Works matching DE "INTEGRATED circuits industry"

Results: 172

Infrastructure matures as Flip chip takes off.

Published in:

Solid State Technology, 2001, v. 44, n. 9, p. 47

By:

Vardaman, E. Jaw

Publication type:

Article

The Control of Oxygen Precipitation and the Impact of Internal Gettering.

Published in:: Solid State Technology, 2001, v. 44, n. 3, p. 113
Publication type:: Article

Let's get on with using the Internet on the fab floor.

Published in:

Solid State Technology, 2001, v. 44, n. 4, p. 166

By:

Parsons, Peter V. N.

Publication type:

Article

It's Europe's turn now.

Published in:

Solid State Technology, 2001, v. 44, n. 4, p. S1

By:

DeFerm, Ludo

Publication type:

Article

The view from Japan: Chipmakers giving up on doing it all themselves.

Published in:

Solid State Technology, 2001, v. 44, n. 4, p. 40

By:

Kimura, Masahide;
Microdevices, Nikkei

Publication type:

Article

We need better factories.

Published in:

Solid State Technology, 2000, v. 43, n. 6, p. 14

By:

Haavind, Robert

Publication type:

Article

Market indicators stay steady course; tool bookings reach $2.3B, says SEMI.

Published in:

Solid State Technology, 2000, v. 43, n. 5, p. 18

By:

Villeneuve, Meg

Publication type:

Article

Flat January sales follow months of rapid growth.

Published in:

Solid State Technology, 2000, v. 43, n. 5, p. 18

By:

Lunday, Christine

Publication type:

Article

Worldwide highlights.

Published in:: Solid State Technology, 1999, v. 42, n. 11, p. 14
Publication type:: Article

Booming comm-IC markets increase GaAs use.

Published in:: Solid State Technology, 1999, v. 42, n. 3, p. 26
Publication type:: Article

IMEC-ASML alliance sees results.

Published in:: Solid State Technology, 1999, v. 42, n. 2, p. 24
Publication type:: Article

IBM goes mainstream with SiGe manufacturing.

Published in:

Solid State Technology, 1999, v. 42, n. 2, p. 18

By:

P.B.

Publication type:

Article

Equipment sales and chip sales tire in October.

Published in:: Solid State Technology, 1999, v. 42, n. 1, p. 14
Publication type:: Article

1998 capital spending trends: Boom to bust.

Published in:

Solid State Technology, 1998, v. 41, n. 10, p. 54

By:

McClean, Bill

Publication type:

Article

Fab for lease.

Published in:: Solid State Technology, 1998, v. 41, n. 4, p. 40
Publication type:: Article

Wet bench materials scrutinized after fires.

Published in:

Solid State Technology, 1998, v. 41, n. 3, p. 22

By:

Lunday, Christine

Publication type:

Article

Philips to build in the Philippines.

Published in:: Solid State Technology, 1997, v. 40, n. 12, p. 34
Publication type:: Article

Expect the unexpected.

Published in:

1997

By:

Korczynski, Ed

Publication type:

Editorial

Benefits of co-operation on innovative performance: evidence from integrated circuits and biotechnology firms in the UK and Taiwan.

Published in:

R&D Management, 2003, v. 33, n. 4, p. 425, doi. 10.1111/1467-9310.00308

By:

Chang, Yuan-Chieh

Publication type:

Article

The front end of new product development: A Canadian survey.

Published in:

R&D Management, 1997, v. 27, n. 1, p. 5, doi. 10.1111/1467-9310.00038

By:

Murphy, Steven A.;
Kumar, Vinod

Publication type:

Article

Calendar.

Published in:: 2007
Publication type:: Calendar

News.

Published in:: Electronics Systems & Software, 2006, v. 4, n. 5, p. 4, doi. 10.1049/ess:20060510
Publication type:: Article

News.

Published in:: Electronics Systems & Software, 2006, v. 4, n. 1, p. 4, doi. 10.1049/ess:20060109
Publication type:: Article

Chip sales forecast pushed up.

Published in:: Electronics Systems & Software, 2005, v. 3, n. 6, p. 9
Publication type:: Article

Fujitsu prepares 65nm process with 25% gate shrink.

Published in:: Electronics Systems & Software, 2005, v. 3, n. 5, p. 4
Publication type:: Article

LSI Logic fabless move was 'timing driven'

Published in:: Electronics Systems & Software, 2005, v. 3, n. 5, p. 5
Publication type:: Article

DSP micro family splits into four.

Published in:: Electronics Systems & Software, 2005, v. 3, n. 5, p. 46
Publication type:: Article

Fabless road beckons even for companies on old processes.

Published in:

2005

By:

Edwards, Chris

Publication type:

Editorial

正硅酸甲酯制备的研究进展.

Published in:

Eco-Industry Science & Phosphorus Fluorine Engineering, 2024, v. 39, n. 12, p. 50

By:

胡国涛;
黄家兴;
柳陈军;
陈广鹏

Publication type:

Article

Technological Performance and Alliances Over the Industry Life Cycle: Evidence from the ASIC Industry.

Published in:

Journal of Product Innovation Management, 2015, v. 32, n. 4, p. 556, doi. 10.1111/jpim.12253

By:

Vanhaverbeke, Wim;
Belderbos, Réne;
Duysters, Geert;
Beerkens, Bonnie

Publication type:

Article

Current Trends in Integrated Circuits.

Published in:

Financial Analysts Journal, 1967, v. 23, n. 5, p. 65, doi. 10.2469/faj.v23.n5.65

By:

Sarlo, George S.;
Longley, F. Alan

Publication type:

Article

As China pushes semiconductor industry, cybersecurity and politics push back.

Published in:

China Business Review, 2016, p. 1

By:

Shira, Dezan

Publication type:

Article

Intel Continues Mobile Market Investment with $1.5 Billion Deal.

Published in:

China Business Review, 2014, p. 1

By:

Huber, Ellen

Publication type:

Article

Malicious Hardware Detection and Design for Trust: an Analysis.

Published in:

Electrotechnical Review / Elektrotehniski Vestnik, 2017, v. 84, n. 1/2, p. 7

By:

R., Sree Ranjani;
M., Nirmala Devi

Publication type:

Article

Before and after the millennium: productivity analysis of the supply chain of Taiwan's IC industry.

Published in:

Applied Economics, 2011, v. 43, n. 22, p. 2993, doi. 10.1080/00036840903357348

By:

Lu, LouisY. Y.

Publication type:

Article

Synchronizing the Supply of Components for Automotive Assembly amid Chip Shortages and Other Supply Delays.

Published in:

Production & Operations Management, 2024, v. 33, n. 9, p. 1821, doi. 10.1177/10591478241260432

By:

Clottey, Toyin;
Benton Jr., WC

Publication type:

Article

New Architecture Enhances Memory Test and Repair.

Published in:

EE: Evaluation Engineering, 2005, v. 44, n. 7, p. 68

By:

Balachandran, Krishna

Publication type:

Article

Applying Advanced Fault Models.

Published in:

EE: Evaluation Engineering, 2004, v. 43, n. 3, p. 48

By:

Jayaram, Vinay;
Hay, Cy;
Kapur, Rohit

Publication type:

Article

CTL: The New Language of DFT.

Published in:

EE: Evaluation Engineering, 2003, v. 42, n. 10, p. 20

By:

Miller, Kathleen R.;
Lonowski, Wayne J.;
Kapur, Rohit;
Harrod, Peter;
Appello, Davide

Publication type:

Article

United Micro to buy Chinese chip maker.

Published in:

ComputerWorld Hong Kong, 2009, v. 26, n. 5, p. 75

By:

Nystedt, Dan

Publication type:

Article

Unusual Energy Dept.--Industry Partnership To Build 21st Century Computer Chip May Be Co-Op Model.

Published in:

Research Technology Management, 1999, v. 42, n. 2, p. 2

By:

Wolff, M. F.;
Gwynne, Peter

Publication type:

Article

Taiwan's ITRI seeks new industry research role.

Published in:

Research Technology Management, 1998, v. 41, n. 6, p. 6

By:

Wolff, M. F.;
Nathan, Richard

Publication type:

Article

Time-Based Embedded Test Instrument with Concurrent Voltage Measurement Capability.

Published in:

Journal of Electronic Testing, 2012, v. 28, n. 5, p. 653, doi. 10.1007/s10836-012-5299-y

By:

Kulovic, Kemal;
Margala, Martin

Publication type:

Article

A System-layer Infrastructure for SoC Diagnosis.

Published in:

Journal of Electronic Testing, 2007, v. 23, n. 5, p. 389, doi. 10.1007/s10836-007-5014-6

By:

P. Bernardi;
M. Grosso;
M. Rebaudengo;
M. Sonza Reorda

Publication type:

Article

Determination of the relative humidity at the parts-per-million (ppm) level in gases by a nanoporous alumina thin-film on a surface acoustic wave (SAW) resonator.

Published in:

Instrumentation Science & Technology, 2022, v. 50, n. 2, p. 118, doi. 10.1080/10739149.2021.1967973

By:

Alam, Shamim;
Khan, Shakeb A.;
Mittal, Upendra;
Islam, Tarikul

Publication type:

Article

Lithography Alignment Techniques Based on Moiré Fringe.

Published in:

Photonics, 2023, v. 10, n. 4, p. 351, doi. 10.3390/photonics10040351

By:

Jiang, Wenbo;
Wang, Huaran;
Xie, Wenda;
Qu, Zhefei

Publication type:

Article

Interfirm Cooperation in Japan's Integrated Circuit Industry, 1960s-1970s.

Published in:

Business History Review, 2012, v. 86, n. 4, p. 773, doi. 10.1017/S0007680512001821

By:

Kim, Yongdo

Publication type:

Article

Smart Devices Reshape the Chip Industry.

Published in:

SERI Quarterly, 2013, v. 6, n. 4, p. 25

By:

JANG Sung-Won

Publication type:

Article

Effects of Ag Flake Addition in Sn-3.0Ag-0.5Cu on Microstructure and Mechanical Properties with High-Temperature Storage Test.

Published in:

Journal of Electronic Materials, 2021, v. 50, n. 10, p. 5639, doi. 10.1007/s11664-021-09102-4

By:

Jang, Jun-Ho;
Min, Kyung Deuk;
Lee, Choong-Jae;
Hwang, Byeong-Uk;
Jung, Seung-Boo

Publication type:

Article

When Size Does Matter.

Published in:

Manufacturing Engineer, 2005, v. 84, n. 2, p. 6, doi. 10.1049/me:20050212

By:

Venables, Mark

Publication type:

Article