12, p. 2074, doi. 10.1007/s11664-006-0316-5
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- Article
Effect of Small Additions of Alloying Elements on the Properties of Sn-Zn Eutectic Alloy.
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- Journal of Electronic Materials, 2006, v. 35, n. 9, p. 1734, doi. 10.1007/s11664-006-0227-5
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Beware of Rosh's product focus.
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- Manufacturing Engineer, 2005, v. 84, n. 5, p. 48, doi. 10.1049/me:20050515
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- Article
Lead-free solders: Still learning, adapting, and working out the kinks.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2010, v. 62, n. 7, p. 15, doi. 10.1007/s11837-010-0101-z
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An Overview of Pb-free, Flip-Chip Wafer-Bumping Technologies.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2008, v. 60, n. 6, p. 66, doi. 10.1007/s11837-008-0075-2
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The Root Causes of the "Black Pad" Phenomenon and Avoidance Tactics.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2008, v. 60, n. 6, p. 61, doi. 10.1007/s11837-008-0074-3
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- Article
Lead-Free and Lead-Bearing Electronic Solders: Implementation, Reliability, and New Technology.
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- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2008, v. 60, n. 6, p. 60, doi. 10.1007/s11837-008-0073-4
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Determinants of green electricity adoption among residential customers in Germany.
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- International Journal of Consumer Studies, 2010, v. 34, n. 4, p. 464, doi. 10.1111/j.1470-6431.2010.00896.x
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- Article
Investigation on co-fired multilayer KNN-based lead-free piezoceramics.
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- Physica Status Solidi. A: Applications & Materials Science, 2014, v. 211, n. 10, p. 2378, doi. 10.1002/pssa.201431156
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Lead-free transducer for non-destructive evaluation.
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- Applied Physics A: Materials Science & Processing, 2007, v. 88, n. 1, p. 209, doi. 10.1007/s00339-007-3971-3
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- Article
0.90(Bi<sub>1/2</sub>Na<sub>1/2</sub>)TiO<sub>3</sub>–0.05(Bi<sub>1/2</sub>K<sub>1/2</sub>)TiO<sub>3</sub>– 0.05BaTiO<sub>3</sub> transducer for ultrasonic wirebonding applications.
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- Applied Physics A: Materials Science & Processing, 2006, v. 84, n. 3, p. 313, doi. 10.1007/s00339-006-3625-x
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- Article
Lead-Free Reliability Issues and Test Methods.
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- EE: Evaluation Engineering, 2006, v. 45, n. 6, p. 48
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- Article