Works matching Electronic equipment design
1
- International Journal of Heat & Technology, 2021, v. 39, n. 2, p. 451, doi. 10.18280/ijht.390214
- Article
2
- Telecommunication Engineering, 2023, v. 63, n. 9, p. 1439, doi. 10.20079/j.issn.1001-893x.220323007
- 王 涛;
- 李泽西;
- 陈学军;
- 王 戈;
- 刘军锋;
- 邓德鑫;
- 孟海涛
- Article
3
- Ordnance Industry Automation, 2020, v. 39, n. 11, p. 61, doi. 10.7690/bgzdh.2020.11.015
- Article
4
- Applied Sciences (2076-3417), 2021, v. 11, n. 15, p. 7054, doi. 10.3390/app11157054
- Liang, Jian-Yi;
- Lee, Yung-Lung;
- Mao, Shih-Wei;
- Tsai, Ming-Da
- Article
5
- Energies (19961073), 2023, v. 16, n. 3, p. 1075, doi. 10.3390/en16031075
- Qiao, Gege;
- Cao, Wenping;
- Hu, Yawei;
- Li, Jiucheng;
- Sun, Lu;
- Hu, Cungang
- Article
6
- Electronics (2079-9292), 2018, v. 7, n. 5, p. 75, doi. 10.3390/electronics7050075
- Conti, Massimo;
- Caldari, Marco;
- Gianfelici, Matteo;
- Ricci, Adriana;
- Ripa, Franco
- Article
7
- Journal of Sensors, 2022, p. 1, doi. 10.1155/2022/8134928
- Zhang, Hao;
- Gupta, Rajeev Kumar;
- Tiwari, Basant
- Article
8
- Electronics (2079-9292), 2025, v. 14, n. 2, p. 314, doi. 10.3390/electronics14020314
- Wang, Sheng;
- Song, Changxu;
- Zhang, Li;
- Hu, Fengjiao;
- Dong, Feng;
- Liang, Dapeng;
- Liu, Jiangtao;
- Zhang, Jingyu;
- Chen, Sihong
- Article
9
- Applied Computational Electromagnetics Society Journal, 2023, v. 38, n. 1, p. 28, doi. 10.13052/2023.ACES.J.380105
- Tianhong Tan;
- Tao Jiang;
- Haolin Jiang;
- Tianhao Wang;
- Mingjuan Cai
- Article
10
- Quality & Reliability Engineering International, 1990, v. 6, n. 4, p. 243, doi. 10.1002/qre.4680060406
- Leonard, Charles T.;
- Pecht, Michael
- Article
11
- Macromolecular Symposia, 2016, v. 360, n. 1, p. 49, doi. 10.1002/masy.201500095
- Rosas‐Aburto, Alberto;
- Roquero‐Tejeda, Pedro;
- Vivaldo‐Lima, Eduardo;
- Pérez‐Salinas, Patricia;
- Phifer, Daniel W.;
- Vázquez, R. Javier Revilla
- Article
12
- Angewandte Chemie, 2013, v. 125, n. 30, p. 7872, doi. 10.1002/ange.201301941
- Lee, Hye Moon;
- Choi, Si ‐ Young;
- Jung, Areum;
- Ko, Seung Hwan
- Article
13
- Advanced Functional Materials, 2016, v. 26, n. 13, p. 2046, doi. 10.1002/adfm.201504202
- Venkata Subbaiah, Y. P.;
- Saji, K. J.;
- Tiwari, A.
- Article
14
- Advanced Functional Materials, 2016, p. 165, doi. 10.1002/adfm.201503405
- Zedong Li;
- Hao Liu;
- Cheng Ouyang;
- Wei Hong Wee;
- Xingye Cui;
- Tian Jian Lu;
- Pingguan-Murphy, Belinda;
- Fei Li;
- Feng Xu
- Article
15
- Leonardo, 2009, v. 42, n. 4, p. 307, doi. 10.1162/leon.2009.42.4.307
- Article
16
- Strain, 2011, v. 47, p. e148, doi. 10.1111/j.1475-1305.2008.00597.x
- Article
17
- Journal of Product Innovation Management, 2009, v. 26, n. 2, p. 222, doi. 10.1111/j.1540-5885.2009.00347.x
- Griffin, Abbie;
- Price, Raymond L.;
- Maloney, Matthew M.;
- Vojak, Bruce A.;
- Sim, Edward W.
- Article
18
- Integrated Ferroelectrics, 2014, v. 153, n. 1, p. 42, doi. 10.1080/10584587.2014.902670
- Sun, Jingwei;
- Lv, Xiaojing;
- Ouyang, Mi;
- Wu, Qichao;
- Zhang, Cheng
- Article
19
- Journal of Environmental Planning & Management, 2018, v. 61, n. 12, p. 2186, doi. 10.1080/09640568.2017.1389700
- Chuang, Hui-Kai;
- Liao, Chi-Shun
- Article
20
- Interactive Learning Environments, 2015, v. 23, n. 3, p. 356, doi. 10.1080/10494820.2013.765895
- Hsieh, Yi-Zeng;
- Su, Mu-Chun;
- Chen, Sherry Y.;
- Chen, Gow-Dong
- Article
21
- Challenges (20781547), 2013, v. 4, n. 1, p. 19, doi. 10.3390/challe4010019
- Lobos, Alex;
- Babbitt, Callie W.
- Article
22
- International Journal on Electrical Engineering & Informatics, 2014, v. 6, n. 4, p. 644
- Parvathy, A. K.;
- Devanathan, Rajagopalan;
- Kamaraj, V.
- Article
23
- Progress in Electromagnetics Research, 2013, v. 141, p. 291, doi. 10.2528/pier13052808
- Lei Qiu;
- Sheng Shui Wang;
- Hui Ying Qi;
- Fei Zhao;
- Shun Lian Chai;
- Jun Jie Mao
- Article
24
- International Journal of High Speed Electronics & Systems, 2006, v. 16, n. 3, p. 855, doi. 10.1142/S0129156406004041
- Chow, T. Paul;
- Agarwal, Anant K.
- Article
25
- International Journal of Human-Computer Interaction, 2011, v. 27, n. 3, p. 280, doi. 10.1080/10447318.2011.540472
- MacDorman, KarlF.;
- Whalen, TimothyJ.;
- Ho, Chin-Chang;
- Patel, Himalaya
- Article
26
- International Journal of Human-Computer Interaction, 2009, v. 25, n. 2, p. 155, doi. 10.1080/10447310802629801
- Bauerly, Michael;
- Liu, Yili
- Article
27
- International Journal of Human-Computer Interaction, 2008, v. 24, n. 3, p. 275, doi. 10.1080/10447310801920508
- Bauerly, Michael;
- Liu, Yili
- Article
28
- International Journal of Human-Computer Interaction, 2006, v. 21, n. 1, p. 15, doi. 10.1207/s15327590ijhc2101_2
- Liu, Yan;
- Salvendy, Gavriel
- Article
29
- Thermal Science, 2016, v. 20, n. 6, p. 2027, doi. 10.2298/TSCI150710006R
- RAMACHANDRAN, Raghavan Nair;
- GANESAN, Kalliappan;
- ASIRVATHAM, Lazarus Godson
- Article
30
- Pertanika Journal of Science & Technology, 2010, v. 18, n. 2, p. 271
- Kamaruddin, Shahrul;
- Beng, S. C.;
- Khan, Zahid A.
- Article
31
- Welding International, 2015, v. 29, n. 2, p. 161, doi. 10.1080/09507116.2014.897812
- Molchanova, Ye.S.;
- Bychkov, N.A.;
- Chernyayev, S.I.
- Article
32
- Environmental Research, Engineering & Management / Aplinkos Tyrimai, Inžinerija ir Vadyba, 2006, v. 37, n. 3, p. 43
- Gurauskienė, Inga;
- Varžinskas, Visvaldas
- Article
34
- Debates IESA, 2012, v. 17, n. 3, p. 88
- Article
35
- 2015
- Safaei Mehrabani, Yavar;
- Eshghi, Mohammad
- Erratum
36
- Circuits, Systems & Signal Processing, 2013, v. 32, n. 2, p. 541, doi. 10.1007/s00034-012-9496-9
- Martins, Miguel;
- Hartingsveldt, Koen;
- Fernandes, Jorge;
- Silva, Manuel;
- Verhoeven, Chris
- Article
37
- William & Mary Law Review, 2015, v. 56, n. 5, p. 1987
- Article
38
- ASHRAE Journal, 2017, v. 59, n. 12, p. 8
- Article
39
- ASHRAE Journal, 2015, v. 57, n. 8, p. 6
- Article
40
- Philosophical Magazine, 2009, v. 89, n. 13, p. 1111, doi. 10.1080/14786430902893163
- Karazhanov, S. Zh.;
- Sheripov, U.;
- Ulyashin, A. G.
- Article
41
- Electronic Components & Materials, 2018, v. 37, n. 6, p. 68, doi. 10.14106/j.cnki.1001-2028.2018.06.014
- Article
42
- Informacije MIDEM: Journal of Microelectronics, Electronic Components & Materials, 2023, v. 53, n. 2, p. 87, doi. 10.33180/InfMIDEM2023.204
- Khanfir, Leila;
- Mouine, Jaouhar
- Article
43
- Journal of Consumer Policy, 1994, v. 17, n. 2, p. 181, doi. 10.1007/BF01016362
- King, Maryon F.;
- Hill, Donna J.
- Article
44
- GSTF Journal on Computing, 2014, v. 3, n. 4, p. 48, doi. 10.7603/s40601-013-0040-y
- Kissinger, Jonathon;
- Morelli, Tony
- Article
45
- Computer Journal, 2008, v. 51, n. 6, p. 700, doi. 10.1093/comjnl/bxm116
- Article
46
- Computer Journal, 2008, v. 51, n. 5, p. 561, doi. 10.1093/comjnl/bxm119
- Article
48
- IETE Journal of Research, 2017, v. 63, n. 4, p. 514, doi. 10.1080/03772063.2017.1301227
- Tey, Y.Y.;
- Ramiah, H.;
- Noh, Norlaili Mohd.
- Article
49
- Russian Engineering Research, 2008, v. 28, n. 9, p. 870, doi. 10.3103/S1068798X08090098
- Vasin, V.;
- Ivashov, E.;
- Stepanchikov, S.
- Article
50
- Robotica, 2023, v. 41, n. 11, p. 3275, doi. 10.1017/S0263574723000917
- He, Shuai;
- Duan, Xuechao;
- Qu, Xianpu;
- Xiao, Jiaxuan
- Article
