Works matching DE "MICROELECTRONICS
Results: 1989
Evolution of the next generation of sensors in the connected world: technical and human challenges.
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- International Journal of Plasma Environmental Science & Technology (IJPEST), 2024, v. 18, n. 3, p. 1, doi. 10.34343/ijpest.2024.18.e03001
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- Article
An Engineered Heterostructured Trinity Enables Fire-Safe, Thermally Conductive Polymer Nanocomposite Films with Low Dielectric Loss.
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- Nano-Micro Letters, 2025, v. 17, n. 1, p. 1, doi. 10.1007/s40820-025-01681-9
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- Article
The impact of airborne molecular bases on DUV photoresists.
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- Solid State Technology, 2001, v. 44, n. 8, p. 63
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- Article
Europe.
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- Solid State Technology, 2001, v. 44, n. 8, p. 24
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- Article
Better EDA tool integration needed for growing SoC market.
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- Solid State Technology, 2001, v. 44, n. 7, p. 58
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- Article
Suppliers' successes with 300mm tools and materials.
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- Solid State Technology, 2001, v. 44, n. 5, p. 91
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- Article
Analyzing and characterizing 193nm resist shrinkage.
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- Solid State Technology, 2001, v. 44, n. 5, p. 52
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- Article
A view into Selete's 300mm program.
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- Solid State Technology, 2000, v. 43, n. 12, p. 30
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- Article
PEB process in a CA resist.
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- Solid State Technology, 2000, v. 43, n. 8, p. 95
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- Article
Space charge effects in e-beam projection lithography.
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- Solid State Technology, 2000, v. 43, n. 7, p. 241
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- Article
Cu contamination control for advanced interconnect manufacturing.
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- Solid State Technology, 2000, v. 43, n. 5, p. 137
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- Article
Wacker Siltronic introduces fLASH wafer.
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- Solid State Technology, 2000, v. 43, n. 1, p. 20
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- Article
Environmentally friendly single-wafer spin cleaning.
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- Solid State Technology, 1999, v. 42, n. 11, p. 73
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- Article
CMP being applied to 5-layer MEMS technology.
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- Solid State Technology, 1999, v. 42, n. 11, p. 22
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- Article
The `bottom line' of automated wafer-level tracking.
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- Solid State Technology, 1999, v. 42, n. 7, p. 141
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- Article
MEMS program at Singapore's Institute of Microelectronics.
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- Solid State Technology, 1998, v. 41, n. 11, p. 28
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- Article
Status of pulsed laser deposition: challenges and opportunities.
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- Surface Engineering, 2006, v. 22, n. 2, p. 81, doi. 10.1179/174329406X98502
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- Article
Inorganic materials and coatings produced by EBPVD.
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- Surface Engineering, 2006, v. 22, n. 1, p. 35, doi. 10.1179/174329406X85029
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- Article
Implantable stimulator featuring multiple programs, adjustable stimulation amplitude and bi-directional communication for implantation in mice.
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- 2007
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- journal article
Polymer and Molecular Electronic Devices.
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- Innovation, 2006, v. 6, n. 1, p. 74
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- Article
Molecular Electronics -- The Ultimate Nano Research.
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- Innovation, 2005, v. 5, n. 2, p. 51
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- Article
A Bio‐Based Allylphenol (Eugenol)‐Functionalized Fluorinated Maleimide with Low Dielectric Constant and Low Water Uptake.
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- Macromolecular Chemistry & Physics, 2018, v. 219, n. 20, p. N.PAG, doi. 10.1002/macp.201800252
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- Article
A New Four-Arm Organosiloxane with Thermopolymerizable Trifluorovinyl ether Groups: Synthesis and Conversion to the Polymer with both Low Dielectric Constant and Low Water Uptake.
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- Macromolecular Chemistry & Physics, 2017, v. 218, n. 13, p. n/a, doi. 10.1002/macp.201700010
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- Article
Tuning Block Polymer Structure, Properties, and Processability for the Design of Efficient Nanostructured Materials Systems.
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- Macromolecular Chemistry & Physics, 2017, v. 218, n. 5, p. n/a, doi. 10.1002/macp.201600513
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- Article
New Fluoropolymers Having Both Low Water Uptake and a Low Dielectric Constant.
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- Macromolecular Chemistry & Physics, 2015, v. 216, n. 23, p. 2302, doi. 10.1002/macp.201500394
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- Article
Improved Heat Spreading Performance of Functionalized Graphene in Microelectronic Device Application.
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- Advanced Functional Materials, 2015, v. 25, n. 28, p. 4430, doi. 10.1002/adfm.201500990
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- Article
Materials and Wireless Microfluidic Systems for Electronics Capable of Chemical Dissolution on Demand.
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- Advanced Functional Materials, 2015, v. 25, n. 9, p. 1338, doi. 10.1002/adfm.201403573
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- Article
Microflotronics: A Flexible, Transparent, Pressure-Sensitive Microfluidic Film.
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- Advanced Functional Materials, 2014, v. 24, n. 39, p. 6195, doi. 10.1002/adfm.201401527
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- Article
Tunable Assembly of sp<sup>3</sup> Cross-Linked 3D Graphene Monoliths: A First-Principles Prediction.
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- Advanced Functional Materials, 2014, v. 23, n. 47, p. 5846, doi. 10.1002/adfm.201301077
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- Article
A Negative Conductivity Material Makes a dc Invisibility Cloak Hide an Object at a Distance.
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- Advanced Functional Materials, 2014, v. 23, n. 35, p. 4306, doi. 10.1002/adfm.201300226
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- Article
Ultra-low- κ HFPDB-based periodic mesoporous organosilica film with high mechanical strength for interlayer dielectric.
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- Journal of Materials Science, 2016, v. 51, n. 17, p. 7966, doi. 10.1007/s10853-016-0066-6
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- Article
Observations of fcc and hcp tantalum.
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- Journal of Materials Science, 2015, v. 50, n. 10, p. 3706, doi. 10.1007/s10853-015-8931-2
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- Article
Subsolidus phase equilibria in the CaO-poor part of the RuO-CaO-VO system.
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- Journal of Materials Science, 2011, v. 46, n. 7, p. 2388, doi. 10.1007/s10853-010-5211-z
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- Article
An assessment of Sn whiskers and depleted area formation in thin Sn films using quantitative image analysis.
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- Journal of Materials Science, 2011, v. 46, n. 1, p. 263, doi. 10.1007/s10853-010-4976-4
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- Article
Plasma-based processes and thin film equipment for nano-scale device fabrication.
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- Journal of Materials Science, 2011, v. 46, n. 1, p. 1, doi. 10.1007/s10853-010-4974-6
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- Article
Carbon based conductive photoresist.
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- Journal of Materials Science, 2009, v. 44, n. 17, p. 4625, doi. 10.1007/s10853-009-3706-2
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- Article
Evaluation of additive effects and homogeneity of the starting mixture on the nuclei-growth processes of barium titanate via a solid state route.
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- Journal of Materials Science, 2008, v. 43, n. 18, p. 6182, doi. 10.1007/s10853-008-2932-3
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- Article
Dielectric properties of barium strontium titanate (BST)/yttrium aluminate (YAlO<sub>3</sub>) thick films under DC bias field.
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- Journal of Materials Science, 2008, v. 43, n. 3, p. 847, doi. 10.1007/s10853-007-2216-3
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- Article
BaTiO<sub>3</sub> (BTO)–CaCu<sub>3</sub>Ti<sub>4</sub>O<sub>12</sub> (CCTO) substrates for microwave devices and antennas.
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- Journal of Materials Science, 2006, v. 41, n. 14, p. 4623, doi. 10.1007/s10853-006-0052-5
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- Article
Defect structure in GaN pyramids.
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- Journal of Materials Science, 2006, v. 41, n. 3, p. 779, doi. 10.1007/s10853-006-6563-2
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- Article
Strength and sharp contact fracture of silicon.
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- Journal of Materials Science, 2006, v. 41, n. 3, p. 841, doi. 10.1007/s10853-006-6567-y
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- Article
Recent advances on understanding the origin of superhardness in nanocomposite coatings: A critical review.
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- Journal of Materials Science, 2006, v. 41, n. 3, p. 937, doi. 10.1007/s10853-006-6577-9
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- Article
Application of N<sub>2</sub>/Ar inductively coupled plasma → the photoresist ashing for low- k dielectrics.
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- Journal of Materials Science, 2005, v. 40, n. 13, p. 3543, doi. 10.1007/s10853-005-2877-8
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- Article
Fabrication of spintronic material Cd<sub>1-x</sub> Mn<sub>x</sub> Te using stack deposition.
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- Journal of Materials Science, 2005, v. 40, n. 6, p. 1333, doi. 10.1007/s10853-005-0561-7
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- Article
Synthesis and characterization of ion-crafted nano/micro field ion emitters.
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- 2005
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- Publication type:
- Letter
Synthesis of transparent thick film of mesoporous TiO<sub>2</sub> by solvent evaporation method.
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- Journal of Materials Science, 2004, v. 39, n. 11, p. 3767, doi. 10.1023/B:JMSC.0000030733.00455.ac
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- Article
Transmission electron microscopy investigation of the interface formation between silicon and anodic alumina.
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- Journal of Materials Science, 2004, v. 39, n. 9, p. 3199
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- Article
Nanogaps in 2D Ag-nanocap arrays for surface-enhanced Raman scattering.
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- Journal of Raman Spectroscopy, 2013, v. 44, n. 12, p. 1666, doi. 10.1002/jrs.4390
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- Article
Determining Stress in Metallic Conducting Layers of Microelectronics Devices Using High Resolution Electron Backscatter Diffraction and Finite Element Analysis.
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- Microscopy & Microanalysis, 2023, v. 29, n. 2, p. 490, doi. 10.1093/micmic/ozad013
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- Article
SCALING WITHOUT SCALING: A PARADIGM SHIFT IN THE SEMICONDUCTOR INDUSTRY.
- Published in:
- Europhysics News, 2018, v. 49, n. 5/6, p. 22, doi. 10.1051/epn/2018504
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- Publication type:
- Article