Works matching DE "CIRCUIT board manufacturing"
Results: 122
The 8th Wonder of the World: Inside Foxconn's empty buildings, empty factories, and empty promises in Wisconsin.
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- Asia-Pacific Journal: Japan Focus, 2020, v. 18, n. 21, p. N.PAG
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Electroless copper deposition on aluminum-seeded ABS plastics.
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- Journal of Materials Science, 2008, v. 43, n. 22, p. 7121, doi. 10.1007/s10853-008-3031-1
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Improved Mixed-Integer Linear Programming Model for Short-Term Scheduling of the Pressing Process in Multi-Layer Printed Circuit Board Manufacturing.
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- Mathematics (2227-7390), 2021, v. 9, n. 21, p. 2653, doi. 10.3390/math9212653
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Design of Printed Circuit Board Production using Water Jet Technology.
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- TEM Journal, 2019, v. 8, n. 4, p. 1313, doi. 10.18421/TEM84-30
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Managing Circuit Materials at mmWave Frequencies.
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- Microwave Journal, 2015, v. 58, n. 7, p. 98
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Substrate Integrated Waveguide Dual-Mode, Dual-Band Filter.
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- Microwave Journal, 2014, v. 57, n. 3, p. 94
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ROGERS CORPORATION: Advanced Circuit Materials.
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- Microwave Journal, 2008, v. 51, n. 7, p. 202
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- Article
Energy saving possibilities for glass fabric finishing for printed circuit boards and construction reinforcements.
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- Technical Textiles / Technische Textilen, 2013, v. 56, n. 2, p. E66
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2. CIRCUITS AND DEVICES.
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- Textile Progress, 2005, v. 36, n. 2/3, p. 2
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Recovery and utilisation of non-metallic fraction from waste printed circuit boards in polypropylene composites.
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- Plastics, Rubber & Composites, 2015, v. 44, n. 8, p. 314, doi. 10.1179/1743289815Y.0000000021
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Nanotechnology: Etch a circuit sketch.
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- Nature, 2009, v. 457, n. 7233, p. 1061, doi. 10.1038/4571061a
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- Article
某电路板企业生产废水处理与回用工程 实例及分析.
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- Industrial Water Treatment, 2024, v. 44, n. 8, p. 205, doi. 10.19965/j.cnki.iwt.2023-1210
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Inspection for Circuit Board Assembly.
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- Management Science, 1997, v. 43, n. 9, p. 1198, doi. 10.1287/mnsc.43.9.1198
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Novel method for plasma etching of printed circuit boards as alternative for fluorocarbon gases.
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- International Journal of Plasma Environmental Science & Technology (IJPEST), 2023, v. 17, n. 2, p. 1, doi. 10.34343/ijpest.2023.17.e02002
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Passively aligned multichannel fiber-pigtailing of planar integrated optical waveguides.
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- Optical Engineering, 2017, v. 56, n. 2, p. 1, doi. 10.1117/1.OE.56.2.026115
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Development of Thermally Conductive Polyurethane Composite by Low Filler Loading of Spherical BN/PMMA Composite Powder.
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- Scientific Reports, 2019, v. 9, n. 1, p. N.PAG, doi. 10.1038/s41598-019-50985-5
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A Nonparametric Scheme for Monitoring a Process Output with a Block Effect.
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- International Journal of Quality, Statistics & Reliability, 2012, p. 1, doi. 10.1155/2012/287582
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A low-cost design experience for junior-level electronics circuits laboratories through emulation of industry-printed circuit board design practice.
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- International Journal of Electrical Engineering Education, 2017, v. 54, n. 3, p. 208, doi. 10.1177/0020720916673650
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COPPER RECOVERY FROM WASTE PRINTED CIRCUIT BOARDS AND THE CORRELATION OF Cu, Pb, Zn BY IONIC LIQUID.
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- Environment Protection Engineering, 2017, v. 43, n. 4, p. 55, doi. 10.5277/epe170405
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FABS and LABS.
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- Microwave Journal, 2017, v. 60, n. 5, p. 234
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- Article
An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics.
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- Journal of Electronic Materials, 2009, v. 38, n. 6, p. 815, doi. 10.1007/s11664-009-0761-z
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Design of miniaturised band-notch ultra-wideband monopole-slot antenna by modified half-mode substrate-integrated waveguide.
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- IET Microwaves, Antennas & Propagation (Wiley-Blackwell), 2013, v. 7, n. 1, p. 26, doi. 10.1049/iet-map.2012.0325
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A Novel Double-layer Low-profile Multiband Frequency Selective Surface for 4G Mobile Communication System.
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- Applied Computational Electromagnetics Society Journal, 2022, v. 37, n. 4, p. 420, doi. 10.13052/2022.ACES.J.370407
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INTELLECTUAL SYSTEM FOR PRINTED CIRCUIT BOARD MANUFACTURE BASED ON MIRAE MX-200.
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- Electronics & Control Systems, 2021, v. 68, n. 2, p. 38, doi. 10.18372/1990-5548.68.16090
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Optimal replenishment policy for manufacturing systems with failure in rework, backlogging and random breakdown.
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- Mathematical & Computer Modelling of Dynamical Systems, 2009, v. 15, n. 3, p. 255, doi. 10.1080/13873950902808602
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Reduction of the Fused Filament Fabrication Process Time in the Manufacturing of Printed Circuit Board Slots.
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- International Journal of Combinatorial Optimization Problems & Informatics, 2020, v. 11, n. 1, p. 59
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MODELING OF GRINDING PROCESS BY PRINTED CIRCUIT BOARDS RECYCLING.
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- Annals of DAAAM & Proceedings, 2010, p. 475
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Margin analysis emerges as imperative validation technique.
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- EE: Evaluation Engineering, 2014, v. 53, n. 8, p. 28
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Approaching Board Test Nonintrusively.
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- EE: Evaluation Engineering, 2009, v. 48, n. 12, p. 23
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AOI-AXI Duo Improves Product Yield.
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- EE: Evaluation Engineering, 2009, v. 48, n. 3, p. 60
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Making Test Lean Again.
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- EE: Evaluation Engineering, 2009, v. 48, n. 3, p. 32
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Implementing Change On the Test Floor.
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- EE: Evaluation Engineering, 2007, v. 46, n. 5, p. 16
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A HIGH-SPEED MICRO-IMPACT TESTING SYSTEM FOR EVALUATING THE PROPERTIES OF LEAD-FREE SOLDER JOINTS.
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- Experimental Techniques, 2010, v. 34, n. 3, p. 68, doi. 10.1111/j.1747-1567.2009.00480.x
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Thermal degradation kinetics of waste printed circuit boards.
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- Chemical Engineering Research & Design: Transactions of the Institution of Chemical Engineers Part A, 2018, v. 130, p. 87, doi. 10.1016/j.cherd.2017.12.005
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DEVELOPMENT OF A MICROCONTROLLER DEVICE FOR REPRODUCING AUDIO INFORMATION.
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- Eurasian Physical Technical Journal, 2023, v. 20, n. 3, p. 70, doi. 10.31489/2023No3/70-79
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A metalized-hole PCB as a strain gauge.
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- Instruments & Experimental Techniques, 2016, v. 59, n. 6, p. 879, doi. 10.1134/S0020441216060051
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Wideband Branch Line Coupler with Open Circuit Coupled Lines.
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- International Journal of Electrical & Computer Engineering (2088-8708), 2017, v. 7, n. 2, p. 888, doi. 10.11591/ijece.v7i2.pp888-893
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CONSIDERATIONS ABOUT COOPER ETCHING BY PHOTOCHEMICAL MACHINING.
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- Nonconventional Technologies Review / Revista de Tehnologii Neconventionale, 2022, v. 26, n. 1, p. 3
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A TABU SEARCH FOR TIME MINIMIZATION IN PRINTED CIRCUIT BOARD ASSEMBLY.
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- Academic Journal of Manufacturing Engineering, 2021, v. 19, n. 2, p. 5
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THE OPTIMIZATED STUDY ON PREPARATION PROCESS OF NANO TIRE PRESSURE SENSOR USED IN AUTO.
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- Academic Journal of Manufacturing Engineering, 2017, v. 15, n. 1, p. 97
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Reflection Phase Shift for PWB and PCBA Production Testing.
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- Journal of Microelectronic & Electronic Packaging, 2012, v. 9, n. 1, p. 1, doi. 10.4071/imaps.315
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Wetting metamorphosis of hydrophobic fluoropolymer coatings submerged in water and ultrasonically vibrated.
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- Journal of Coatings Technology & Research, 2020, v. 17, n. 3, p. 633, doi. 10.1007/s11998-019-00250-1
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- Article
Fabrication of Fluxgate Sensor Heads by Milling with a Circuit Board Plotter and Influence of Core Annealing Conditions on Sensor Performance.
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- Journal of Superconductivity & Novel Magnetism, 2017, v. 30, n. 11, p. 3257, doi. 10.1007/s10948-016-3681-1
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- Article
Reliability behavior of lead-free solder joints in electronic components.
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- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 1, p. 172, doi. 10.1007/s10854-012-0720-y
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Fully integrated wideband phased array with large scan range and 5:1 bandwidth.
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- IET Microwaves, Antennas & Propagation (Wiley-Blackwell), 2021, v. 15, n. 14, p. 1799, doi. 10.1049/mia2.12196
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Telemetric angle and position sensing using millimeter-wave metamaterial and a frequency-modulated continuous-wave (FMCW) chip.
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- Journal of Sensors & Sensor Systems, 2024, v. 13, n. 1, p. 31, doi. 10.5194/jsss-13-31-2024
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Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms.
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- Materials (1996-1944), 2019, v. 12, n. 3, p. 550, doi. 10.3390/ma12030550
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- Article
ACCURATE AND EFFICIENT ANALYSIS OF PLANAR ELECTROMAGNETIC BAND-GAP STRUCTURES FOR POWER BUS NOISE MITIGATION IN THE GHZ BAND.
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- Progress in Electromagnetics Research B, 2012, v. 37, p. 59, doi. 10.2528/pierb11100402
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Hardware-in-the-Loop Simulation System Based on Unity3D for Winding Machine.
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- Journal of Donghua University (English Edition), 2024, v. 41, n. 3, p. 298, doi. 10.19884/j.1672-5220.202311003
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Modeling of Micropores Drilling Force for Printed Circuit Board Micro-holes Based on Energy Method.
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- Journal of Donghua University (English Edition), 2023, v. 40, n. 5, p. 525, doi. 10.19884/j.1672-5220.202209003
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