CMP抛光垫表面及材料特性对抛光效果影响的研究进展.
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- Micronanoelectronic Technology, 2024, v. 61, n. 4, p. 1, doi. 10.13250/j.cnki.wndz.24040103
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- Article
Works matching AU 李雯浩宇
Results: 3
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阴/非离子型表面活性剂对 CMP 后 SiO<sub>2</sub> 颗粒的去除效果.
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- Semiconductor Technology / Bandaoti Jishu, 2024, v. 49, n. 5, p. 461, doi. 10.13290/j.cnki.bdtjs.2024.05.008
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- Article
3
化学机械抛光中摩擦润滑与化学行为研究进展.
- Published in:
- Applied Chemical Industry, 2024, v. 53, n. 6, p. 1416
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- Publication type:
- Article