Works matching DE "ULTRA large scale integration of circuits"

Results: 22

IITC '99: Many options, many risks.

Published in:

Solid State Technology, 1999, v. 42, n. 8, p. 24

By:

Korczynski, Ed

Publication type:

Article

Low-k dielectric costs for dual-damascene integration.

Published in:

Solid State Technology, 1999, v. 42, n. 5, p. 43

By:

Korczynski, Ed

Publication type:

Article

At CMP-MIC, new models impose science on CMP.

Published in:

Solid State Technology, 1999, v. 42, n. 5, p. 24

By:

Korczynski, Ed

Publication type:

Article

Report from DUMIC: Low-k still in development.

Published in:

Solid State Technology, 1999, v. 42, n. 5, p. 22

By:

Korczynski, Ed

Publication type:

Article

Roadmapping over shifting terrain.

Published in:

1999

By:

Korczynski, Ed

Publication type:

Editorial

Corrosion of electrodeposited copper by exposure to volatile organic compounds.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 7, p. 666, doi. 10.1007/s10854-008-9783-1

By:

D’Urzo, Lucia;
Bozzini, Benedetto

Publication type:

Article

SILICON-ON-INSULATOR MESFETS AT THE 45NM NODE.

Published in:

International Journal of High Speed Electronics & Systems, 2012, v. 21, n. 1, p. -1, doi. 10.1142/S0129156412500127

By:

LEPKOWSKI, WILLIAM;
WILK, SETH J.;
GHAJAR, M. REZA;
PARSI, ANURADHA;
THORNTON, TREVOR J.

Publication type:

Article

Interconnect reliability analysis of ULSI using automated model generation algorithm.

Published in:

International Journal of RF & Microwave Computer-Aided Engineering, 2016, v. 26, n. 6, p. 481, doi. 10.1002/mmce.20992

By:

Lin, Qian;
Fu, Haipeng;
Na, Weicong;
He, Feifei;
Li, Xi;
Cheng, Qianfu;
Zhu, Yuanyuan

Publication type:

Article

The role of plasma analytics in leading‐edge semiconductor technologies.

Published in:

Contributions to Plasma Physics, 2018, v. 58, n. 5, p. 367, doi. 10.1002/ctpp.201700086

By:

Zimmermann, S.;
Haase, M.;
Lang, N.;
Röpcke, J.;
Schulz, S. E.;
Otto, T.

Publication type:

Article

Optimization Approaches for Designing Quantum Reversible Arithmetic Logic Unit.

Published in:

International Journal of Theoretical Physics, 2016, v. 55, n. 3, p. 1423, doi. 10.1007/s10773-015-2782-0

By:

Haghparast, Majid;
Bolhassani, Ali

Publication type:

Article

Impact of Level-Converter on Power-Saving Capability of Clustered Voltage Scaling.

Published in:

Advances in Radio Science, 2005, v. 3, p. 311, doi. 10.5194/ars-3-311-2005

By:

Henzler, St.;
Berthold, J.;
Koban, M.;
Reinl, M.;
Georgakos, G.;
Schmitt-Landsiedel, D.

Publication type:

Article

Multi-Agent Approach for Facing Challenges in Ultra-Large Scale systems.

Published in:

International Journal of Electrical & Computer Engineering (2088-8708), 2014, v. 4, n. 2, p. 151, doi. 10.11591/ijece.v4i2.4102

By:

Bagheri, Hamid;
Torkamani, Mohammad Ali;
Ghaffari, Zhaleh

Publication type:

Article

Behavior of COPs (Pits) on Substrate Surface for ULSI Process Integrity.

Published in:

Journal of Studies on Manufacturing, 2010, v. 1, n. 2/3, p. 85

By:

Po-Ying Chen;
Wen-Kuan Yeh;
Ming Hsiung Tsai;
I-Fen Chen;
Po-Han Wu;
Woei-Jye Ong;
Shih-Chun Hung;
Wei-Chou Chen;
Kang-Ping Li;
Pei-Chen Yeh;
Hsin-Ying Huang

Publication type:

Article

Implementation of a Reuse Process for Liquid Crystal Displays Using an Eccentric-Form Tool.

Published in:

International Journal of Molecular Sciences, 2009, v. 10, n. 9, p. 4178, doi. 10.3390/ijms10094178

By:

Pai-Shan Pa

Publication type:

Article

An efficient room-temperature silicon-based light-emitting diode.

Published in:

Nature, 2001, v. 410, n. 6825, p. 192, doi. 10.1038/35065571

By:

Wai Lek Ng;
Lourenco, M.A.;
Gwilliam, R.M.;
Ledain, S.;
G. Shao;
Homewood, K.P.

Publication type:

Article

Atomic Layer Deposition of Silicon Nitride Thin Films: A Review of Recent Progress, Challenges, and Outlooks.

Published in:

Materials (1996-1944), 2016, v. 9, n. 12, p. 1007, doi. 10.3390/ma9121007

By:

Xin Meng;
Young-Chul Byun;
Kim, Harrison S.;
Lee, Joy S.;
Lucero, Antonio T.;
Lanxia Cheng;
Jiyoung Kim

Publication type:

Article

System Tests Processes At the 65-nm Node.

Published in:: 2005
Publication type:: Product Review

Analysis and Application of Grey Relation and ANOVA in Chemical–Mechanical Polishing Process Parameters.

Published in:

International Journal of Advanced Manufacturing Technology, 2003, v. 21, n. 1, p. 10, doi. 10.1007/s001700300001

By:

Ho, C.-Y.;
Lin, Z.-C.

Publication type:

Article

Electrodeposition of Cu from acidic sulphate solutions in presence of Bis-(3-sulphopropyl)-disulphide (SPS).

Published in:

Transactions of the Institute of Metal Finishing, 2006, v. 84, n. 2, p. 83, doi. 10.1179/174591906X99866

By:

Bozzini, B.;
D'Urzo, L.;
Mele, C.;
Romanello, V.

Publication type:

Article

A neural computation to study the scaling capability of the undoped DG MOSFET.

Published in:

Semiconductor Physics, Quantum Electronics & Optoelectronics, 2008, v. 11, n. 2, p. 196, doi. 10.15407/spqeo11.02.196

By:

Djeffal, F.;
Guessasma, S.;
Benhaya, A.;
Bendib, T.

Publication type:

Article

Void Growth Behavior in ULSI Cu Interconnections by Grain-Boundary Diffusion Simulation.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 10, p. 2255, doi. 10.1007/s11664-010-1311-4

By:

Takashi Onishi;
MasaoMizuno;
Tetsuya Yoshikawa;
Jun Munemasa;
Takao Inoue;
Aki Miyagaki;
Hisashi Nakamoto

Publication type:

Article

Thermal Stability Study of Cu(MoN<sub> x </sub>) Seed Layer on Barrierless Si.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 100, doi. 10.1007/s11664-008-0523-3

By:

Chu, J.P.;
Lin, C.H.;
Leau, W.K.;
John, V.S.

Publication type:

Article