Works matching DE "FLIP chip technology"
Results: 364
Self‐Intercalated Magnetic Heterostructures in 2D Chromium Telluride.
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- Advanced Functional Materials, 2023, v. 33, n. 2, p. 1, doi. 10.1002/adfm.202208528
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3D Printed Supercapacitor: Techniques, Materials, Designs, and Applications.
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- Advanced Functional Materials, 2023, v. 33, n. 1, p. 1, doi. 10.1002/adfm.202208034
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Order–Disorder Transitions in a Polar Vortex Lattice.
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- Advanced Functional Materials, 2022, v. 32, n. 22, p. 1, doi. 10.1002/adfm.202111392
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V "Bridged" CoO to Eliminate Charge Transfer Barriers and Drive Lattice Oxygen Oxidation during Water‐Splitting.
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- Advanced Functional Materials, 2021, v. 31, n. 9, p. 1, doi. 10.1002/adfm.202008822
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- Article
Deformations of a simplified flip chip structure under thermal testing inspected using a real-time Moiré technique.
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- International Journal of Advanced Manufacturing Technology, 2006, v. 27, n. 7/8, p. 708, doi. 10.1007/s00170-004-2245-x
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THERMAL STRESS ANALYSIS AND DESIGN OPTIMIZATION OF DIRECT CHIP ATTACH (DCA) AND CHIP SCALE PACKAGE (CSP) IN FLIP CHIP TECHNOLOGY.
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- Engineering Optimization, 2002, v. 34, n. 6, p. 591, doi. 10.1080/03052150215718
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Noncontact excitation of multi-GHz lithium niobate electromechanical resonators.
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- Microsystems & Nanoengineering, 2024, v. 10, n. 1, p. 1, doi. 10.1038/s41378-024-00771-9
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Small-size temperature/high-pressure integrated sensor via flip-chip method.
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- Microsystems & Nanoengineering, 2024, v. 10, n. 1, p. 1, doi. 10.1038/s41378-024-00723-3
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- Article
Suitable stacking sequence of glass fibre reinforcements for specific application of composite using Taguchi design and finite element method.
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- Journal of Industrial Textiles, 2022, v. 52, p. 1, doi. 10.1177/15280837221128312
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- Article
Fracturing and Porosity Channeling in Fluid Overpressure Zones in the Shallow Earth's Crust.
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- Geofluids, 2020, p. 1, doi. 10.1155/2020/7621759
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- Article
Memristor-Based Loop Filter Design for Phase Locked Loop.
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- Journal of Low Power Electronics & Applications, 2019, v. 9, n. 3, p. 24, doi. 10.3390/jlpea9030024
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Use of flip ambiguity probabilities in robust sensor network localization.
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- Wireless Networks (10220038), 2011, v. 17, n. 5, p. 1157, doi. 10.1007/s11276-011-0333-z
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Chirality flips of skyrmion bubbles.
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- Nature Communications, 2022, v. 13, n. 1, p. 1, doi. 10.1038/s41467-022-33700-3
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- Article
Study on the Fluid-Structure Interaction at Different Layout of Stacked Chip in Molded Packaging.
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- Arabian Journal for Science & Engineering (Springer Science & Business Media B.V. ), 2017, v. 42, n. 11, p. 4743, doi. 10.1007/s13369-017-2659-z
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Random augmentation pipe for hyperspectral image classification with few samples.
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- International Journal of Remote Sensing, 2022, v. 43, n. 18, p. 6581, doi. 10.1080/01431161.2022.2132123
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Facile Synthesis of Conductive Flexible Composite Sn@Ag Microspheres and their Application in Anisotropic Conductive Films.
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- Particle & Particle Systems Characterization, 2022, v. 39, n. 1, p. 1, doi. 10.1002/ppsc.202100161
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Graphenic Aerogels Decorated with Ag Nanoparticles as 3D SERS Substrates for Biosensing.
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- Particle & Particle Systems Characterization, 2020, v. 37, n. 7, p. 1, doi. 10.1002/ppsc.202000095
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Creep of sintered porous micron-silver: nanoindentation experiment and theoretical analysis.
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- Journal of Materials Science, 2021, v. 56, n. 32, p. 18281, doi. 10.1007/s10853-021-06426-8
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- Article
Microstructural variation and high-speed impact responses of Sn-3.0Ag-0.5Cu/ENEPIG solder joints with ultra-thin Ni-P deposit.
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- Journal of Materials Science, 2013, v. 48, n. 6, p. 2724, doi. 10.1007/s10853-012-7070-2
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A Comprehensive Study of the Robustness for LiDAR-Based 3D Object Detectors Against Adversarial Attacks.
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- International Journal of Computer Vision, 2024, v. 132, n. 5, p. 1592, doi. 10.1007/s11263-023-01934-3
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- Article
Design of Hybrid Bandpass Filter Chips with High Selectivity and Wideband Using IPD and FBAR Technology.
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- International Journal of RF & Microwave Computer-Aided Engineering, 2024, v. 2024, p. 1, doi. 10.1155/2024/9928016
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- Article
Thermal Conductivity of Hybrid SiC/Si Substrates for the Growth of LED Heterostructures.
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- Technical Physics Letters, 2023, v. 49, p. S327, doi. 10.1134/S1063785023010200
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A Light-Emitting Diode Based on AlInGaN Heterostructures Grown on SiC/Si Substrates and Its Fabrication Technology.
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- Technical Physics Letters, 2022, v. 48, n. 2, p. 31, doi. 10.1134/S1063785022020043
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- Article
Output Properties of Transparent Submount Packaged FlipChip Light-Emitting Diode Modules.
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- Applied Sciences (2076-3417), 2016, v. 6, n. 6, p. 179, doi. 10.3390/app6060179
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- Article
Spin-sate reconfiguration induced by alternating magnetic field for efficient oxygen evolution reaction.
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- Nature Communications, 2021, v. 12, n. 1, p. 1, doi. 10.1038/s41467-021-25095-4
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- Article
The Construction of Force, Moment and Torque Diagrams of a Loaded Shaft in the Context of a Flipped Machine Design Classroom.
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- Journal of Strategic Innovation & Sustainability, 2020, v. 15, n. 3, p. 124, doi. 10.33423/jsis.v15i3.2953
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- Article
Next-generation RSV vaccines avoid flipping out.
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- Science Translational Medicine, 2022, v. 14, n. 676, p. 1, doi. 10.1126/scitranslmed.ade9984
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- Article
Hybrid Device Fabrication Using Roll-to-Roll Printing for Personal Environmental Monitoring.
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- Polymers (20734360), 2023, v. 15, n. 12, p. 2687, doi. 10.3390/polym15122687
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- Article
Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging.
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- Polymers (20734360), 2022, v. 14, n. 14, p. N.PAG, doi. 10.3390/polym14142950
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- Article
Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining.
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- Polymers (20734360), 2021, v. 13, n. 6, p. 957, doi. 10.3390/polym13060957
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A two-dimensional simulation model for the molded underfill process in flip chip packaging.
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- Journal of Mechanical Science & Technology, 2015, v. 29, n. 7, p. 2967, doi. 10.1007/s12206-015-0627-7
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- Article
Strain behaviors of solder bump with underfill for flip chip package under thermal loading condition.
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- Journal of Mechanical Science & Technology, 2014, v. 28, n. 12, p. 4899, doi. 10.1007/s12206-014-1109-z
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- Article
Finite element modeling and random vibration analysis of BGA electronic package soldered using lead free solder alloy − Sn-1Cu-1Ni-1Ag.
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- International Journal for Simulation & Multidisciplinary Design Optimization, 2019, v. 10, p. 1, doi. 10.1051/smdo/2019013
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- Article
Novel Au-Based Solder Alloys: A Potential Answer for Electrical Packaging Problem.
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- Advances in Materials Science & Engineering, 2020, p. 1, doi. 10.1155/2020/4969647
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- Article
Indium Bump Process for Low-Temperature Detectors and Readout.
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- Journal of Low Temperature Physics, 2022, v. 209, n. 3/4, p. 293, doi. 10.1007/s10909-022-02728-6
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- Article
Electroplated Indium Bumps as Thermal and Electrical Connections of NTD-Ge Sensors for the Fabrication of Microcalorimeter Arrays.
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- Journal of Low Temperature Physics, 2012, v. 167, n. 3/4, p. 535, doi. 10.1007/s10909-012-0560-4
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- Article
Scaling effect on Ag<sub>3</sub>Sn growth behaviours in micro-joints for flip chip assemblies.
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- Science & Technology of Welding & Joining, 2018, v. 23, n. 7, p. 551, doi. 10.1080/13621718.2018.1427835
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- Article
Thermomigration-induced failure in ball grid array solder joint under high current stressing.
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- Journal of Materials Science, 2023, v. 58, n. 26, p. 10753, doi. 10.1007/s10853-023-08678-y
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- Article
A review on numerical approach of reflow soldering process for copper pillar technology.
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- International Journal of Advanced Manufacturing Technology, 2022, v. 121, n. 7/8, p. 4325, doi. 10.1007/s00170-022-09724-w
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- Article
Numerical analysis performance of microbump cutting tool in hot machining Ti-6Al-4V.
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- International Journal of Advanced Manufacturing Technology, 2022, v. 121, n. 3/4, p. 2005, doi. 10.1007/s00170-022-09477-6
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- Article
Residual Thermal Strain Distribution Measurement of Underfills in Flip Chip Electronic Packages by an Inverse Approach Based on the Sampling Moiré Method.
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- Experimental Mechanics, 2020, v. 60, n. 5, p. 611, doi. 10.1007/s11340-019-00571-7
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- Article
Real-time observation of thermally induced warpage of flip-chip package using far-infrared Fizeau interferometry.
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- Experimental Mechanics, 2004, v. 44, n. 6, p. 628, doi. 10.1007/BF02428253
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- Article
Wpływ rozmieszczenia pustek lutowniczych na parametry cieplne tranzystorów MOSFET.
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- Przegląd Elektrotechniczny, 2022, v. 98, n. 9, p. 94, doi. 10.15199/48.2022.09.19
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Biwavelength transceiver module for parallel simultaneous bidirectional optical interconnections.
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- Optical Engineering, 2013, v. 52, n. 12, p. 1, doi. 10.1117/1.OE.52.12.120502
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- Article
Forward-flipping architecture for lifting-based discrete wavelet transform.
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- Optical Engineering, 2011, v. 50, n. 3, p. 037005, doi. 10.1117/1.3558741
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- Article
Insulated Gate Bipolar Transistor Solder Layer Defect Detection Research Based on Improved YOLOv5.
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- Applied Sciences (2076-3417), 2022, v. 12, n. 22, p. 11469, doi. 10.3390/app122211469
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- Article
The Effect of an Ag Nanofilm on Low-Temperature Cu/Ag-Ag/Cu Chip Bonding in Air.
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- Applied Sciences (2076-3417), 2021, v. 11, n. 20, p. 9444, doi. 10.3390/app11209444
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- Article
Thermal Performance of LED Filament in Flip-Chip Packaging Manufactured for Different Correlated Color Temperature.
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- Applied Sciences (2076-3417), 2021, v. 11, n. 19, p. 8844, doi. 10.3390/app11198844
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- Article
Co-Package Technology Platform for Low-Power and Low-Cost Data Centers.
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- Applied Sciences (2076-3417), 2021, v. 11, n. 13, p. 6098, doi. 10.3390/app11136098
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- Article
Physics of Failure (PoF) Based Lifetime Prediction of Power Electronics at the Printed Circuit Board Level.
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- Applied Sciences (2076-3417), 2021, v. 11, n. 6, p. 2679, doi. 10.3390/app11062679
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- Article