Works matching DE "HIGH temperature electronics"
1
- Macromolecular Symposia, 2024, v. 413, n. 2, p. 1, doi. 10.1002/masy.202300105
- Devi, Saraswati;
- Behera, Saubhagyalaxmi;
- Moharana, Srikanta;
- Chakroborty, Subhendu;
- Barik, Arundhati
- Article
2
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 17, p. 22654, doi. 10.1007/s10854-021-06750-4
- Xu, Jin;
- Yin, Yuning;
- Chen, Haoran
- Article
3
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 22, p. 19034, doi. 10.1007/s10854-018-0029-6
- Sheikhi, Roozbeh;
- Cho, Junghyun
- Article
4
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 13, p. 9535, doi. 10.1007/s10854-017-6700-5
- Zhu, Yaju;
- Li, Jialiang;
- Duan, Bo;
- Li, Yao;
- Zhai, Pengcheng;
- Li, Peng
- Article
5
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 12, p. 9226, doi. 10.1007/s10854-015-3459-4
- Watson, Jeff;
- Castro, Gustavo
- Article
6
- High Temperature, 2018, v. 56, n. 4, p. 527, doi. 10.1134/S0018151X18040089
- Karpov, A. V.;
- Kovalev, D. Yu.;
- Borovinskaya, I. P.;
- Sytschev, A. E.
- Article
7
- Integrated Ferroelectrics, 2014, v. 154, n. 1, p. 14, doi. 10.1080/10584587.2014.903768
- Xu, Bin;
- Fan, Xiaohong;
- Xu, Yong;
- Guo, Xiaofei;
- Zhai, Tongguang
- Article
8
- International Journal of Circuit Theory & Applications, 2016, v. 44, n. 2, p. 418, doi. 10.1002/cta.2084
- Zou, Lei;
- Pathrose, Jerrin;
- Je, Minkyu
- Article
9
- NANO (1793-2920), 2021, v. 16, n. 2, p. N.PAG, doi. 10.1142/S1793292021500211
- Yildirim, Mustafa A.;
- Teker, Kasif
- Article
10
- Journal of Solid State Electrochemistry, 2017, v. 21, n. 8, p. 2457, doi. 10.1007/s10008-017-3593-4
- Article
11
- Journal of Solid State Electrochemistry, 2014, v. 18, n. 5, p. 1415, doi. 10.1007/s10008-013-2190-4
- Istomin, S.;
- Antipov, E.;
- Fedotov, Yu.;
- Bredikhin, S.;
- Lyskov, N.;
- Shafeie, S.;
- Svensson, G.;
- Liu, Y.;
- Shen, Z.
- Article
12
- Electronics Letters (Wiley-Blackwell), 2024, v. 60, n. 10, p. 1, doi. 10.1049/ell2.13236
- Zhang, Lixing;
- Lv, BeiBei;
- Ding, Xu;
- Yu, Faxin;
- Mo, Jiongjiong
- Article
13
- Physica Status Solidi. A: Applications & Materials Science, 2021, v. 218, n. 22, p. 1, doi. 10.1002/pssa.202100301
- Abdullah, Mohd Faizol;
- Bulya Nazim, Nur Julia Nazim;
- Soriadi, Nurhidaya;
- Mohamad Badaruddin, Siti Aishah;
- Mat Hussin, Mohd Rofei;
- Syono, Mohd Ismahadi
- Article
14
- Composite Interfaces, 2022, v. 29, n. 6, p. 659, doi. 10.1080/09276440.2021.1990482
- Zhao, Lihua;
- Wu, Weiqing;
- Jia, Lichuan;
- Zhang, Zongxi;
- Wang, Zhong;
- Huang, Xiaolong;
- Ning, Wenjun;
- Ren, Junwen
- Article
15
- Composite Interfaces, 2021, v. 28, n. 11, p. 1067, doi. 10.1080/09276440.2020.1855573
- Wang, Tingting;
- Wei, Chengmei;
- Yan, Lei;
- Liao, Yun;
- Wang, Guoli;
- Zhao, Lihua;
- Fu, Mingli;
- Ren, Junwen
- Article
16
- Journal of Microelectronic & Electronic Packaging, 2020, v. 17, n. 3, p. 99, doi. 10.4071/imaps.1123535
- Nasiri, Ardalan;
- Ang, Simon S.
- Article
17
- Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 2, p. 78, doi. 10.4071/imaps.873073
- Liangyu Chen;
- Neudeck, Philip G.;
- Meredith, Roger D.;
- Lukco, Dorothy;
- Spry, David J.;
- Nakley, Leah M.;
- Phillips, Kyle G.;
- Beheim, Glenn M.;
- Hunter, Gary W.
- Article
18
- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 4, p. 166, doi. 10.4071/imaps.516313
- Aviño-Salvado, Oriol;
- Sabbah, Wissam;
- Buttay, Cyril;
- Morel, Hervé;
- Bevilacqua, Pascal
- Article
19
- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 1, p. 11, doi. 10.4071/imaps.529
- Liang-Yu Chen;
- Neudeck, Philip G.;
- Spry, David J.;
- Beheim, Glenn M.;
- Hunter, Gary W.
- Article
20
- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 1, p. 17, doi. 10.4071/imaps.526
- Salem, Jebreel M.;
- Dong Sam Ha
- Article
21
- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 2, p. 39, doi. 10.4071/imaps.503
- Zheng Chen;
- Yiying Yao;
- Wenli Zhang;
- Boroyevich, Dushan;
- Ngo, Khai;
- Mattavelli, Paolo;
- Burgos, Rolando
- Article
22
- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 1, p. 33, doi. 10.4071/imaps.487
- Kelberer, A.;
- Dreiner, S.;
- Grella, K.;
- Dittrich, D.;
- Kappert, H.;
- Vogt, H.;
- Paschen, U.
- Article
23
- Journal of Microelectronic & Electronic Packaging, 2016, v. 13, n. 1, p. 6, doi. 10.4071/imaps.492
- Croteau, Paul;
- Seal, Sayan;
- Witherell, Ryan;
- Glover, Michael;
- Krishnamurthy, Shashank;
- Mantooth, Alan
- Article
24
- Journal of Microelectronic & Electronic Packaging, 2013, v. 10, n. 4, p. 163, doi. 10.4071/imaps.392
- Riches, S. T.;
- Johnston, C.;
- Lui, A.
- Article
25
- Journal of Applied Polymer Science, 2020, v. 137, n. 11, p. N.PAG, doi. 10.1002/app.48457
- Tong, Lifen;
- Yang, Guangyao;
- Lei, Xiting;
- You, Yong;
- Liu, Xiaobo
- Article
26
- Fuel Cells, 2014, v. 14, n. 3, p. 395, doi. 10.1002/fuce.201300150
- Fu, Q.;
- Schefold, J.;
- Brisse, A.;
- Nielsen, J. U.
- Article
27
- Advanced Functional Materials, 2024, v. 34, n. 4, p. 1, doi. 10.1002/adfm.202311085
- Khuje, Saurabh;
- Alshatnawi, Firas;
- Smilgies, Detlef;
- Alhendi, Mohammed;
- Islam, Abdullah;
- Armstrong, Jason;
- Yu, Jian;
- Poliks, Mark;
- Ren, Shenqiang
- Article
28
- China's Refractories, 2024, v. 33, n. 3, p. 22, doi. 10.19691/j.cnki.1004-4493.2024.03.004
- Wenjing LIU;
- Ning LIAO;
- Yawei LI
- Article
29
- China's Refractories, 2024, v. 33, n. 3, p. 42, doi. 10.19691/j.cnki.1004-4493.2024.03.007
- Chenchen LIU;
- Ao HUANG;
- Yan YU;
- Guoping WEI;
- Shenghao LI;
- Huazhi GU
- Article
30
- Energies (19961073), 2019, v. 12, n. 23, p. 4462, doi. 10.3390/en12234462
- Castellazzi, Alberto;
- Gurpinar, Emre;
- Wang, Zhenyu;
- Suliman Hussein, Abdallah;
- Garcia Fernandez, Pablo
- Article
31
- Advanced Engineering Materials, 2023, v. 25, n. 22, p. 1, doi. 10.1002/adem.202300957
- Zheng Li;
- Khuje, Saurabh;
- Islam, Abdullah;
- Shenqiang Ren
- Article
32
- Advanced Engineering Materials, 2022, v. 24, n. 12, p. 1, doi. 10.1002/adem.202200513
- Forrester, Jack;
- Li, Linhao;
- Yang, Zijiang;
- Davidson, Jonathan N.;
- Sinclair, Derek C.;
- Reaney, Ian M.;
- Foster, Martin P.;
- Stone, David A.
- Article
33
- Cellulose, 2022, v. 29, n. 18, p. 9671, doi. 10.1007/s10570-022-04861-7
- Zhao, Jiaojiao;
- Zhou, Jianhua;
- Li, Hong;
- Xiao, Anguo
- Article
34
- SID Symposium Digest of Technical Papers, 2015, v. 46, n. 1, p. 943, doi. 10.1002/sdtp.10419
- Yeh, Bo-Liang;
- Lin, Chun-Nan
- Article
35
- SID Symposium Digest of Technical Papers, 2015, v. 46, n. 1, p. 769, doi. 10.1002/sdtp.10213
- Yan, Liangchen;
- Wang, Meili;
- Zhang, Li;
- Wang, Dongfang;
- Liu, Fengjuan;
- Yuan, Guangcai;
- Wang, Gang
- Article
36
- Metrology & Measurement Systems, 2015, v. 22, n. 3, p. 331, doi. 10.1515/mms-2015-0034
- Belavič, Darko;
- Bradeško, Andraž;
- Zarnik, Marina Santo;
- Rojac, Tadej
- Article
37
- Crystals (2073-4352), 2025, v. 15, n. 3, p. 255, doi. 10.3390/cryst15030255
- Article
38
- Metallurgical & Materials Transactions. Part A, 2014, v. 45, n. 1, p. 335, doi. 10.1007/s11661-013-1987-1
- Kejzlar, Pavel;
- Kratochvíl, Petr;
- Král, Robert;
- Vodičková, Věra
- Article
39
- Metallurgical & Materials Transactions. Part A, 2014, v. 45, n. 1, p. 395, doi. 10.1007/s11661-013-1984-4
- Kaushal, Gagandeep;
- Bala, Niraj;
- Kaur, Narinder;
- Singh, Harpreet;
- Prakash, Satya
- Article
40
- Metallurgical & Materials Transactions. Part A, 2014, v. 45, n. 1, p. 501, doi. 10.1007/s11661-013-1980-8
- Article
41
- Metallurgical & Materials Transactions. Part A, 2014, v. 45, n. 1, p. 351, doi. 10.1007/s11661-013-1961-y
- Riallant, Fanny;
- Cormier, Jonathan;
- Longuet, Arnaud;
- Milhet, Xavier;
- Mendez, José
- Article
42
- AAPPS Bulletin, 2017, v. 27, n. 4, p. 3
- Article
43
- Nuclear Technology, 2014, v. 185, n. 3, p. 227, doi. 10.13182/NT13-97
- HIROYUKI SATO;
- XING L. YAN;
- YUKIO TACHIBANA;
- KAZUHIKO KUNITOMI;
- YUKITAKA KATO
- Article
44
- Electronics Letters (Wiley-Blackwell), 2014, v. 50, n. 17, p. 1207, doi. 10.1049/el.2014.2092
- Yang Lu;
- Mengyi Cao;
- Jiaxing Wei;
- Bochao Zhao;
- Xiaohua Ma;
- Yue Hao
- Article
45
- LPI Contribution, 2021, p. 1
- Krishnamoorthy, S.;
- Komjathy, A.;
- Pauken, M. T.;
- Cutts, J. A.;
- Bowman, D. C.;
- Brissaud, Q.;
- Jackson, J. M.;
- Martire, L.;
- Chaigneau, Y.;
- Garcia, R. F.;
- Mimoun, D.;
- Izraelevitz, J.
- Article
46
- LPI Contribution, 2021, p. 1
- Glass, Dean;
- Jones, John-Paul;
- Shevade, Abhijit;
- Cutts, James;
- Raub, Eric;
- Bhakta, Dharmesh;
- Bugga, Ratnakumar
- Article
47
- LPI Contribution, 2019, p. 1
- SAUDER, J.;
- HILGEMANN, E.;
- STACK, K.;
- KAWATA, J.;
- PARNESS, A.;
- JOHNSON, M.
- Article
48
- LPI Contribution, 2019, p. 1
- Nemanich, Robert;
- Malakoutian, Mohamadali;
- Surdi, Harshad;
- Benipal, Manpuneet;
- Koeck, Franz;
- Chowdhury, Srabanti;
- Goodnick, Stephen;
- Lyons, James
- Article
49
- LPI Contribution, 2019, p. 1
- Krishnamoorthy, S.;
- Komjathy, A.;
- Pauken, M. T.;
- Bowman, D. C.;
- Cutts, J. A.;
- Izraelevitz, J.;
- Jackson, J. M.;
- Martire, L.;
- Garcia, R. F.;
- Mimoun, D.
- Article
50
- Nature Photonics, 2013, v. 7, n. 9, p. 702, doi. 10.1038/nphoton.2013.216
- Welp, Ulrich;
- Kadowaki, Kazuo;
- Kleiner, Reinhold
- Article