能信耦合的类神经形态器件技术展望.
- Published in:
- Electronic Components & Materials, 2023, v. 42, n. 10, p. 1151, doi. 10.14106/j.cnki.1001-2028.2023.0058
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- Publication type:
- Article
Works matching AU 张晓琨
Results: 5
1
2
Al<sub>2</sub> O<sub>3</sub> 包覆优化LiNi<sub>0.8</sub>Co<sub>0.1</sub>Mn<sub>0.1</sub>O<sub>2</sub> 正极材料性能研究.
- Published in:
- Electronic Components & Materials, 2020, v. 39, n. 10, p. 32, doi. 10.14106/j.cnki.1001-2028.2020.0351
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- Publication type:
- Article
3
一步水热合成法制备Li<sub>0. 33</sub> La<sub>0. 56</sub> TiO<sub>3</sub> 粉体材料.
- Published in:
- Electronic Components & Materials, 2020, v. 39, n. 7, p. 47
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- Publication type:
- Article
4
磁控溅射制备高循环稳定性的氟氧化铜薄膜研究.
- Published in:
- Electronic Components & Materials, 2020, v. 39, n. 7, p. 28
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- Publication type:
- Article
5
超声雾化喷涂工艺制备醋酸纤维素多孔膜.
- Published in:
- Electronic Components & Materials, 2018, v. 37, n. 10, p. 67, doi. 10.14106/j.cnki.1001-2028.2018.10.012
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- Publication type:
- Article